JPS568855A - Container for semiconductor - Google Patents

Container for semiconductor

Info

Publication number
JPS568855A
JPS568855A JP8603679A JP8603679A JPS568855A JP S568855 A JPS568855 A JP S568855A JP 8603679 A JP8603679 A JP 8603679A JP 8603679 A JP8603679 A JP 8603679A JP S568855 A JPS568855 A JP S568855A
Authority
JP
Japan
Prior art keywords
terminals
substrate
main surface
high density
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8603679A
Other languages
Japanese (ja)
Inventor
Takashi Kondo
Toshinobu Banjo
Isao Okura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8603679A priority Critical patent/JPS568855A/en
Publication of JPS568855A publication Critical patent/JPS568855A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To realize high density mounting by forming an inside terminal, on which a semiconductor device can be adhered directly, and an outside terminal connected to an exterior lead on one main surface of a substrate. CONSTITUTION:Inside terminals 3 are provided on a substrate 2 in order to have an electrical and thermal connection of a projected electrode on a semiconductor device having a plurality of terminals, and these terminals are arranged in a mesh form at the intersecting point of the line and row determined in advance. Also on the same plane as the substrate 2, a plurality of outside terminals 6 are provided surrounding the terminals 3. These terminals 6 are electrically connected to a plularity of exterior leads provided on the other main surface of the substrate 2 passing through between the substrates consisted of a multilayer ceramic or the like. As a result, in addition to the realization of a high density mounting, a semiconductor container can be fabricated at a low cost with a least time of delivery.
JP8603679A 1979-07-04 1979-07-04 Container for semiconductor Pending JPS568855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8603679A JPS568855A (en) 1979-07-04 1979-07-04 Container for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8603679A JPS568855A (en) 1979-07-04 1979-07-04 Container for semiconductor

Publications (1)

Publication Number Publication Date
JPS568855A true JPS568855A (en) 1981-01-29

Family

ID=13875435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8603679A Pending JPS568855A (en) 1979-07-04 1979-07-04 Container for semiconductor

Country Status (1)

Country Link
JP (1) JPS568855A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216250A (en) * 1985-11-06 1987-09-22 Shinko Electric Ind Co Ltd Manufacture of printed substrate type pga package
JP2008163850A (en) * 2006-12-28 2008-07-17 Aisan Ind Co Ltd Fuel injection valve

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216250A (en) * 1985-11-06 1987-09-22 Shinko Electric Ind Co Ltd Manufacture of printed substrate type pga package
JPH025014B2 (en) * 1985-11-06 1990-01-31 Shinko Denki Kogyo Kk
JP2008163850A (en) * 2006-12-28 2008-07-17 Aisan Ind Co Ltd Fuel injection valve

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