JPS5725329A - Radiation sensitive precursor of high heat- resistant polymer - Google Patents

Radiation sensitive precursor of high heat- resistant polymer

Info

Publication number
JPS5725329A
JPS5725329A JP8878281A JP8878281A JPS5725329A JP S5725329 A JPS5725329 A JP S5725329A JP 8878281 A JP8878281 A JP 8878281A JP 8878281 A JP8878281 A JP 8878281A JP S5725329 A JPS5725329 A JP S5725329A
Authority
JP
Japan
Prior art keywords
diones
hydroxyl group
radiation
reactive precursor
precursor stages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8878281A
Other languages
English (en)
Other versions
JPH0237934B2 (ja
Inventor
Aane Herumuuto
Kiyuun Ebaaharuto
Ruubunaa Rooranto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5725329A publication Critical patent/JPS5725329A/ja
Publication of JPH0237934B2 publication Critical patent/JPH0237934B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0633Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/0644Poly(1,3,5)triazines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0666Polycondensates containing five-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0672Polycondensates containing five-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only one nitrogen atom in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0683Polycondensates containing six-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0694Polycondensates containing six-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring, e.g. polyquinoxalines
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
JP8878281A 1980-06-10 1981-06-09 Radiation sensitive precursor of high heat- resistant polymer Granted JPS5725329A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803021748 DE3021748A1 (de) 1980-06-10 1980-06-10 Strahlungsreaktive vorstufen hochwaermebestaendiger polymerer

Publications (2)

Publication Number Publication Date
JPS5725329A true JPS5725329A (en) 1982-02-10
JPH0237934B2 JPH0237934B2 (ja) 1990-08-28

Family

ID=6104269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8878281A Granted JPS5725329A (en) 1980-06-10 1981-06-09 Radiation sensitive precursor of high heat- resistant polymer

Country Status (5)

Country Link
US (1) US4371685A (ja)
EP (1) EP0041677B1 (ja)
JP (1) JPS5725329A (ja)
AT (1) ATE10980T1 (ja)
DE (2) DE3021748A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5968332A (ja) * 1982-10-13 1984-04-18 Nitto Electric Ind Co Ltd 感光性樹脂組成物
JPS6088939A (ja) * 1983-10-21 1985-05-18 Shin Etsu Chem Co Ltd 感光性組成物
JP2006193691A (ja) * 2005-01-17 2006-07-27 Nippon Kayaku Co Ltd 感光性ポリアミド酸及びこれを含有する感光性組成物
WO2021246478A1 (ja) * 2020-06-05 2021-12-09 富士フイルム株式会社 樹脂組成物及びその製造方法並びにパターン形成用組成物の製造方法

