JPS5725329A - Radiation sensitive precursor of high heat- resistant polymer - Google Patents
Radiation sensitive precursor of high heat- resistant polymerInfo
- Publication number
- JPS5725329A JPS5725329A JP8878281A JP8878281A JPS5725329A JP S5725329 A JPS5725329 A JP S5725329A JP 8878281 A JP8878281 A JP 8878281A JP 8878281 A JP8878281 A JP 8878281A JP S5725329 A JPS5725329 A JP S5725329A
- Authority
- JP
- Japan
- Prior art keywords
- diones
- hydroxyl group
- radiation
- reactive precursor
- precursor stages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 title abstract 2
- 239000002243 precursor Substances 0.000 title 1
- 230000005855 radiation Effects 0.000 title 1
- 241000551547 Dione <red algae> Species 0.000 abstract 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 3
- 239000012713 reactive precursor Substances 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000004642 Polyimide Substances 0.000 abstract 1
- 125000003277 amino group Chemical group 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- -1 cyclic carboxylic-acid anhydrides Chemical class 0.000 abstract 1
- 125000000623 heterocyclic group Chemical group 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0633—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/0644—Poly(1,3,5)triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0666—Polycondensates containing five-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0672—Polycondensates containing five-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only one nitrogen atom in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0683—Polycondensates containing six-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0694—Polycondensates containing six-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring, e.g. polyquinoxalines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803021748 DE3021748A1 (de) | 1980-06-10 | 1980-06-10 | Strahlungsreaktive vorstufen hochwaermebestaendiger polymerer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5725329A true JPS5725329A (en) | 1982-02-10 |
JPH0237934B2 JPH0237934B2 (ja) | 1990-08-28 |
Family
ID=6104269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8878281A Granted JPS5725329A (en) | 1980-06-10 | 1981-06-09 | Radiation sensitive precursor of high heat- resistant polymer |
Country Status (5)
Country | Link |
---|---|
US (1) | US4371685A (ja) |
EP (1) | EP0041677B1 (ja) |
JP (1) | JPS5725329A (ja) |
AT (1) | ATE10980T1 (ja) |
DE (2) | DE3021748A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5968332A (ja) * | 1982-10-13 | 1984-04-18 | Nitto Electric Ind Co Ltd | 感光性樹脂組成物 |
JPS6088939A (ja) * | 1983-10-21 | 1985-05-18 | Shin Etsu Chem Co Ltd | 感光性組成物 |
JP2006193691A (ja) * | 2005-01-17 | 2006-07-27 | Nippon Kayaku Co Ltd | 感光性ポリアミド酸及びこれを含有する感光性組成物 |
WO2021246478A1 (ja) * | 2020-06-05 | 2021-12-09 | 富士フイルム株式会社 | 樹脂組成物及びその製造方法並びにパターン形成用組成物の製造方法 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4579809A (en) * | 1982-10-22 | 1986-04-01 | Ciba-Geigy Corporation | Positive image formation |
DE3411714A1 (de) * | 1984-03-29 | 1985-10-10 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von polyimidazol- und polyimidazopyrrolon-reliefstrukturen |
US4551522A (en) * | 1985-04-26 | 1985-11-05 | E. I. Du Pont De Nemours And Company | Process for making photopolymerizable aromatic polyamic acid derivatives |
DE3833438A1 (de) * | 1988-10-01 | 1990-04-05 | Basf Ag | Strahlungsempfindliche gemische und deren verwendung |
DE3833437A1 (de) * | 1988-10-01 | 1990-04-05 | Basf Ag | Strahlungsempfindliche gemische und deren verwendung |
EP0391200B1 (de) * | 1989-04-06 | 1995-10-11 | Siemens Aktiengesellschaft | Herstellung hochwärmebeständiger Reliefstrukturen |
DE3927632A1 (de) * | 1989-08-22 | 1991-02-28 | Basf Ag | Umsetzungsprodukt, verfahren zu dessen herstellung und damit erhaltenes strahlungsempfindliches material |
EP0450189B1 (de) * | 1990-03-29 | 1996-10-30 | Siemens Aktiengesellschaft | Hochwärmebeständige Negativresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen |
