JPS57203790A - Apparatus for electrolytically plating blot shaped coating to metalic tape or metallized tape - Google Patents
Apparatus for electrolytically plating blot shaped coating to metalic tape or metallized tapeInfo
- Publication number
- JPS57203790A JPS57203790A JP57035036A JP3503682A JPS57203790A JP S57203790 A JPS57203790 A JP S57203790A JP 57035036 A JP57035036 A JP 57035036A JP 3503682 A JP3503682 A JP 3503682A JP S57203790 A JPS57203790 A JP S57203790A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- blot
- metallized
- metalic
- segments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- 230000000873 masking effect Effects 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 2
- 238000009713 electroplating Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Coating Apparatus (AREA)
- Contacts (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL8101106A NL8101106A (nl) | 1981-03-07 | 1981-03-07 | Inrichting voor het galvanisch aanbrengen van vlekvormige bedekkingen. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57203790A true JPS57203790A (en) | 1982-12-14 |
| JPS625237B2 JPS625237B2 (enExample) | 1987-02-03 |
Family
ID=19837122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57035036A Granted JPS57203790A (en) | 1981-03-07 | 1982-03-05 | Apparatus for electrolytically plating blot shaped coating to metalic tape or metallized tape |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US4493757A (enExample) |
| EP (1) | EP0060591B1 (enExample) |
| JP (1) | JPS57203790A (enExample) |
| KR (1) | KR880002017B1 (enExample) |
| AT (1) | ATE11058T1 (enExample) |
| BR (1) | BR8201224A (enExample) |
| DE (1) | DE3261736D1 (enExample) |
| HK (1) | HK51986A (enExample) |
| MY (1) | MY8600527A (enExample) |
| NL (1) | NL8101106A (enExample) |
| PH (1) | PH20617A (enExample) |
| SG (1) | SG4786G (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939947A (ja) * | 1982-08-27 | 1984-03-05 | Yanmar Diesel Engine Co Ltd | デユアルフユエル機関の燃料供給装置 |
| JPS5954567U (ja) * | 1982-09-30 | 1984-04-10 | 日本エレクトロプレイテイング・エンジニヤ−ス株式会社 | 帯状メツキ物の部分メツキ装置 |
| JP2004052031A (ja) * | 2002-07-18 | 2004-02-19 | Yazaki Corp | 鍍金装置 |
| JP2012241262A (ja) * | 2011-05-23 | 2012-12-10 | Jx Nippon Mining & Metals Corp | スポットめっき装置及びスポットめっき装置用バックアップ部材 |
| WO2013057947A1 (ja) * | 2011-10-19 | 2013-04-25 | Dowaメタルテック株式会社 | 部分めっき装置及び部分めっき方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3708779A1 (de) * | 1986-11-22 | 1988-06-01 | Schempp & Decker Maschinenbau | Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes |
| GB2214930A (en) * | 1988-02-11 | 1989-09-13 | Twickenham Plating & Enamellin | Mask for use in electriplating on elongate substrate |
| NL9100640A (nl) * | 1991-04-12 | 1992-11-02 | Meco Equip Eng | Inrichting voor het aanbrengen van vlekvormige bedekkingen. |
| NL9300174A (nl) * | 1993-01-28 | 1994-08-16 | Meco Equip Eng | Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten. |
| US7282240B1 (en) | 1998-04-21 | 2007-10-16 | President And Fellows Of Harvard College | Elastomeric mask and use in fabrication of devices |
| CA2402737A1 (en) * | 2000-03-17 | 2001-09-27 | Emanuele Ostuni | Cell patterning technique |
| JP7395610B2 (ja) | 2019-03-25 | 2023-12-11 | アッサ アブロイ アーベー | 位置推定に基づく意図検知を備える物理アクセス制御システム |
| NL2035636B1 (nl) * | 2023-08-18 | 2025-03-04 | Meco Equipment Eng B V | Systeem voor het elektrolytisch behandelen van discrete delen van het oppervlak van een bandvormig substraat. |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB582014A (en) * | 1944-04-13 | 1946-11-01 | Brassert & Co | Improvements relating to apparatus for handling and treating flexible metallic sheets |
