JPS571247A - Fin - Google Patents

Fin

Info

Publication number
JPS571247A
JPS571247A JP7281280A JP7281280A JPS571247A JP S571247 A JPS571247 A JP S571247A JP 7281280 A JP7281280 A JP 7281280A JP 7281280 A JP7281280 A JP 7281280A JP S571247 A JPS571247 A JP S571247A
Authority
JP
Japan
Prior art keywords
fin
boss
plate
transfer rate
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7281280A
Other languages
Japanese (ja)
Inventor
Yutaka Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7281280A priority Critical patent/JPS571247A/en
Publication of JPS571247A publication Critical patent/JPS571247A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To form rapid current of cooling fluid even in the rear current of a boss, and to hold a high heat transfer rate by a method wherein guide vanes are provided on the plate of an auxiliary fin. CONSTITUTION:A flat element is placed between both the side fins, and generated heat in the element passes the boss of the main fin 3 and is transferred from the plate of the auxiliary fin 4 to the circumferential fluid. When the guide vanes 5 are provided on the fin plate, a dead water region is not generated in the rear of the boss, average heat transfer rate is enhanced, and cooling capacity of the fin can be enlarged remarkably.
JP7281280A 1980-06-02 1980-06-02 Fin Pending JPS571247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7281280A JPS571247A (en) 1980-06-02 1980-06-02 Fin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7281280A JPS571247A (en) 1980-06-02 1980-06-02 Fin

Publications (1)

Publication Number Publication Date
JPS571247A true JPS571247A (en) 1982-01-06

Family

ID=13500184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7281280A Pending JPS571247A (en) 1980-06-02 1980-06-02 Fin

Country Status (1)

Country Link
JP (1) JPS571247A (en)

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