JPS57207176A - Sputtering target - Google Patents

Sputtering target

Info

Publication number
JPS57207176A
JPS57207176A JP9228481A JP9228481A JPS57207176A JP S57207176 A JPS57207176 A JP S57207176A JP 9228481 A JP9228481 A JP 9228481A JP 9228481 A JP9228481 A JP 9228481A JP S57207176 A JPS57207176 A JP S57207176A
Authority
JP
Japan
Prior art keywords
target
sputter
refrigerant
packing plate
sputter target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9228481A
Other languages
Japanese (ja)
Other versions
JPH0115591B2 (en
Inventor
Hideki Tateishi
Susumu Aiuchi
Tamotsu Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9228481A priority Critical patent/JPS57207176A/en
Publication of JPS57207176A publication Critical patent/JPS57207176A/en
Publication of JPH0115591B2 publication Critical patent/JPH0115591B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Abstract

PURPOSE:To stabilize a sputtering treatment and to improve the operating efficiency of a device by forming a target and a packing plate of the same material to one body, and forming a film for preventing corrosion on the surface in contact with a refrigerant. CONSTITUTION:In a sputter target for a sputter treatment, a sputter target and a packing plate are formed of the same material to one body. A film 18 of copper plating or the like which is not corroded by a refrigerant is formed on the surface of the packing plate of this one-body target 17 in contact with the refrigerant and this is mounted to a target body via an insulator. The accidents of the sputter target are reduced by this, and the sputtering treatment is carried out safely. Further, there is an effect of permitting inexpensive manufacture of the sputter target.
JP9228481A 1981-06-17 1981-06-17 Sputtering target Granted JPS57207176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9228481A JPS57207176A (en) 1981-06-17 1981-06-17 Sputtering target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9228481A JPS57207176A (en) 1981-06-17 1981-06-17 Sputtering target

Publications (2)

Publication Number Publication Date
JPS57207176A true JPS57207176A (en) 1982-12-18
JPH0115591B2 JPH0115591B2 (en) 1989-03-17

Family

ID=14050099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9228481A Granted JPS57207176A (en) 1981-06-17 1981-06-17 Sputtering target

Country Status (1)

Country Link
JP (1) JPS57207176A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056762U (en) * 1983-09-27 1985-04-20 日本真空技術株式会社 Target for sputtering
JPS6060454U (en) * 1983-09-30 1985-04-26 鹿児島日本電気株式会社 Target for sputtering
JPS6223978A (en) * 1985-07-24 1987-01-31 Fujitsu Ltd Sputtering device
JPS6263670A (en) * 1985-09-12 1987-03-20 Toshiba Corp Monolithic target for sputtering

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056762U (en) * 1983-09-27 1985-04-20 日本真空技術株式会社 Target for sputtering
JPS6060454U (en) * 1983-09-30 1985-04-26 鹿児島日本電気株式会社 Target for sputtering
JPS6223978A (en) * 1985-07-24 1987-01-31 Fujitsu Ltd Sputtering device
JPS6263670A (en) * 1985-09-12 1987-03-20 Toshiba Corp Monolithic target for sputtering

Also Published As

Publication number Publication date
JPH0115591B2 (en) 1989-03-17

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