JPS5724554A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5724554A JPS5724554A JP10020980A JP10020980A JPS5724554A JP S5724554 A JPS5724554 A JP S5724554A JP 10020980 A JP10020980 A JP 10020980A JP 10020980 A JP10020980 A JP 10020980A JP S5724554 A JPS5724554 A JP S5724554A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- silicone resin
- package
- tip
- alpha
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W42/25—
-
- H10W70/682—
-
- H10W72/01515—
-
- H10W72/075—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/5363—
-
- H10W72/5524—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10020980A JPS5724554A (en) | 1980-07-22 | 1980-07-22 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10020980A JPS5724554A (en) | 1980-07-22 | 1980-07-22 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5724554A true JPS5724554A (en) | 1982-02-09 |
| JPS6155254B2 JPS6155254B2 (cg-RX-API-DMAC10.html) | 1986-11-27 |
Family
ID=14267907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10020980A Granted JPS5724554A (en) | 1980-07-22 | 1980-07-22 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5724554A (cg-RX-API-DMAC10.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038842A (ja) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | ピングリッドアレイ型半導体パッケージ |
| JPS6156686U (cg-RX-API-DMAC10.html) * | 1984-09-19 | 1986-04-16 | ||
| US4604495A (en) * | 1983-12-21 | 1986-08-05 | Fujitsu Limited | Semiconductor device and process for producing same |
| JPS61126285U (cg-RX-API-DMAC10.html) * | 1985-01-28 | 1986-08-08 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122132A (en) * | 1978-03-16 | 1979-09-21 | Ricoh Co Ltd | Slit exposure method for photreceptor in copier |
| JPS5567486A (en) * | 1978-11-14 | 1980-05-21 | Seiko Epson Corp | Thermal printer |
| JPS5588356A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Semiconductor device |
| JPS5623759A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Resin-sealed semiconductor device and manufacture thereof |
-
1980
- 1980-07-22 JP JP10020980A patent/JPS5724554A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122132A (en) * | 1978-03-16 | 1979-09-21 | Ricoh Co Ltd | Slit exposure method for photreceptor in copier |
| JPS5567486A (en) * | 1978-11-14 | 1980-05-21 | Seiko Epson Corp | Thermal printer |
| JPS5588356A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Semiconductor device |
| JPS5623759A (en) * | 1979-08-01 | 1981-03-06 | Hitachi Ltd | Resin-sealed semiconductor device and manufacture thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038842A (ja) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | ピングリッドアレイ型半導体パッケージ |
| US4604495A (en) * | 1983-12-21 | 1986-08-05 | Fujitsu Limited | Semiconductor device and process for producing same |
| JPS6156686U (cg-RX-API-DMAC10.html) * | 1984-09-19 | 1986-04-16 | ||
| JPS61126285U (cg-RX-API-DMAC10.html) * | 1985-01-28 | 1986-08-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6155254B2 (cg-RX-API-DMAC10.html) | 1986-11-27 |
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