JPS57206055A - Cooling system for electronic device - Google Patents
Cooling system for electronic deviceInfo
- Publication number
- JPS57206055A JPS57206055A JP56089578A JP8957881A JPS57206055A JP S57206055 A JPS57206055 A JP S57206055A JP 56089578 A JP56089578 A JP 56089578A JP 8957881 A JP8957881 A JP 8957881A JP S57206055 A JPS57206055 A JP S57206055A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- semiconductor devices
- protrusions
- substrate
- cooling water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W40/77—
-
- H10W72/07251—
-
- H10W72/20—
-
- H10W72/877—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56089578A JPS57206055A (en) | 1981-06-12 | 1981-06-12 | Cooling system for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56089578A JPS57206055A (en) | 1981-06-12 | 1981-06-12 | Cooling system for electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57206055A true JPS57206055A (en) | 1982-12-17 |
| JPS6251498B2 JPS6251498B2 (cg-RX-API-DMAC10.html) | 1987-10-30 |
Family
ID=13974675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56089578A Granted JPS57206055A (en) | 1981-06-12 | 1981-06-12 | Cooling system for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57206055A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6275599U (cg-RX-API-DMAC10.html) * | 1985-10-30 | 1987-05-14 | ||
| JPH01106992U (cg-RX-API-DMAC10.html) * | 1988-01-06 | 1989-07-19 |
-
1981
- 1981-06-12 JP JP56089578A patent/JPS57206055A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6251498B2 (cg-RX-API-DMAC10.html) | 1987-10-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW347583B (en) | Semiconductor device and manufacture thereof | |
| JPS57206055A (en) | Cooling system for electronic device | |
| JPS5429555A (en) | Heat sink constituent | |
| EP0281404A3 (en) | Cooling system for electronic equipment | |
| JPS57160150A (en) | Heat dissipating board for hybrid ic | |
| JPS5478982A (en) | Semiconductor device and its manufacture | |
| GB1258488A (cg-RX-API-DMAC10.html) | ||
| JPS5440583A (en) | Semiconductor device | |
| JPH05335452A (ja) | 混成集積回路装置 | |
| JPS645045A (en) | Cooling structure for integrated circuit package | |
| JPS5323564A (en) | Bump type semiconductor device | |
| JPS57121262A (en) | Semiconductor device and manufacture thereof | |
| JPS57188859A (en) | Metal foil for flexible tape of film carrier | |
| JPS5487178A (en) | Construction of bonding part between semiconductor pellet and electrode plate | |
| JPS52117063A (en) | Preparation of ohmic ontact layer in semiconductor device | |
| JPS54126467A (en) | Lead frame for semiconductor device | |
| JPS6412561A (en) | Application of heat transfer compound | |
| JPS5311591A (en) | Semiconductor laser device | |
| JPS5336467A (en) | Semiconductor pellet fixture to metal substrate | |
| JPS52146563A (en) | Semiconductor device | |
| JPS57159033A (en) | Semiconductor device and manufacture thereof | |
| JPS5687332A (en) | Semiconductor chip | |
| JPS59143388A (ja) | 液冷用電子回路基板 | |
| JPS5324269A (en) | Integrated circuit devic e | |
| JPS5662343A (en) | Electronic device |