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4579809A (en) * 1982-10-22 1986-04-01 Ciba-Geigy Corporation Positive image formation
DE3411714A1 (de) * 1984-03-29 1985-10-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von polyimidazol- und polyimidazopyrrolon-reliefstrukturen
US4551522A (en) * 1985-04-26 1985-11-05 E. I. Du Pont De Nemours And Company Process for making photopolymerizable aromatic polyamic acid derivatives
DE3833438A1 (de) * 1988-10-01 1990-04-05 Basf Ag Strahlungsempfindliche gemische und deren verwendung
DE3833437A1 (de) * 1988-10-01 1990-04-05 Basf Ag Strahlungsempfindliche gemische und deren verwendung
EP0391200B1 (de) * 1989-04-06 1995-10-11 Siemens Aktiengesellschaft Herstellung hochwärmebeständiger Reliefstrukturen
DE3927632A1 (de) * 1989-08-22 1991-02-28 Basf Ag Umsetzungsprodukt, verfahren zu dessen herstellung und damit erhaltenes strahlungsempfindliches material
EP0450189B1 (de) * 1990-03-29 1996-10-30 Siemens Aktiengesellschaft Hochwärmebeständige Negativresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen
DE59208963D1 (de) * 1991-05-07 1997-11-20 Siemens Ag Hochwärmebeständige Positivresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen
US5856065A (en) * 1996-03-27 1999-01-05 Olin Microelectronic Chemicals, Inc. Negative working photoresist composition based on polyimide primers
US6177225B1 (en) 1998-10-01 2001-01-23 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
US6143467A (en) * 1998-10-01 2000-11-07 Arch Specialty Chemicals, Inc. Photosensitive polybenzoxazole precursor compositions
JP4529252B2 (ja) * 1999-09-28 2010-08-25 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造法及び電子部品
JP3479769B2 (ja) 2000-01-26 2003-12-15 日本航空電子工業株式会社 コネクタの挿抜機構
EP1441997A1 (en) 2001-11-08 2004-08-04 DSM IP Assets B.V. Flame-retardant optical fiber coating composition
KR20060023520A (ko) * 2003-03-11 2006-03-14 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 신규한 감광성 수지 조성물들
US6939659B2 (en) 2003-03-11 2005-09-06 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
EP1606326A2 (en) * 2003-03-11 2005-12-21 FujiFilm Electronic Materials USA, Inc. Novel photosensitive resin compositions
US7132205B2 (en) 2003-06-05 2006-11-07 Arch Specialty Chemicals, Inc. Positive photosensitive resin compositions
JP4244309B2 (ja) * 2003-09-12 2009-03-25 富士フイルム株式会社 平版印刷版原版
TWI363249B (en) * 2003-10-15 2012-05-01 Fujifilm Electronic Materials Novel photosensitive resin compositions
CN1867523A (zh) 2003-10-17 2006-11-22 帝斯曼知识产权资产管理有限公司 阻燃的经uv固化并缓冲的光纤和缓冲组合物
WO2006132962A2 (en) 2005-06-03 2006-12-14 Fujifilm Electronic Materials U.S.A. Inc. Novel photosensitive resin compositions
US7803510B2 (en) * 2005-08-17 2010-09-28 Fujifilm Electronic Materials U.S.A., Inc. Positive photosensitive polybenzoxazole precursor compositions
JP4530949B2 (ja) * 2005-08-29 2010-08-25 富士フイルム株式会社 感光性樹脂組成物及びそれを用いた半導体装置の製造方法
JP2007240975A (ja) * 2006-03-09 2007-09-20 Fujifilm Corp 感光性樹脂組成物及びそれを用いた半導体装置の製造方法
EP2204281A4 (en) 2007-10-25 2013-08-14 Techno Polymer Co Ltd LAMINATE REFLECTING THE INFRARED
US9519216B2 (en) * 2008-02-04 2016-12-13 Fujifilm Electronic Materials U.S.A., Inc. Positive photosensitive resin compositions
US11905356B2 (en) 2021-03-16 2024-02-20 Nippon Kayaku Kabushiki Kaisha Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL177718C (nl) * 1973-02-22 1985-11-01 Siemens Ag Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren.
US3964908A (en) * 1975-09-22 1976-06-22 International Business Machines Corporation Positive resists containing dimethylglutarimide units
JPS52153672A (en) * 1976-06-16 1977-12-20 Matsushita Electric Ind Co Ltd Electron beam resist and its usage

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5968332A (ja) * 1982-10-13 1984-04-18 Nitto Electric Ind Co Ltd 感光性樹脂組成物
JPH0350786B2 (ja) * 1982-10-13 1991-08-02 Nitto Denko Corp
JPS6088939A (ja) * 1983-10-21 1985-05-18 Shin Etsu Chem Co Ltd 感光性組成物
JP2006193691A (ja) * 2005-01-17 2006-07-27 Nippon Kayaku Co Ltd 感光性ポリアミド酸及びこれを含有する感光性組成物
WO2021246478A1 (ja) * 2020-06-05 2021-12-09 富士フイルム株式会社 樹脂組成物及びその製造方法並びにパターン形成用組成物の製造方法
CN115768832A (zh) * 2020-06-05 2023-03-07 富士胶片株式会社 树脂组合物及其制造方法以及图案形成用组合物的制造方法

Also Published As

Publication number Publication date
ATE10980T1 (de) 1985-01-15
JPH0237934B2 (ja) 1990-08-28
DE3167919D1 (en) 1985-02-07
EP0041677B1 (de) 1984-12-27
DE3021748A1 (de) 1981-12-17
US4371685A (en) 1983-02-01
EP0041677A2 (de) 1981-12-16
EP0041677A3 (en) 1982-12-29

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