JPS5728689A - Method for diffusion joining - Google Patents
Method for diffusion joiningInfo
- Publication number
- JPS5728689A JPS5728689A JP10113480A JP10113480A JPS5728689A JP S5728689 A JPS5728689 A JP S5728689A JP 10113480 A JP10113480 A JP 10113480A JP 10113480 A JP10113480 A JP 10113480A JP S5728689 A JPS5728689 A JP S5728689A
- Authority
- JP
- Japan
- Prior art keywords
- joining
- temperature
- pressure
- heated
- diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
PURPOSE: To improve mechanical properties of joined sections, by supporting both joining surfaces with a pressure for a prescribed time under a joining temperature after they are heated and cleaned, before both joining surfaces are pressure joined.
CONSTITUTION: After the air in a vacuum chamber 10 is removed to form a vacuum condition, joining members 1 and 2 are heated to a temperature higher than the diffusion joining temperature by a heater 9, and the temperature is maintained constantly. Since the joining surface of both joining members 1 and 2 are isolated from each other and exposed in a vacuum condition while the temperature is maintained, contaminations and oxide films on the joining surfaces are eliminated and, at the same time, any absorbing gas contained in the parent metal near the joining surface is also discharged from the surface. Then, the temperature in the furnace is lowered to the diffusion joining temperature and the joining surfaces of joining members 1 and 2 are closely contacted through the lower pressure ram, and then, a pressure of a prescribed strength is applied to them. They are heated while the pressure is being applied. Then, the joining members 1 and 2 are cooled to the room temperature and thus the diffusion joining treatment is completed.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10113480A JPS5728689A (en) | 1980-07-25 | 1980-07-25 | Method for diffusion joining |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10113480A JPS5728689A (en) | 1980-07-25 | 1980-07-25 | Method for diffusion joining |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5728689A true JPS5728689A (en) | 1982-02-16 |
Family
ID=14292600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10113480A Pending JPS5728689A (en) | 1980-07-25 | 1980-07-25 | Method for diffusion joining |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5728689A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0489183A (en) * | 1990-08-01 | 1992-03-23 | Natl Res Inst For Metals | Diffusion joining method |
US6264095B1 (en) | 1999-07-14 | 2001-07-24 | Swales Aerospace | High temperature isostatic pressure bonding of beryllium pressure vessels with an interior void |
US7163121B1 (en) | 1999-07-14 | 2007-01-16 | Swales & Associates, Inc. | High temperature isostatic pressure bonding of hollow beryllium pressure vessels using a bonding flange |
JP2012016743A (en) * | 2010-07-09 | 2012-01-26 | Toyota Motor Corp | Solid phase diffusion-joining method for die-casting die material |
WO2019054368A1 (en) * | 2017-09-15 | 2019-03-21 | 国立研究開発法人産業技術総合研究所 | Method for joining substrates, and sealing structure |
-
1980
- 1980-07-25 JP JP10113480A patent/JPS5728689A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0489183A (en) * | 1990-08-01 | 1992-03-23 | Natl Res Inst For Metals | Diffusion joining method |
US6264095B1 (en) | 1999-07-14 | 2001-07-24 | Swales Aerospace | High temperature isostatic pressure bonding of beryllium pressure vessels with an interior void |
US7163121B1 (en) | 1999-07-14 | 2007-01-16 | Swales & Associates, Inc. | High temperature isostatic pressure bonding of hollow beryllium pressure vessels using a bonding flange |
JP2012016743A (en) * | 2010-07-09 | 2012-01-26 | Toyota Motor Corp | Solid phase diffusion-joining method for die-casting die material |
WO2019054368A1 (en) * | 2017-09-15 | 2019-03-21 | 国立研究開発法人産業技術総合研究所 | Method for joining substrates, and sealing structure |
JPWO2019054368A1 (en) * | 2017-09-15 | 2020-12-17 | 国立研究開発法人産業技術総合研究所 | Substrate joining method and sealing structure |
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