JPS5731168A - Semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the cost of a picture display device, by a method wherein many picture units, each one of which consists of a plurality of picture elements, are gathered and bonded on a reinforcing board and the utilization factor of a semiconductor wafer is improved. CONSTITUTION:An aperture is made in a drain-video wire 20 in a picture element 26, an electrode 22 is added and a poly-Si gate-gate wire 23 are provided. A plurality of the picture elements 26 are gathered and a unit 27 is composed. On the back of the unit a metal layer 32 is placed and bonded to a reinforcing board 34, holding a resin layer 33 in between, by being compressed against a supporting base 28 under pressurized heating process. After being removed from the base 28, the units are covered with an insulating film 36, a video wire is produced by providing a drain electrode 38 and a metal wiring 39, a gate wiring 41 is provided in such a manner that it is connected to the gate electrode 23 through an interlayer insulating film 39 and a metal reflection electrode 44 is provided in such a manner that it is connected to the metal electrode 24 through an interlayer insulating film 42. Finally, as usual, a liquid crystal cell is completed by filling liquid crystal 13 between the reflection electrode 44 and a glass plate 15 on which a transparent electrode 14 is prepared. Thus by introducing the unit into high cost wafer processing, the cost of the chip, and therefore the cost of the device, is reduced.