JPS57197410A - Measuring method of adhered amount of high polymer film on metallic plate - Google Patents

Measuring method of adhered amount of high polymer film on metallic plate

Info

Publication number
JPS57197410A
JPS57197410A JP56083171A JP8317181A JPS57197410A JP S57197410 A JPS57197410 A JP S57197410A JP 56083171 A JP56083171 A JP 56083171A JP 8317181 A JP8317181 A JP 8317181A JP S57197410 A JPS57197410 A JP S57197410A
Authority
JP
Japan
Prior art keywords
polymer film
high polymer
rays
radiant
irradiated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56083171A
Other languages
Japanese (ja)
Other versions
JPS6319004B2 (en
Inventor
Naoki Matsuura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rigaku Corp
Original Assignee
Rigaku Industrial Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rigaku Industrial Corp filed Critical Rigaku Industrial Corp
Priority to JP56083171A priority Critical patent/JPS57197410A/en
Publication of JPS57197410A publication Critical patent/JPS57197410A/en
Publication of JPS6319004B2 publication Critical patent/JPS6319004B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
    • G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/633—Specific applications or type of materials thickness, density, surface weight (unit area)

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

PURPOSE:To measure the adhered amount of high polymer film, by irradiating a radiant ray from the side of high polymer film on a metallic plate with the high polymer film, measuring Compton scattering rays for the intensity and processing the result. CONSTITUTION:Radiant rays are irradiated from a radiant source 1 with an angle alpha to a sample 11 to be masured where high polymer film P such as polyvinylchloride is attached to a base metal B such as steel plate, and the Compton scattering rays irradiated with a takeup angle beta are detected with a detector 3. The output is given to an operation circuit 8 via an amplifier 5, a peak wave analyzer 6, and a counting circuit 7. In the operation circuit 8, the attached amount of the high polymer film P can be calculated and displayed on a display 10 with the intensity of irradiated radiant rays IOE, angles alpha, beta, absorption coefficient of the sample to be measured, Compton scattering ray intensity IB and IP from the base metal and the high polymer film, and compensating value to fluorescent X-rays from a radiant ray compensating circuit 9.
JP56083171A 1981-05-29 1981-05-29 Measuring method of adhered amount of high polymer film on metallic plate Granted JPS57197410A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56083171A JPS57197410A (en) 1981-05-29 1981-05-29 Measuring method of adhered amount of high polymer film on metallic plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56083171A JPS57197410A (en) 1981-05-29 1981-05-29 Measuring method of adhered amount of high polymer film on metallic plate

Publications (2)

Publication Number Publication Date
JPS57197410A true JPS57197410A (en) 1982-12-03
JPS6319004B2 JPS6319004B2 (en) 1988-04-21

Family

ID=13794823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56083171A Granted JPS57197410A (en) 1981-05-29 1981-05-29 Measuring method of adhered amount of high polymer film on metallic plate

Country Status (1)

Country Link
JP (1) JPS57197410A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58135407A (en) * 1982-01-22 1983-08-12 Nippon X Sen Kk Method for measuring film thickness
JPS6441810A (en) * 1987-08-07 1989-02-14 Nippon Kokan Kk Method for measuring applied film on metal thickness
EP0359434A2 (en) * 1988-09-09 1990-03-21 Alcatel Canada Wire Inc. Cable insulation eccentricity and diameter monitor
FR2672120A1 (en) * 1991-01-30 1992-07-31 Aerospatiale METHOD AND SYSTEM WITH COMPON EFFECT FOR LOCATING A PLAN SEPARATING FROM TWO MEDIA OF DIFFERENT DENSITY.
JP2001272360A (en) * 2000-01-20 2001-10-05 Kawasaki Steel Corp Method and device for measuring oxygen amount per unit area of steel band amount in internal oxidized layer formed in steel band

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53146655A (en) * 1977-05-26 1978-12-20 Toshiba Corp Thickness abnormality detector of paper form objects

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53146655A (en) * 1977-05-26 1978-12-20 Toshiba Corp Thickness abnormality detector of paper form objects

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58135407A (en) * 1982-01-22 1983-08-12 Nippon X Sen Kk Method for measuring film thickness
JPS6441810A (en) * 1987-08-07 1989-02-14 Nippon Kokan Kk Method for measuring applied film on metal thickness
EP0359434A2 (en) * 1988-09-09 1990-03-21 Alcatel Canada Wire Inc. Cable insulation eccentricity and diameter monitor
FR2672120A1 (en) * 1991-01-30 1992-07-31 Aerospatiale METHOD AND SYSTEM WITH COMPON EFFECT FOR LOCATING A PLAN SEPARATING FROM TWO MEDIA OF DIFFERENT DENSITY.
JP2001272360A (en) * 2000-01-20 2001-10-05 Kawasaki Steel Corp Method and device for measuring oxygen amount per unit area of steel band amount in internal oxidized layer formed in steel band

Also Published As

Publication number Publication date
JPS6319004B2 (en) 1988-04-21

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