JPS57206055A - Cooling system for electronic device - Google Patents

Cooling system for electronic device

Info

Publication number
JPS57206055A
JPS57206055A JP56089578A JP8957881A JPS57206055A JP S57206055 A JPS57206055 A JP S57206055A JP 56089578 A JP56089578 A JP 56089578A JP 8957881 A JP8957881 A JP 8957881A JP S57206055 A JPS57206055 A JP S57206055A
Authority
JP
Japan
Prior art keywords
metal foil
semiconductor devices
protrusions
substrate
cooling water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56089578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6251498B2 (cg-RX-API-DMAC10.html
Inventor
Motohiro Sato
Noriyuki Ashiwake
Akio Yasukawa
Susumu Hioki
Fumiyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56089578A priority Critical patent/JPS57206055A/ja
Publication of JPS57206055A publication Critical patent/JPS57206055A/ja
Publication of JPS6251498B2 publication Critical patent/JPS6251498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/77
    • H10W72/07251
    • H10W72/20
    • H10W72/877

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56089578A 1981-06-12 1981-06-12 Cooling system for electronic device Granted JPS57206055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56089578A JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56089578A JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Publications (2)

Publication Number Publication Date
JPS57206055A true JPS57206055A (en) 1982-12-17
JPS6251498B2 JPS6251498B2 (cg-RX-API-DMAC10.html) 1987-10-30

Family

ID=13974675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56089578A Granted JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Country Status (1)

Country Link
JP (1) JPS57206055A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6275599U (cg-RX-API-DMAC10.html) * 1985-10-30 1987-05-14
JPH01106992U (cg-RX-API-DMAC10.html) * 1988-01-06 1989-07-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Also Published As

Publication number Publication date
JPS6251498B2 (cg-RX-API-DMAC10.html) 1987-10-30

Similar Documents

Publication Publication Date Title
TW347583B (en) Semiconductor device and manufacture thereof
JPS57206055A (en) Cooling system for electronic device
JPS5429555A (en) Heat sink constituent
EP0281404A3 (en) Cooling system for electronic equipment
JPS57160150A (en) Heat dissipating board for hybrid ic
JPS5478982A (en) Semiconductor device and its manufacture
GB1258488A (cg-RX-API-DMAC10.html)
JPS5440583A (en) Semiconductor device
JPH05335452A (ja) 混成集積回路装置
JPS645045A (en) Cooling structure for integrated circuit package
JPS5323564A (en) Bump type semiconductor device
JPS57121262A (en) Semiconductor device and manufacture thereof
JPS57188859A (en) Metal foil for flexible tape of film carrier
JPS5487178A (en) Construction of bonding part between semiconductor pellet and electrode plate
JPS52117063A (en) Preparation of ohmic ontact layer in semiconductor device
JPS54126467A (en) Lead frame for semiconductor device
JPS6412561A (en) Application of heat transfer compound
JPS5311591A (en) Semiconductor laser device
JPS5336467A (en) Semiconductor pellet fixture to metal substrate
JPS52146563A (en) Semiconductor device
JPS57159033A (en) Semiconductor device and manufacture thereof
JPS5687332A (en) Semiconductor chip
JPS59143388A (ja) 液冷用電子回路基板
JPS5324269A (en) Integrated circuit devic e
JPS5662343A (en) Electronic device