JPS63246854A - Package structure of electronic part - Google Patents

Abstract

PURPOSE:To prevent the contact of leads between neighboring elements when a plurality of the semiconductor elements are mounted on a wiring board such as a PC (printed circuit) board, by providing projections on the side surface of a package. CONSTITUTION:Projections 4 are provided on the side surface of a packaging resin 3. The projections 4 are provided on both ends of each side surface of an approximately square package. The amount of protrusion is made higher than at least a lead part 2. Since the projections 4 are formed on the side surface of the packaging resin 3, contact and short-circuit defects between neighboring semiconductor elements can be prevented when a plurality of the semiconductor elements 1 are mounted on a wiring board such as a PC board. It is not necessary to form these projections on both ends of the side surface of the package. The structure, in which the projections are brought into contact before the contact of the lead parts when packages are arranged in the neighboring positions, may be acceptable.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to pIIcc (Plastic Leaded
This relates to the package structure of surface-mounted electronic components such as chip carriers.

[Conventional technology]

1 shows a plan view of a package structure of a semiconductor device. In the figure, (1) is a semiconductor element in which a semiconductor chip is connected to a lead frame and then sealed with resin and the lead part (powder is bent inward. (■ is the sealing resin).

Further, FIG. 4 shows a state in which the semiconductor element (1) is surface-mounted on a wiring board such as a PO (print circuit) board. FIG. 5 is a side view thereof.

In the figure (5 is a wiring board such as a PC board, solder (7)
) in which the semiconductor elements (1) are connected.

[Problem that the invention seeks to solve]

As shown in Figure 4, when the aforementioned semiconductor element (1) is mounted on a wiring board (5) such as a PA board, the gap (6) between semiconductor elements next to each other becomes smaller due to the recent trend towards high-density packaging. This is becoming a trend. Amid this trend, conventional semiconductor device package structures always require a space to maintain insulation, which hinders high-density packaging. In addition, even if a space is provided to maintain insulation, the gap (0) may disappear due to the processing accuracy of the semiconductor element, the accuracy of mounting the semiconductor element on the wiring board (S), and the leads between adjacent semiconductor elements may be removed. There were problems such as short circuits caused by contact between the two.

This invention was made to solve the above-mentioned problems, and when semiconductor elements are mounted next to each other,
The purpose of the present invention is to obtain a package structure for electronic components that does not cause short-circuit defects due to lead contact.

[Means for solving problems]

The electronic component package structure according to the present invention has a protrusion on the side surface of the package.

[Effect]

Since the package according to the present invention has a protrusion formed on the side surface, when a plurality of semiconductor elements are mounted on a wiring board such as a PC board, the processing accuracy of the semiconductor element and the mounting accuracy of the semiconductor element on the wiring board may be affected. Insulation can be maintained between adjacent semiconductor elements without the leads coming into contact with each other.

[Embodiment] FIG. 1 shows a plan view of an electronic package according to an embodiment of the present invention. In the figures, (1) to (J indicate the same or equivalent parts as in the conventional example shown in Figs. 3 to 5. .

These protrusions (4) are provided at both ends of each side of the approximately square package, and their protrusion amount is at least greater than the lead portion.

In this example, the protrusions (→ are formed on the side surfaces of the sealing resin (3), so when multiple semiconductor elements (1) are mounted next to each other on a wiring board such as a PC board, they will sit next to each other. It is possible to prevent defects such as short circuits caused by contact between leads between semiconductor elements.

Note that these protrusions do not have to be formed at both ends of the side surface of the package, but it is sufficient that the protrusions come into contact with each other before the lead parts do when the packages are placed adjacent to each other.

〔Effect of the invention〕

As described above, according to the present invention, since the protrusion is provided on the side surface of the sealing resin part, it is possible to prevent leads from coming into contact between neighboring semiconductor elements when a plurality of semiconductor elements are mounted on a wiring board such as a PO board. Can be done.

[Brief explanation of drawings]

FIG. 1 is a top view showing a package structure of a semiconductor device according to an embodiment of the present invention. FIG. 2 is a top view when a plurality of semiconductor elements shown in FIG. 1 are mounted on a wiring board such as a PC board. FIG. 3 is a top view showing a conventional semiconductor device package structure. FIG. 4 is a top view when a plurality of the semiconductor elements shown in FIG. 3 are mounted on a wiring board such as a PC board, and FIG. 5 is a side view thereof. In the figure, (1) is the semiconductor element, ((ri) is the lead part, (mark is the sealing resin, (4) is the protrusion, (5) is the wiring board such as a PO board, and (6) is between the leads of adjacent semiconductor elements. The gap (?) is solder. The same reference numerals in each figure indicate the same or corresponding parts. Agent: Masuo Oiwa, Patent Attorney Figure 1, Figure 2, Figure 3

Claims (3)

[Claims] (1) A package structure for electronic components characterized by a protrusion provided on the side surface of the package. (2) The package structure according to claim 1, wherein the package cage has a substantially rectangular shape, and projections are provided at both ends of each side surface. (3) The package structure according to claim 1 or 2, wherein the package is made of resin sealing, and the protrusion is formed of the resin.