GB1361304A - Distance pieces for semiconductor components - Google Patents

Distance pieces for semiconductor components

Info

Publication number
GB1361304A
GB1361304A GB680772A GB680772A GB1361304A GB 1361304 A GB1361304 A GB 1361304A GB 680772 A GB680772 A GB 680772A GB 680772 A GB680772 A GB 680772A GB 1361304 A GB1361304 A GB 1361304A
Authority
GB
United Kingdom
Prior art keywords
tubes
web
webs
joined
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB680772A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LUMBERG KARL KG
Original Assignee
LUMBERG KARL KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LUMBERG KARL KG filed Critical LUMBERG KARL KG
Publication of GB1361304A publication Critical patent/GB1361304A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Abstract

1361304 Semi-conductor devices; component assemblies KARL LUMBERG KG 14 Feb 1972 [16 Feb 1971] 6807/72 Headings H1K and H1R A distance piece for insertion between a semi-conductor device and a printed circuit board comprises a plurality of parallel tubes, each adapted to receive and surround a lead of the device, each tube being connected at one of its ends by a flat section web to at least one adjacent tube, the tubes and webs being integrally formed from a soft flexurally deformable insulating material. This arrangement allows the leads to be bent to adapt them to the positions of their fixing points on the printed circuit board. As shown, Fig. 5, a distance piece comprises three tubes 14a joined at one end by a frame shaped web 14b. Alternatively the web may be solid, Figs. 1 to 5 (not shown). Three tubes may be arranged in an in-line configuration and joined by two webs, Fig. 4 (not shown), the adjacent surfaces of the tubes being of reduced thickness to permit closer spacing. Four tubes joined by a square frame web may be provided, Fig. 6 (not shown), and the outer edges of the webs may be provided with cut-outs (notches) to receive further leads of the device which are not to be bent.
GB680772A 1971-02-16 1972-02-14 Distance pieces for semiconductor components Expired GB1361304A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2107225 1971-02-16

Publications (1)

Publication Number Publication Date
GB1361304A true GB1361304A (en) 1974-07-24

Family

ID=5798859

Family Applications (1)

Application Number Title Priority Date Filing Date
GB680772A Expired GB1361304A (en) 1971-02-16 1972-02-14 Distance pieces for semiconductor components

Country Status (3)

Country Link
DE (1) DE2107225B1 (en)
FR (1) FR2125329B1 (en)
GB (1) GB1361304A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8104113U1 (en) * 1981-02-14 1981-07-30 Deutsche Thomson-Brandt Gmbh, 7730 Villingen-Schwenningen Insulating pad for high-voltage semiconductors
FR2550684B1 (en) * 1983-08-09 1985-10-11 Cepe PLOT FOR COMPONENT BASE AND DEVICE FOR HOLDING SUCH A BASE COMPRISING THE SAME

Also Published As

Publication number Publication date
DE2107225B1 (en) 1972-05-25
FR2125329B1 (en) 1974-12-13
FR2125329A1 (en) 1972-09-29

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee