JPS57207174A - Sputtering device - Google Patents

Sputtering device

Info

Publication number
JPS57207174A
JPS57207174A JP9134281A JP9134281A JPS57207174A JP S57207174 A JPS57207174 A JP S57207174A JP 9134281 A JP9134281 A JP 9134281A JP 9134281 A JP9134281 A JP 9134281A JP S57207174 A JPS57207174 A JP S57207174A
Authority
JP
Japan
Prior art keywords
metallic pieces
compsns
target
alloy films
thin alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9134281A
Other languages
Japanese (ja)
Inventor
Takahiro Miyano
Kunji Nakajima
Shoichi Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP9134281A priority Critical patent/JPS57207174A/en
Publication of JPS57207174A publication Critical patent/JPS57207174A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To form thin alloy films of desired compsns. uniformly by denting the surfaces of a sputtering electrode wherein plural metallic pieces are formed to one body to a spherical shape, and connecting electric power sources to each of the plural metallic pieces. CONSTITUTION:A sputtering electrode (target) 1 is made by forming plural dissimilar metallic pieces 2 to one body by means of insulating materials 3 and denting the surfaces thereof to a spherical shape. A material 4 to be vapor deposited is held by means of a jig at a level higher than the spherical center of the spherical dent of said target 1. Each of the dissimilar metallic pieces 2 of the target 1 is connected to electric power sources 5 by means of connecting wires 6, and the respective outputs are controlled. With such mechanism, thin alloy films of arbitrary compsns. are vapor deposited uniformly on the material 4 and the compsns. of the thin alloy films are controlled as desired during vapor deposition.
JP9134281A 1981-06-12 1981-06-12 Sputtering device Pending JPS57207174A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9134281A JPS57207174A (en) 1981-06-12 1981-06-12 Sputtering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9134281A JPS57207174A (en) 1981-06-12 1981-06-12 Sputtering device

Publications (1)

Publication Number Publication Date
JPS57207174A true JPS57207174A (en) 1982-12-18

Family

ID=14023739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9134281A Pending JPS57207174A (en) 1981-06-12 1981-06-12 Sputtering device

Country Status (1)

Country Link
JP (1) JPS57207174A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861461U (en) * 1981-10-19 1983-04-25 富士通株式会社 sputtering equipment
JPS6046368A (en) * 1983-08-23 1985-03-13 Showa Denko Kk Sputtering target
JPS62211373A (en) * 1986-03-11 1987-09-17 Matsushita Electric Ind Co Ltd Sputtering device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5861461U (en) * 1981-10-19 1983-04-25 富士通株式会社 sputtering equipment
JPS6046368A (en) * 1983-08-23 1985-03-13 Showa Denko Kk Sputtering target
JPS6331550B2 (en) * 1983-08-23 1988-06-24 Showa Denko Kk
JPS62211373A (en) * 1986-03-11 1987-09-17 Matsushita Electric Ind Co Ltd Sputtering device

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