JPS57208166A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS57208166A
JPS57208166A JP9427181A JP9427181A JPS57208166A JP S57208166 A JPS57208166 A JP S57208166A JP 9427181 A JP9427181 A JP 9427181A JP 9427181 A JP9427181 A JP 9427181A JP S57208166 A JPS57208166 A JP S57208166A
Authority
JP
Japan
Prior art keywords
lead frame
frames
frame
semiconductor device
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9427181A
Other languages
English (en)
Inventor
Masaaki Shimotomai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9427181A priority Critical patent/JPS57208166A/ja
Publication of JPS57208166A publication Critical patent/JPS57208166A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • H01L23/49555Cross section geometry characterised by bent parts the bent parts being the outer leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9427181A 1981-06-17 1981-06-17 Lead frame for semiconductor device Pending JPS57208166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9427181A JPS57208166A (en) 1981-06-17 1981-06-17 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9427181A JPS57208166A (en) 1981-06-17 1981-06-17 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS57208166A true JPS57208166A (en) 1982-12-21

Family

ID=14105601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9427181A Pending JPS57208166A (en) 1981-06-17 1981-06-17 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS57208166A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6055647A (ja) * 1983-09-07 1985-03-30 Nec Corp 半導体装置
JPH01107152U (ja) * 1988-01-12 1989-07-19
JPH042052U (ja) * 1990-04-21 1992-01-09

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5366170A (en) * 1976-11-26 1978-06-13 Hitachi Ltd Lead frame with prodjection

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5366170A (en) * 1976-11-26 1978-06-13 Hitachi Ltd Lead frame with prodjection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6055647A (ja) * 1983-09-07 1985-03-30 Nec Corp 半導体装置
JPH01107152U (ja) * 1988-01-12 1989-07-19
JPH042052U (ja) * 1990-04-21 1992-01-09

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