JPS57197879A - Lead wire connection structure for air-cooled optoelectric transducer - Google Patents
Lead wire connection structure for air-cooled optoelectric transducerInfo
- Publication number
- JPS57197879A JPS57197879A JP56083312A JP8331281A JPS57197879A JP S57197879 A JPS57197879 A JP S57197879A JP 56083312 A JP56083312 A JP 56083312A JP 8331281 A JP8331281 A JP 8331281A JP S57197879 A JPS57197879 A JP S57197879A
- Authority
- JP
- Japan
- Prior art keywords
- air
- lead wires
- cooled
- insulative substrate
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 239000000919 ceramic Substances 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
Abstract
PURPOSE:To improve working efficiency in connecting lead wires by a structure wherein contact electrodes corresponding to radial leads of an air-tight tubular body are provided on an insulative substrate having an opening through which the tubular body is inserted, and elastic pieces for pressing the lead wires are also provided thereon. CONSTITUTION:An insertion opening 12, through which an air-tight tubular body including an optoelectric transducer is inserted and enclosed therein, is formed at the center of a first insulative substrate 11, and contact electrodes 13 are disposed at positions corresponding to radial lead wires 3 fixed to a ceramic substrate 4 of the body. (14 denotes lead-out wires and 15 denotes shield electrodes). Then, a second insulative substrate having cutouts at positions corresponding to the contact electrodes 13 and a third insulative substrate having elastic pieces for pressing the lead wires are provided thereby to constitute a lead wire connection structure for an air-cooled optoelectric transducer. By so doing, working efficiency in connecting the lead wires is improved and reliability in connections is also improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56083312A JPS57197879A (en) | 1981-05-29 | 1981-05-29 | Lead wire connection structure for air-cooled optoelectric transducer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56083312A JPS57197879A (en) | 1981-05-29 | 1981-05-29 | Lead wire connection structure for air-cooled optoelectric transducer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57197879A true JPS57197879A (en) | 1982-12-04 |
Family
ID=13798894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56083312A Pending JPS57197879A (en) | 1981-05-29 | 1981-05-29 | Lead wire connection structure for air-cooled optoelectric transducer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57197879A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0136687A2 (en) * | 1983-10-03 | 1985-04-10 | Honeywell Inc. | Infrared receiver |
US5053850A (en) * | 1988-03-14 | 1991-10-01 | Motorola, Inc. | Bonding pad for semiconductor devices |
-
1981
- 1981-05-29 JP JP56083312A patent/JPS57197879A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0136687A2 (en) * | 1983-10-03 | 1985-04-10 | Honeywell Inc. | Infrared receiver |
US5053850A (en) * | 1988-03-14 | 1991-10-01 | Motorola, Inc. | Bonding pad for semiconductor devices |
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