JPS57196551A - Cooling structure of high density lsi package - Google Patents

Cooling structure of high density lsi package

Info

Publication number
JPS57196551A
JPS57196551A JP56080177A JP8017781A JPS57196551A JP S57196551 A JPS57196551 A JP S57196551A JP 56080177 A JP56080177 A JP 56080177A JP 8017781 A JP8017781 A JP 8017781A JP S57196551 A JPS57196551 A JP S57196551A
Authority
JP
Japan
Prior art keywords
high density
lsi
package
lsi package
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56080177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6152989B2 (enExample
Inventor
Tsuneaki Tajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56080177A priority Critical patent/JPS57196551A/ja
Publication of JPS57196551A publication Critical patent/JPS57196551A/ja
Publication of JPS6152989B2 publication Critical patent/JPS6152989B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56080177A 1981-05-28 1981-05-28 Cooling structure of high density lsi package Granted JPS57196551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56080177A JPS57196551A (en) 1981-05-28 1981-05-28 Cooling structure of high density lsi package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56080177A JPS57196551A (en) 1981-05-28 1981-05-28 Cooling structure of high density lsi package

Publications (2)

Publication Number Publication Date
JPS57196551A true JPS57196551A (en) 1982-12-02
JPS6152989B2 JPS6152989B2 (enExample) 1986-11-15

Family

ID=13711064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56080177A Granted JPS57196551A (en) 1981-05-28 1981-05-28 Cooling structure of high density lsi package

Country Status (1)

Country Link
JP (1) JPS57196551A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08293573A (ja) * 1995-04-20 1996-11-05 Daimler Benz Ag 超小形冷却装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08293573A (ja) * 1995-04-20 1996-11-05 Daimler Benz Ag 超小形冷却装置及びその製造方法

Also Published As

Publication number Publication date
JPS6152989B2 (enExample) 1986-11-15

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