GB1093464A - The manufacture of semi-conductor assemblies - Google Patents

The manufacture of semi-conductor assemblies

Info

Publication number
GB1093464A
GB1093464A GB2442665A GB2442665A GB1093464A GB 1093464 A GB1093464 A GB 1093464A GB 2442665 A GB2442665 A GB 2442665A GB 2442665 A GB2442665 A GB 2442665A GB 1093464 A GB1093464 A GB 1093464A
Authority
GB
United Kingdom
Prior art keywords
strip
semi
conductive regions
regions
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2442665A
Inventor
John Arthur Chandler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB2442665A priority Critical patent/GB1093464A/en
Priority to FR64813A priority patent/FR1482707A/en
Publication of GB1093464A publication Critical patent/GB1093464A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

1,093,464. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. May 18, 1966 [June 9, 1965], No. 24426/65. Heading H1K. In a sequential method of mounting semiconductor devices, an elongate member of insulating material provided with transverse conductive regions on one face is longitudinally moved through an apparatus which mounts a semi-conductor device on the member, connects the electrodes of the device to respective ones of the conductive regions, and severs the leading portion of the member to produce a completed assembly. As shown, Fig. 1, a ceramic strip 1 having transverse metallized regions 2 is moved in the direction of the arrow by indexing means (not shown), which may use the metallized regions as registering marks. At a first position a planar transistor 4 is mounted with its collector connected to one of the conductive regions, and at a second position flying leads 5 are attached to other conductive regions. The transistor and its flying leads may then be covered with a mass of insulating material and the end portion of the strip is severed as along dotted line 6, to produce an assembly comprising a mounted transistor. The conductive regions 2 extend down the sides of strip 1 so that the assembly can be mounted on a printed circuit. In a modification, Fig. 2 (not shown), the conductive strips are of varying widths and do not extend completely across the strip. Slots (14) are also provided in the edges of the strip to form indexing means. The strip 1 may also be in the form of a semi-flexible ribbon. The semi-conductor devices may also be diodes or integrated circuits.
GB2442665A 1965-06-09 1965-06-09 The manufacture of semi-conductor assemblies Expired GB1093464A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2442665A GB1093464A (en) 1965-06-09 1965-06-09 The manufacture of semi-conductor assemblies
FR64813A FR1482707A (en) 1965-06-09 1966-06-09 Improvements in manufacturing processes for semiconductor devices and products obtained

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2442665A GB1093464A (en) 1965-06-09 1965-06-09 The manufacture of semi-conductor assemblies

Publications (1)

Publication Number Publication Date
GB1093464A true GB1093464A (en) 1967-12-06

Family

ID=10211557

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2442665A Expired GB1093464A (en) 1965-06-09 1965-06-09 The manufacture of semi-conductor assemblies

Country Status (1)

Country Link
GB (1) GB1093464A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2129808A1 (en) * 1970-06-18 1971-12-30 Philips Nv Device and base plate for a mosaic of semiconductor components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2129808A1 (en) * 1970-06-18 1971-12-30 Philips Nv Device and base plate for a mosaic of semiconductor components

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