ES2082965T3 - Composiciones polimeras reticuladas con compuestos de bistriazeno. - Google Patents

Composiciones polimeras reticuladas con compuestos de bistriazeno.

Info

Publication number
ES2082965T3
ES2082965T3 ES91902476T ES91902476T ES2082965T3 ES 2082965 T3 ES2082965 T3 ES 2082965T3 ES 91902476 T ES91902476 T ES 91902476T ES 91902476 T ES91902476 T ES 91902476T ES 2082965 T3 ES2082965 T3 ES 2082965T3
Authority
ES
Spain
Prior art keywords
poly
polymer compositions
bistriazene compounds
bistriazene
compounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91902476T
Other languages
English (en)
Inventor
Aldrich N K Lau
Lanchi P Vo
Frank W Mercer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
AlliedSignal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AlliedSignal Inc filed Critical AlliedSignal Inc
Application granted granted Critical
Publication of ES2082965T3 publication Critical patent/ES2082965T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C245/00—Compounds containing chains of at least two nitrogen atoms with at least one nitrogen-to-nitrogen multiple bond
    • C07C245/22—Compounds containing chains of at least two nitrogen atoms with at least one nitrogen-to-nitrogen multiple bond containing chains of three or more nitrogen atoms with one or more nitrogen-to-nitrogen double bonds
    • C07C245/24—Chains of only three nitrogen atoms, e.g. diazoamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4006—(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20—Cross-linking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Catching Or Destruction (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

LOS COMPUESTOS DE BISTRIAZENO TALES COMO *FIG* SON UTILES PARA RETICULAR POLIMEROS TALES COMO POLI(IMIDAS), (CETONAS DE ETER DE) POLI(ARILO), (SULFONAS DE ETER DE) POLI(ARILO), POLI(QUINOLINAS), POLI(QUINOXALINAS), Y FLUOROPOLIMEROS NO AROMATICOS QUE TIENEN GRUPOS ALIFATICOS C-H. LOS POLIMEROS RETICULADOS CON ESTOS COMPUESTOS DE BISTRIAZENO SON UTILES COMO AISLADORES DE INTERESTRATIFICACION EN ARTICULOS DE CIRCUITOS INTEGRADOS MULTICAPAS.
ES91902476T 1989-12-08 1990-12-07 Composiciones polimeras reticuladas con compuestos de bistriazeno. Expired - Lifetime ES2082965T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44775089A 1989-12-08 1989-12-08
US07/583,898 US5173542A (en) 1989-12-08 1990-09-17 Bistriazene compounds and polymeric compositions crosslinked therewith

Publications (1)

Publication Number Publication Date
ES2082965T3 true ES2082965T3 (es) 1996-04-01

Family

ID=27035077

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91902476T Expired - Lifetime ES2082965T3 (es) 1989-12-08 1990-12-07 Composiciones polimeras reticuladas con compuestos de bistriazeno.

Country Status (9)

Country Link
US (1) US5173542A (es)
EP (1) EP0504314B1 (es)
AT (1) ATE134210T1 (es)
CA (1) CA2068726C (es)
DE (1) DE69025411T2 (es)
DK (1) DK0504314T3 (es)
ES (1) ES2082965T3 (es)
GR (1) GR3019739T3 (es)
WO (1) WO1991009087A1 (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235044A (en) * 1992-09-09 1993-08-10 Raychem Corporation Compounds having oxadiazole and triazene moieties, crosslinkable polymers therefrom, and methods therefor
US5250667A (en) * 1992-09-09 1993-10-05 Raychem Corporation 1-[(hydroxyphenoxy)phenylene]triazenes, polymers crosslinked therewith, and methods therefor
US5874516A (en) * 1995-07-13 1999-02-23 Air Products And Chemicals, Inc. Nonfunctionalized poly(arylene ethers)
US5658994A (en) * 1995-07-13 1997-08-19 Air Products And Chemicals, Inc. Nonfunctionalized poly(arylene ether) dielectrics
US5925420A (en) * 1996-07-16 1999-07-20 Wj Semiconductor Equipment Group, Inc. Method for preparing crosslinked aromatic polymers as low κ dielectrics
KR19990024596A (ko) * 1997-09-04 1999-04-06 윤종용 광통신용 폴리아릴렌에테르
DE10228770A1 (de) 2002-06-27 2004-02-12 Infineon Technologies Ag Dielektrikum mit Sperrwirkung gegen Kupferdiffusion
US20080206536A1 (en) * 2005-02-16 2008-08-28 Solvay Advanced Polymers, L.L.C. Poly (Aryl Ether Sulfone) Material And Use Thereof
JP5549900B2 (ja) * 2005-06-24 2014-07-16 旭硝子株式会社 架橋性含フッ素芳香族プレポリマー及びその用途
EP2033324B1 (en) * 2006-05-24 2016-04-13 Ben Gurion University of the Negev Research and Development Authority Membranes and methods for their preparation
AU2010215116A1 (en) 2009-02-19 2011-10-13 Ben-Gurion University Of The Negev Research And Development Authority Chemically resistant membranes, coatings and films and methods for their preparation
WO2012081026A2 (en) 2010-12-12 2012-06-21 Ben-Gurion University Of The Negev Research And Development Authority Anion exchange membranes, methods of preparation and uses
US10290381B2 (en) 2011-12-30 2019-05-14 Ge-Hitachi Nuclear Energy Americas Llc Method and apparatus for a high-temperature deposition solution injector
EP2909253B1 (en) 2012-10-22 2021-11-10 Delsper LP Cross-linked organic polymer compositions
US9761336B2 (en) 2012-12-20 2017-09-12 Ge-Hitachi Nuclear Energy Americas Llc Insulated solution injector, system including the same, and method of injecting using the same
SG11201505815TA (en) 2013-01-28 2015-08-28 Delsper LP Anti-extrusion compositions for sealing and wear components
CA2906858C (en) 2013-03-15 2021-09-21 Delsper LP Cross-linked organic polymers for use as elastomers
TW201538532A (zh) * 2014-04-10 2015-10-16 Rogers Corp 交聯的氟聚合物電路材料、電路層板及其製造方法
WO2016092087A1 (en) * 2014-12-12 2016-06-16 Solvay Specialty Polymers Usa, Llc Poly(aryl ether) compositions for polymer-metal junctions and polymer-metal junctions and corresponding fabrication methods
US10515729B2 (en) * 2015-11-04 2019-12-24 Ge-Hitachi Nuclear Energy Americas Llc Insulated solution injector including an insulating liner, system including the same, and method of injecting using the same
DE102018119446A1 (de) * 2018-08-09 2020-02-13 Carl Freudenberg Kg Vernetzung von Polyaryletherketonen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168942A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Photosensitive polymer composition
US4656116A (en) * 1983-10-12 1987-04-07 Ciba-Geigy Corporation Radiation-sensitive coating composition
JPS6121131A (ja) * 1984-07-09 1986-01-29 Mitsubishi Electric Corp 感光性耐熱材料

Also Published As

Publication number Publication date
DE69025411T2 (de) 1996-07-04
DK0504314T3 (da) 1996-03-11
CA2068726A1 (en) 1991-06-09
EP0504314B1 (en) 1996-02-14
GR3019739T3 (en) 1996-07-31
CA2068726C (en) 2001-10-30
EP0504314A1 (en) 1992-09-23
ATE134210T1 (de) 1996-02-15
JPH05503114A (ja) 1993-05-27
DE69025411D1 (de) 1996-03-28
WO1991009087A1 (en) 1991-06-27
US5173542A (en) 1992-12-22

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