BR8201224A - Dispositivo para aplicar material em forma de ponto de contatomediante eletrogalvanizacao - Google Patents

Dispositivo para aplicar material em forma de ponto de contatomediante eletrogalvanizacao

Info

Publication number
BR8201224A
BR8201224A BR8201224A BR8201224A BR8201224A BR 8201224 A BR8201224 A BR 8201224A BR 8201224 A BR8201224 A BR 8201224A BR 8201224 A BR8201224 A BR 8201224A BR 8201224 A BR8201224 A BR 8201224A
Authority
BR
Brazil
Prior art keywords
segments
electrogalvanization
contact point
masking member
blot
Prior art date
Application number
BR8201224A
Other languages
English (en)
Portuguese (pt)
Inventor
Harry Christiaan Piepers
Original Assignee
Galentan Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Galentan Ag filed Critical Galentan Ag
Publication of BR8201224A publication Critical patent/BR8201224A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Contacts (AREA)
  • Coating Apparatus (AREA)
BR8201224A 1981-03-07 1982-03-05 Dispositivo para aplicar material em forma de ponto de contatomediante eletrogalvanizacao BR8201224A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8101106A NL8101106A (nl) 1981-03-07 1981-03-07 Inrichting voor het galvanisch aanbrengen van vlekvormige bedekkingen.

Publications (1)

Publication Number Publication Date
BR8201224A true BR8201224A (pt) 1983-01-18

Family

ID=19837122

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8201224A BR8201224A (pt) 1981-03-07 1982-03-05 Dispositivo para aplicar material em forma de ponto de contatomediante eletrogalvanizacao

Country Status (12)

Country Link
US (1) US4493757A (enExample)
EP (1) EP0060591B1 (enExample)
JP (1) JPS57203790A (enExample)
KR (1) KR880002017B1 (enExample)
AT (1) ATE11058T1 (enExample)
BR (1) BR8201224A (enExample)
DE (1) DE3261736D1 (enExample)
HK (1) HK51986A (enExample)
MY (1) MY8600527A (enExample)
NL (1) NL8101106A (enExample)
PH (1) PH20617A (enExample)
SG (1) SG4786G (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939947A (ja) * 1982-08-27 1984-03-05 Yanmar Diesel Engine Co Ltd デユアルフユエル機関の燃料供給装置
JPS5954567U (ja) * 1982-09-30 1984-04-10 日本エレクトロプレイテイング・エンジニヤ−ス株式会社 帯状メツキ物の部分メツキ装置
DE3708779A1 (de) * 1986-11-22 1988-06-01 Schempp & Decker Maschinenbau Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes
GB2214930A (en) * 1988-02-11 1989-09-13 Twickenham Plating & Enamellin Mask for use in electriplating on elongate substrate
NL9100640A (nl) * 1991-04-12 1992-11-02 Meco Equip Eng Inrichting voor het aanbrengen van vlekvormige bedekkingen.
NL9300174A (nl) * 1993-01-28 1994-08-16 Meco Equip Eng Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.
US7282240B1 (en) 1998-04-21 2007-10-16 President And Fellows Of Harvard College Elastomeric mask and use in fabrication of devices
WO2001070389A2 (en) * 2000-03-17 2001-09-27 President And Fellows Of Harvard College Cell patterning technique
JP3845343B2 (ja) * 2002-07-18 2006-11-15 矢崎総業株式会社 鍍金装置
JP5788218B2 (ja) * 2011-05-23 2015-09-30 Jx日鉱日石金属株式会社 スポットめっき装置及びスポットめっき装置用バックアップ部材
JP5914083B2 (ja) * 2011-10-19 2016-05-11 Ｄｏｗａメタルテック株式会社 部分めっき装置及び部分めっき方法
AU2020247388B2 (en) 2019-03-25 2023-03-09 Assa Abloy Ab Physical access control systems with localization-based intent detection
NL2035636B1 (nl) * 2023-08-18 2025-03-04 Meco Equipment Eng B V Systeem voor het elektrolytisch behandelen van discrete delen van het oppervlak van een bandvormig substraat.

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB582014A (en) * 1944-04-13 1946-11-01 Brassert & Co Improvements relating to apparatus for handling and treating flexible metallic sheets
US3746630A (en) * 1970-12-08 1973-07-17 Auric Corp Apparatus for selective electroplating of strips
NL170027C (nl) * 1971-05-25 1982-09-16 Galentan Ag Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting.
US4132617A (en) * 1973-10-04 1979-01-02 Galentan, A.G. Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape
CH594067A5 (enExample) * 1973-10-04 1977-12-30 Galentan Ag
US4003805A (en) * 1975-10-20 1977-01-18 Uop Inc. System for electroplating a sequence of moving plate members
JPS5250936A (en) * 1975-10-21 1977-04-23 Noge Denki Kogyo Kk Continuous partial plating apparatus
US4033844A (en) * 1975-11-03 1977-07-05 National Semiconductor Corporation Apparatus for selectively plating lead frames
US4155815A (en) * 1978-04-03 1979-05-22 Francis William L Method of continuous electroplating and continuous electroplating machine for printed circuit board terminals
US4186062A (en) * 1978-07-13 1980-01-29 Micro-Plate, Inc. Continuous tab plater and method
DE3165132D1 (en) * 1980-12-23 1984-08-30 Owen S G Ltd Improvements in or relating to selective plating

Also Published As

Publication number Publication date
MY8600527A (en) 1986-12-31
JPS625237B2 (enExample) 1987-02-03
KR880002017B1 (ko) 1988-10-12
JPS57203790A (en) 1982-12-14
DE3261736D1 (en) 1985-02-14
NL8101106A (nl) 1982-10-01
EP0060591B1 (en) 1985-01-02
ATE11058T1 (de) 1985-01-15
SG4786G (en) 1987-03-27
HK51986A (en) 1986-07-11
KR830009269A (ko) 1983-12-19
PH20617A (en) 1987-03-06
US4493757A (en) 1985-01-15
EP0060591A1 (en) 1982-09-22

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Legal Events

Date Code Title Description
MM Lapse due to non-payment of fees (art. 50)