JPS54106170A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54106170A
JPS54106170A JP1370878A JP1370878A JPS54106170A JP S54106170 A JPS54106170 A JP S54106170A JP 1370878 A JP1370878 A JP 1370878A JP 1370878 A JP1370878 A JP 1370878A JP S54106170 A JPS54106170 A JP S54106170A
Authority
JP
Japan
Prior art keywords
terminal
lead wire
connection side
wire connection
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1370878A
Other languages
Japanese (ja)
Inventor
Tadao Kushima
Tomiro Yasuda
Tadashi Sakagami
Kazutoyo Narita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1370878A priority Critical patent/JPS54106170A/en
Publication of JPS54106170A publication Critical patent/JPS54106170A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE:To lessen the stress caused by the expansion and contraction of the lead wire through an extremely simple constitution, and thus to obtain a device featuring a long life to the heat fatigue. CONSTITUTION:Terminal 8a of the lead wire connection side of the terminals buried in terminal holder 7 made of plastics is made thinner than terminal 8b of the external lead wire connection side in order to reduce the stiffness. The manufacture can be facilitated if terminal 8b is made into the double structure. Thus, the stress is lessened, obtaining a device of high reliability.
JP1370878A 1978-02-09 1978-02-09 Semiconductor device Pending JPS54106170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1370878A JPS54106170A (en) 1978-02-09 1978-02-09 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1370878A JPS54106170A (en) 1978-02-09 1978-02-09 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54106170A true JPS54106170A (en) 1979-08-20

Family

ID=11840716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1370878A Pending JPS54106170A (en) 1978-02-09 1978-02-09 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54106170A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04216278A (en) * 1990-12-14 1992-08-06 Fuji Photo Film Co Ltd Radiograph photographing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04216278A (en) * 1990-12-14 1992-08-06 Fuji Photo Film Co Ltd Radiograph photographing device

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