JPS573212A - Forming method for multilayer film for electronic circuit - Google Patents
Forming method for multilayer film for electronic circuitInfo
- Publication number
- JPS573212A JPS573212A JP7563280A JP7563280A JPS573212A JP S573212 A JPS573212 A JP S573212A JP 7563280 A JP7563280 A JP 7563280A JP 7563280 A JP7563280 A JP 7563280A JP S573212 A JPS573212 A JP S573212A
- Authority
- JP
- Japan
- Prior art keywords
- film
- multilayered film
- vapor
- multilayered
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
Landscapes
- Magnetic Heads (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
Abstract
PURPOSE:To obtain a high-precision multilayered film free from a shift in position by forming a mask with a smaller window than the opening of an intermediate layer on a substrate through the intermediate layer, and then by forming the multilayered film by alternating vapor deposition and ion plating. CONSTITUTION:For the formation of a multilayered film consisting of alternately stacked conductor films 13 and insulating films 14, for example, polyimide resin 11 is applied over a substrate 1 to about 5mum and after it is cured, and about 0.3mum thickness film of Mo12 is vapor-deposited. The Mo film 12 is photoetched to form an accurate pattern. In an atmosphere of O2, sputtering is carried out to cut into the resin film 11. Under high vacuum, a conductor 13 is vapor-deposited from above and on it, and insulating film 14 is stacked by ion plating. This operation is repeated to obtain a multilayered film. Thus, the high-precision multilayered film free from a shift in position is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7563280A JPS573212A (en) | 1980-06-06 | 1980-06-06 | Forming method for multilayer film for electronic circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7563280A JPS573212A (en) | 1980-06-06 | 1980-06-06 | Forming method for multilayer film for electronic circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS573212A true JPS573212A (en) | 1982-01-08 |
Family
ID=13581813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7563280A Pending JPS573212A (en) | 1980-06-06 | 1980-06-06 | Forming method for multilayer film for electronic circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS573212A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014044785A (en) * | 2012-08-28 | 2014-03-13 | Dainippon Printing Co Ltd | Suspension substrate, suspension, suspension with head, and hard disk drive |
-
1980
- 1980-06-06 JP JP7563280A patent/JPS573212A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014044785A (en) * | 2012-08-28 | 2014-03-13 | Dainippon Printing Co Ltd | Suspension substrate, suspension, suspension with head, and hard disk drive |
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