DE69025411T2 - Mit bistriazenverbindungen vernetzte polymerische zusammensetzungen - Google Patents

Mit bistriazenverbindungen vernetzte polymerische zusammensetzungen

Info

Publication number
DE69025411T2
DE69025411T2 DE69025411T DE69025411T DE69025411T2 DE 69025411 T2 DE69025411 T2 DE 69025411T2 DE 69025411 T DE69025411 T DE 69025411T DE 69025411 T DE69025411 T DE 69025411T DE 69025411 T2 DE69025411 T2 DE 69025411T2
Authority
DE
Germany
Prior art keywords
poly
compounds
bistriazen
networked
polymeric compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69025411T
Other languages
English (en)
Other versions
DE69025411D1 (de
Inventor
Aldrich Lau
Lanchi Vo
Frank Mercer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
AlliedSignal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AlliedSignal Inc filed Critical AlliedSignal Inc
Publication of DE69025411D1 publication Critical patent/DE69025411D1/de
Application granted granted Critical
Publication of DE69025411T2 publication Critical patent/DE69025411T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C245/00—Compounds containing chains of at least two nitrogen atoms with at least one nitrogen-to-nitrogen multiple bond
    • C07C245/22—Compounds containing chains of at least two nitrogen atoms with at least one nitrogen-to-nitrogen multiple bond containing chains of three or more nitrogen atoms with one or more nitrogen-to-nitrogen double bonds
    • C07C245/24—Chains of only three nitrogen atoms, e.g. diazoamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4006—(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20—Cross-linking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
DE69025411T 1989-12-08 1990-12-07 Mit bistriazenverbindungen vernetzte polymerische zusammensetzungen Expired - Fee Related DE69025411T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US44775089A 1989-12-08 1989-12-08
US07/583,898 US5173542A (en) 1989-12-08 1990-09-17 Bistriazene compounds and polymeric compositions crosslinked therewith
PCT/US1990/007232 WO1991009087A1 (en) 1989-12-08 1990-12-07 Novel bistriazene compounds and polymeric compositions crosslinked therewith

Publications (2)

Publication Number Publication Date
DE69025411D1 DE69025411D1 (de) 1996-03-28
DE69025411T2 true DE69025411T2 (de) 1996-07-04

Family

ID=27035077

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69025411T Expired - Fee Related DE69025411T2 (de) 1989-12-08 1990-12-07 Mit bistriazenverbindungen vernetzte polymerische zusammensetzungen

Country Status (9)

Country Link
US (1) US5173542A (de)
EP (1) EP0504314B1 (de)
AT (1) ATE134210T1 (de)
CA (1) CA2068726C (de)
DE (1) DE69025411T2 (de)
DK (1) DK0504314T3 (de)
ES (1) ES2082965T3 (de)
GR (1) GR3019739T3 (de)
WO (1) WO1991009087A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235044A (en) * 1992-09-09 1993-08-10 Raychem Corporation Compounds having oxadiazole and triazene moieties, crosslinkable polymers therefrom, and methods therefor
US5250667A (en) * 1992-09-09 1993-10-05 Raychem Corporation 1-[(hydroxyphenoxy)phenylene]triazenes, polymers crosslinked therewith, and methods therefor
US5874516A (en) * 1995-07-13 1999-02-23 Air Products And Chemicals, Inc. Nonfunctionalized poly(arylene ethers)
US5658994A (en) * 1995-07-13 1997-08-19 Air Products And Chemicals, Inc. Nonfunctionalized poly(arylene ether) dielectrics
US5925420A (en) * 1996-07-16 1999-07-20 Wj Semiconductor Equipment Group, Inc. Method for preparing crosslinked aromatic polymers as low κ dielectrics
KR19990024596A (ko) * 1997-09-04 1999-04-06 윤종용 광통신용 폴리아릴렌에테르
DE10228770A1 (de) 2002-06-27 2004-02-12 Infineon Technologies Ag Dielektrikum mit Sperrwirkung gegen Kupferdiffusion
US20080206536A1 (en) * 2005-02-16 2008-08-28 Solvay Advanced Polymers, L.L.C. Poly (Aryl Ether Sulfone) Material And Use Thereof
WO2006137327A1 (ja) * 2005-06-24 2006-12-28 Asahi Glass Company, Limited 架橋性含フッ素芳香族プレポリマー及びその用途
US8455557B2 (en) * 2006-05-24 2013-06-04 Ben Gurion University Of The Negev R&D Authority Membranes, coatings and films and methods for their preparation
US8710109B2 (en) 2009-02-19 2014-04-29 Ben Gurion University Of The Negev Research And Development Authority Chemically resistant membranes, coatings and films and methods for their preparation
US9457318B2 (en) 2010-12-12 2016-10-04 Ben-Gurion University Of The Negev Research And Development Authority Anion exchange membranes, methods of preparation and uses
US10290381B2 (en) 2011-12-30 2019-05-14 Ge-Hitachi Nuclear Energy Americas Llc Method and apparatus for a high-temperature deposition solution injector
SG11201503164QA (en) 2012-10-22 2015-06-29 Delsper LP Cross-Linked Organic Polymer Compositions and Methods for Controlling Cross-Linking Reaction Rate and of Modifying Same to Enhance Processability
US9761336B2 (en) 2012-12-20 2017-09-12 Ge-Hitachi Nuclear Energy Americas Llc Insulated solution injector, system including the same, and method of injecting using the same
US9127138B2 (en) 2013-01-28 2015-09-08 Delsper LP Anti-extrusion compositions for sealing and wear components
CA2906858C (en) 2013-03-15 2021-09-21 Delsper LP Cross-linked organic polymers for use as elastomers
TW201538532A (zh) * 2014-04-10 2015-10-16 Rogers Corp 交聯的氟聚合物電路材料、電路層板及其製造方法
CN107001659B (zh) * 2014-12-12 2021-03-16 索尔维特殊聚合物美国有限责任公司 用于聚合物-金属接合件的聚(芳基醚)组合物和聚合物-金属接合件以及相应的制造方法
US10515729B2 (en) * 2015-11-04 2019-12-24 Ge-Hitachi Nuclear Energy Americas Llc Insulated solution injector including an insulating liner, system including the same, and method of injecting using the same
DE102018119446A1 (de) * 2018-08-09 2020-02-13 Carl Freudenberg Kg Vernetzung von Polyaryletherketonen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57168942A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Photosensitive polymer composition
US4656116A (en) * 1983-10-12 1987-04-07 Ciba-Geigy Corporation Radiation-sensitive coating composition
JPS6121131A (ja) * 1984-07-09 1986-01-29 Mitsubishi Electric Corp 感光性耐熱材料

Also Published As

Publication number Publication date
ATE134210T1 (de) 1996-02-15
CA2068726C (en) 2001-10-30
EP0504314A1 (de) 1992-09-23
DE69025411D1 (de) 1996-03-28
GR3019739T3 (en) 1996-07-31
DK0504314T3 (da) 1996-03-11
ES2082965T3 (es) 1996-04-01
EP0504314B1 (de) 1996-02-14
US5173542A (en) 1992-12-22
WO1991009087A1 (en) 1991-06-27
CA2068726A1 (en) 1991-06-09
JPH05503114A (ja) 1993-05-27

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