DE59208963D1 (de) * | 1991-05-07 | 1997-11-20 | Siemens Ag | Hochwärmebeständige Positivresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen |
US5856065A (en) * | 1996-03-27 | 1999-01-05 | Olin Microelectronic Chemicals, Inc. | Negative working photoresist composition based on polyimide primers |
US6177225B1 (en) | 1998-10-01 | 2001-01-23 | Arch Specialty Chemicals, Inc. | Photosensitive resin compositions |
US6143467A (en) * | 1998-10-01 | 2000-11-07 | Arch Specialty Chemicals, Inc. | Photosensitive polybenzoxazole precursor compositions |
JP4529252B2 (ja) * | 1999-09-28 | 2010-08-25 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造法及び電子部品 |
JP3479769B2 (ja) | 2000-01-26 | 2003-12-15 | 日本航空電子工業株式会社 | コネクタの挿抜機構 |
EP1441997A1 (en) | 2001-11-08 | 2004-08-04 | DSM IP Assets B.V. | Flame-retardant optical fiber coating composition |
KR20060023520A (ko) * | 2003-03-11 | 2006-03-14 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 신규한 감광성 수지 조성물들 |
US6939659B2 (en) | 2003-03-11 | 2005-09-06 | Arch Specialty Chemicals, Inc. | Photosensitive resin compositions |
EP1606326A2 (en) * | 2003-03-11 | 2005-12-21 | FujiFilm Electronic Materials USA, Inc. | Novel photosensitive resin compositions |
US7132205B2 (en) | 2003-06-05 | 2006-11-07 | Arch Specialty Chemicals, Inc. | Positive photosensitive resin compositions |
JP4244309B2 (ja) * | 2003-09-12 | 2009-03-25 | 富士フイルム株式会社 | 平版印刷版原版 |
TWI363249B (en) * | 2003-10-15 | 2012-05-01 | Fujifilm Electronic Materials | Novel photosensitive resin compositions |
CN1867523A (zh) | 2003-10-17 | 2006-11-22 | 帝斯曼知识产权资产管理有限公司 | 阻燃的经uv固化并缓冲的光纤和缓冲组合物 |
WO2006132962A2 (en) | 2005-06-03 | 2006-12-14 | Fujifilm Electronic Materials U.S.A. Inc. | Novel photosensitive resin compositions |
US7803510B2 (en) * | 2005-08-17 | 2010-09-28 | Fujifilm Electronic Materials U.S.A., Inc. | Positive photosensitive polybenzoxazole precursor compositions |
JP4530949B2 (ja) * | 2005-08-29 | 2010-08-25 | 富士フイルム株式会社 | 感光性樹脂組成物及びそれを用いた半導体装置の製造方法 |
JP2007240975A (ja) * | 2006-03-09 | 2007-09-20 | Fujifilm Corp | 感光性樹脂組成物及びそれを用いた半導体装置の製造方法 |
EP2204281A4 (en) | 2007-10-25 | 2013-08-14 | Techno Polymer Co Ltd | LAMINATE REFLECTING THE INFRARED |
US9519216B2 (en) * | 2008-02-04 | 2016-12-13 | Fujifilm Electronic Materials U.S.A., Inc. | Positive photosensitive resin compositions |
US11905356B2 (en) | 2021-03-16 | 2024-02-20 | Nippon Kayaku Kabushiki Kaisha | Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL177718C (nl) * | 1973-02-22 | 1985-11-01 | Siemens Ag | Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren. |
US3964908A (en) * | 1975-09-22 | 1976-06-22 | International Business Machines Corporation | Positive resists containing dimethylglutarimide units |
JPS52153672A (en) * | 1976-06-16 | 1977-12-20 | Matsushita Electric Ind Co Ltd | Electron beam resist and its usage |
-
1980
- 1980-06-10 DE DE19803021748 patent/DE3021748A1/de not_active Withdrawn
-
1981
- 1981-06-01 DE DE8181104178T patent/DE3167919D1/de not_active Expired
- 1981-06-01 EP EP81104178A patent/EP0041677B1/de not_active Expired
- 1981-06-01 AT AT81104178T patent/ATE10980T1/de active
- 1981-06-04 US US06/270,637 patent/US4371685A/en not_active Expired - Lifetime
- 1981-06-09 JP JP8878281A patent/JPS5725329A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5968332A (ja) * | 1982-10-13 | 1984-04-18 | Nitto Electric Ind Co Ltd | 感光性樹脂組成物 |
JPH0350786B2 (ja) * | 1982-10-13 | 1991-08-02 | Nitto Denko Corp | |
JPS6088939A (ja) * | 1983-10-21 | 1985-05-18 | Shin Etsu Chem Co Ltd | 感光性組成物 |
JP2006193691A (ja) * | 2005-01-17 | 2006-07-27 | Nippon Kayaku Co Ltd | 感光性ポリアミド酸及びこれを含有する感光性組成物 |
WO2021246478A1 (ja) * | 2020-06-05 | 2021-12-09 | 富士フイルム株式会社 | 樹脂組成物及びその製造方法並びにパターン形成用組成物の製造方法 |
CN115768832A (zh) * | 2020-06-05 | 2023-03-07 | 富士胶片株式会社 | 树脂组合物及其制造方法以及图案形成用组合物的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
ATE10980T1 (de) | 1985-01-15 |
JPH0237934B2 (ja) | 1990-08-28 |
DE3167919D1 (en) | 1985-02-07 |
EP0041677B1 (de) | 1984-12-27 |
DE3021748A1 (de) | 1981-12-17 |
US4371685A (en) | 1983-02-01 |
EP0041677A2 (de) | 1981-12-16 |
EP0041677A3 (en) | 1982-12-29 |
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