| US3746630A (en) * | 1970-12-08 | 1973-07-17 | Auric Corp | Apparatus for selective electroplating of strips |
| NL170027C (nl) * | 1971-05-25 | 1982-09-16 | Galentan Ag | Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting. |
| US4132617A (en) * | 1973-10-04 | 1979-01-02 | Galentan, A.G. | Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape |
| CH594067A5 (enExample) * | 1973-10-04 | 1977-12-30 | Galentan Ag | |
| US4003805A (en) * | 1975-10-20 | 1977-01-18 | Uop Inc. | System for electroplating a sequence of moving plate members |
| JPS5250936A (en) * | 1975-10-21 | 1977-04-23 | Noge Denki Kogyo Kk | Continuous partial plating apparatus |
| US4033844A (en) * | 1975-11-03 | 1977-07-05 | National Semiconductor Corporation | Apparatus for selectively plating lead frames |
| US4155815A (en) * | 1978-04-03 | 1979-05-22 | Francis William L | Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals |
| US4186062A (en) * | 1978-07-13 | 1980-01-29 | Micro-Plate, Inc. | Continuous tab plater and method |
| EP0055130B1 (en) * | 1980-12-23 | 1984-07-25 | S.G. Owen Limited | Improvements in or relating to selective plating |
-
1981
- 1981-03-07 NL NL8101106A patent/NL8101106A/nl not_active Application Discontinuation
-
1982
- 1982-03-01 US US06/353,151 patent/US4493757A/en not_active Expired - Lifetime
- 1982-03-04 DE DE8282200276T patent/DE3261736D1/de not_active Expired
- 1982-03-04 EP EP82200276A patent/EP0060591B1/en not_active Expired
- 1982-03-04 AT AT82200276T patent/ATE11058T1/de not_active IP Right Cessation
- 1982-03-05 KR KR8200945A patent/KR880002017B1/ko not_active Expired
- 1982-03-05 BR BR8201224A patent/BR8201224A/pt not_active IP Right Cessation
- 1982-03-05 JP JP57035036A patent/JPS57203790A/ja active Granted
- 1982-03-05 PH PH26955A patent/PH20617A/en unknown
-
1986
- 1986-01-16 SG SG47/86A patent/SG4786G/en unknown
- 1986-07-03 HK HK519/86A patent/HK51986A/en not_active IP Right Cessation
- 1986-12-30 MY MY527/86A patent/MY8600527A/xx unknown
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5939947A (ja) * | 1982-08-27 | 1984-03-05 | Yanmar Diesel Engine Co Ltd | デユアルフユエル機関の燃料供給装置 |
| JPS5954567U (ja) * | 1982-09-30 | 1984-04-10 | 日本エレクトロプレイテイング・エンジニヤ−ス株式会社 | 帯状メツキ物の部分メツキ装置 |
| JP2004052031A (ja) * | 2002-07-18 | 2004-02-19 | Yazaki Corp | 鍍金装置 |
| JP2012241262A (ja) * | 2011-05-23 | 2012-12-10 | Jx Nippon Mining & Metals Corp | スポットめっき装置及びスポットめっき装置用バックアップ部材 |
| WO2013057947A1 (ja) * | 2011-10-19 | 2013-04-25 | Dowaメタルテック株式会社 | 部分めっき装置及び部分めっき方法 |
| JP2013100593A (ja) * | 2011-10-19 | 2013-05-23 | Dowa Metaltech Kk | 部分めっき装置 |
| US9683307B2 (en) | 2011-10-19 | 2017-06-20 | Dowa Metaltech Co., Ltd. | Partial plating device and partial plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| US4493757A (en) | 1985-01-15 |
| JPS625237B2 (enExample) | 1987-02-03 |
| PH20617A (en) | 1987-03-06 |
| SG4786G (en) | 1987-03-27 |
| NL8101106A (nl) | 1982-10-01 |
| HK51986A (en) | 1986-07-11 |
| EP0060591B1 (en) | 1985-01-02 |
| DE3261736D1 (en) | 1985-02-14 |
| ATE11058T1 (de) | 1985-01-15 |
| EP0060591A1 (en) | 1982-09-22 |
| MY8600527A (en) | 1986-12-31 |
| KR880002017B1 (ko) | 1988-10-12 |
| BR8201224A (pt) | 1983-01-18 |
| KR830009269A (ko) | 1983-12-19 |
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