JPS5743448A - Electronically cooled amplifier - Google Patents
Electronically cooled amplifierInfo
- Publication number
- JPS5743448A JPS5743448A JP55119302A JP11930280A JPS5743448A JP S5743448 A JPS5743448 A JP S5743448A JP 55119302 A JP55119302 A JP 55119302A JP 11930280 A JP11930280 A JP 11930280A JP S5743448 A JPS5743448 A JP S5743448A
- Authority
- JP
- Japan
- Prior art keywords
- amplifier
- heat
- metallic foil
- conductor
- grounding conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Amplifiers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
PURPOSE:To efficiently cool an amplifier with a small-sized electronic cooler by forming a part of the grounding conductor of the amplifier in a metallic foil and cooling the amplifier through the metallic foil, thereby preventing the transfer of heat to the entire grounding conductor. CONSTITUTION:A part of a grounding conductor 12 is formed of a metallic foil 10. The heat of an amplifier 8 is transferred through a heat conductor 13, the metallic foil 10 and a heat conductor 14 to an electronic cooler 9, and is thus heated. Since the foil 10 is extremely thin, the heat from the amplifier 8 can not be transmitted to the entire grounding conductor, thereby efficiently cooling the amplifier.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55119302A JPS5743448A (en) | 1980-08-29 | 1980-08-29 | Electronically cooled amplifier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55119302A JPS5743448A (en) | 1980-08-29 | 1980-08-29 | Electronically cooled amplifier |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5743448A true JPS5743448A (en) | 1982-03-11 |
JPS6131621B2 JPS6131621B2 (en) | 1986-07-21 |
Family
ID=14758049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55119302A Granted JPS5743448A (en) | 1980-08-29 | 1980-08-29 | Electronically cooled amplifier |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5743448A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980996A (en) * | 1982-10-30 | 1984-05-10 | 株式会社島津製作所 | Circuit device using printed board |
-
1980
- 1980-08-29 JP JP55119302A patent/JPS5743448A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980996A (en) * | 1982-10-30 | 1984-05-10 | 株式会社島津製作所 | Circuit device using printed board |
Also Published As
Publication number | Publication date |
---|---|
JPS6131621B2 (en) | 1986-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0327336A3 (en) | Electronic devices incorporating carbon films | |
GB2036170B (en) | Cooled engine valve with heat transfer | |
JPS5664289A (en) | Cooler | |
JPS5743448A (en) | Electronically cooled amplifier | |
GB1021230A (en) | Improvements relating to transistor amplifiers | |
JPS53113354A (en) | Thermostatic oven for electronic cooling | |
GB1365877A (en) | Electronic circuit assemblies | |
JPS53126918A (en) | Speaker system | |
EP0281404A3 (en) | Cooling system for electronic equipment | |
JPS6472430A (en) | Enclosed switchboard | |
JPS52132701A (en) | Console containing electronic equipment | |
ZA958912B (en) | An ecological thermoelectric cooling system | |
ES462067A1 (en) | A heat evacuating cápsula with electronic component. (Machine-translation by Google Translate, not legally binding) | |
JPS5780748A (en) | Cooling housing for power semiconductor application device | |
JPS549048A (en) | Heat exchanger, thermosiphon, and production of thermosiphon | |
JPS5413036A (en) | Induction heatiang device | |
JPS53112483A (en) | Forcedly cooled power cable | |
JPS53457A (en) | Cooling device of ebullition type | |
JPS55134952A (en) | Mounting of ic package | |
ES8507731A1 (en) | Raised core-forming vapour deposition surface band and cooling of electronic subassemblies | |
JPS645045A (en) | Cooling structure for integrated circuit package | |
JPS5236247A (en) | Magnetic corpuscular type electromagnetic coupling | |
JPS57105684A (en) | Device for heat transfer | |
FR2337483A1 (en) | Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces | |
JPS5472552A (en) | Heat exchanger |