JPS5723253A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5723253A
JPS5723253A JP9781680A JP9781680A JPS5723253A JP S5723253 A JPS5723253 A JP S5723253A JP 9781680 A JP9781680 A JP 9781680A JP 9781680 A JP9781680 A JP 9781680A JP S5723253 A JPS5723253 A JP S5723253A
Authority
JP
Japan
Prior art keywords
directions
terminals
neighboring
lengths
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9781680A
Other languages
Japanese (ja)
Inventor
Shigekichi Inokoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9781680A priority Critical patent/JPS5723253A/en
Publication of JPS5723253A publication Critical patent/JPS5723253A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enable easier mounting to a printed circuit board, by a method wherein lengths of external terminals, which are taken out in four direction from a package containing an element and bent into an L-shape, are made equal to each other for the opposing directions and different for neighboring two directions. CONSTITUTION:A plurality of external terminals 12 are taken out in four directions from a package 11 for such a multiterminal element as an LSI. Lengths of the terminals 12 bent into an L-shape are made equal for oppositing two directions (a and a', and b and b') and different for neighboring two directions (for instance, a and b). This enables mounting to holes provided in a printed circuit board, by correcting arrangement of the terminals 12 and inserting from longer terminals with e.g., a mounting tool. Accordingly, elements can be mounted easily and securely.
JP9781680A 1980-07-17 1980-07-17 Semiconductor device Pending JPS5723253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9781680A JPS5723253A (en) 1980-07-17 1980-07-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9781680A JPS5723253A (en) 1980-07-17 1980-07-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5723253A true JPS5723253A (en) 1982-02-06

Family

ID=14202263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9781680A Pending JPS5723253A (en) 1980-07-17 1980-07-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5723253A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5407780A (en) * 1989-12-27 1995-04-18 Sumitomo Chemical Company, Limited Radiation-sensitive positive resist composition comprising an alkali-soluble resin made from m-cresol, 2-tert-butl-5-methyl phenol and formaldehyde

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5407780A (en) * 1989-12-27 1995-04-18 Sumitomo Chemical Company, Limited Radiation-sensitive positive resist composition comprising an alkali-soluble resin made from m-cresol, 2-tert-butl-5-methyl phenol and formaldehyde

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