JPS5780748A - Cooling housing for power semiconductor application device - Google Patents

Cooling housing for power semiconductor application device

Info

Publication number
JPS5780748A
JPS5780748A JP15729680A JP15729680A JPS5780748A JP S5780748 A JPS5780748 A JP S5780748A JP 15729680 A JP15729680 A JP 15729680A JP 15729680 A JP15729680 A JP 15729680A JP S5780748 A JPS5780748 A JP S5780748A
Authority
JP
Japan
Prior art keywords
side faces
heat
housing
power semiconductor
application device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15729680A
Other languages
Japanese (ja)
Inventor
Yasuo Matsuda
Kazuo Honda
Hisakatsu Motowaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15729680A priority Critical patent/JPS5780748A/en
Publication of JPS5780748A publication Critical patent/JPS5780748A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To reduce the size of a power semiconductor application device by transferring the heat generated from semiconductor parts via a heat pipe inserted to the bottom of a housing for the device to a plurality of side faces of the housing to be radiated. CONSTITUTION:A semiconductr module 1 is mounted on the bottom A of a housing. On the bottom surface A are arranged symmetrically with respect to a central point 0 heat pies 4 on the same plane in such a manner that the inserts of the heat pipes 4 is interposed between aluminum plates A1 and A2. Heat pipes 4 rising along the side faces are similarly interposed between cooling fins B1, C1 and aluminum plates B2, C2 at the side faces faced with the side faces B, C. When the heat pipes are thus inserted, the heat generated from the module 1 can be transferred to the side faces to radiate the heat from a plurality of side faces, and the device can be accordingly reduced in size and weight.
JP15729680A 1980-11-08 1980-11-08 Cooling housing for power semiconductor application device Pending JPS5780748A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15729680A JPS5780748A (en) 1980-11-08 1980-11-08 Cooling housing for power semiconductor application device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15729680A JPS5780748A (en) 1980-11-08 1980-11-08 Cooling housing for power semiconductor application device

Publications (1)

Publication Number Publication Date
JPS5780748A true JPS5780748A (en) 1982-05-20

Family

ID=15646556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15729680A Pending JPS5780748A (en) 1980-11-08 1980-11-08 Cooling housing for power semiconductor application device

Country Status (1)

Country Link
JP (1) JPS5780748A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1010054A1 (en) * 1997-08-27 2000-06-21 Intel Corporation Apparatus for managing heat in a computer environment or the like
JP2015053311A (en) * 2013-09-05 2015-03-19 パナソニック株式会社 Cooling system
WO2017061408A1 (en) * 2015-10-08 2017-04-13 古河電気工業株式会社 Heat sink
JP2019029551A (en) * 2017-08-01 2019-02-21 富士電機株式会社 Power converter for railway car

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1010054A1 (en) * 1997-08-27 2000-06-21 Intel Corporation Apparatus for managing heat in a computer environment or the like
EP1010054A4 (en) * 1997-08-27 2007-12-26 Intel Corp Apparatus for managing heat in a computer environment or the like
JP2015053311A (en) * 2013-09-05 2015-03-19 パナソニック株式会社 Cooling system
WO2017061408A1 (en) * 2015-10-08 2017-04-13 古河電気工業株式会社 Heat sink
JPWO2017061408A1 (en) * 2015-10-08 2018-07-26 古河電気工業株式会社 heatsink
US11287192B2 (en) 2015-10-08 2022-03-29 Furukawa Electric Co., Ltd. Heat sink
JP2019029551A (en) * 2017-08-01 2019-02-21 富士電機株式会社 Power converter for railway car

Similar Documents

Publication Publication Date Title
KR900003611B1 (en) Semiconductor device
US20150234438A1 (en) Cooler for Computing modules of a Computer
JPS5780748A (en) Cooling housing for power semiconductor application device
GB1414908A (en) Spaceheating apparatus
ES8701966A1 (en) Element basket assembly for heat exchanger.
JPS57107063A (en) Semiconductor package
JPS5729883A (en) Pipe joint with cooling fin
ES457141A1 (en) Heat exchanger
CN217922331U (en) Oil-cooled potentiostat
EP0281404A3 (en) Cooling system for electronic equipment
JPS5540225A (en) Controller for heat engine
JPS56147457A (en) Vapor cooling type semiconductor device
JPS6355966A (en) Heat radiator of integrated circuit module
FR2452078A1 (en) Radiator for heat rejection cooling - has parallel heat carrying ducts cross connected by others for balancing
JPS6432699A (en) Cooling structure of printed wiring board
JPS645045A (en) Cooling structure for integrated circuit package
JPH0447998Y2 (en)
JPS571247A (en) Fin
JPS5513918A (en) Radiator
JPS6459895A (en) Electronic part mounting device
JPS5743448A (en) Electronically cooled amplifier
JPS5765523A (en) Heat pipe
UA14408A1 (en) Converter installation
JPS51150237A (en) Pachage
JPS57122553A (en) Self-cooling type semiconductor device