JPS5743448A - Electronically cooled amplifier - Google Patents

Electronically cooled amplifier

Info

Publication number
JPS5743448A
JPS5743448A JP55119302A JP11930280A JPS5743448A JP S5743448 A JPS5743448 A JP S5743448A JP 55119302 A JP55119302 A JP 55119302A JP 11930280 A JP11930280 A JP 11930280A JP S5743448 A JPS5743448 A JP S5743448A
Authority
JP
Japan
Prior art keywords
amplifier
heat
metallic foil
conductor
grounding conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55119302A
Other languages
Japanese (ja)
Other versions
JPS6131621B2 (en
Inventor
Kazuhisa Akinaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55119302A priority Critical patent/JPS5743448A/en
Publication of JPS5743448A publication Critical patent/JPS5743448A/en
Publication of JPS6131621B2 publication Critical patent/JPS6131621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Amplifiers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To efficiently cool an amplifier with a small-sized electronic cooler by forming a part of the grounding conductor of the amplifier in a metallic foil and cooling the amplifier through the metallic foil, thereby preventing the transfer of heat to the entire grounding conductor. CONSTITUTION:A part of a grounding conductor 12 is formed of a metallic foil 10. The heat of an amplifier 8 is transferred through a heat conductor 13, the metallic foil 10 and a heat conductor 14 to an electronic cooler 9, and is thus heated. Since the foil 10 is extremely thin, the heat from the amplifier 8 can not be transmitted to the entire grounding conductor, thereby efficiently cooling the amplifier.
JP55119302A 1980-08-29 1980-08-29 Electronically cooled amplifier Granted JPS5743448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55119302A JPS5743448A (en) 1980-08-29 1980-08-29 Electronically cooled amplifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55119302A JPS5743448A (en) 1980-08-29 1980-08-29 Electronically cooled amplifier

Publications (2)

Publication Number Publication Date
JPS5743448A true JPS5743448A (en) 1982-03-11
JPS6131621B2 JPS6131621B2 (en) 1986-07-21

Family

ID=14758049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55119302A Granted JPS5743448A (en) 1980-08-29 1980-08-29 Electronically cooled amplifier

Country Status (1)

Country Link
JP (1) JPS5743448A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980996A (en) * 1982-10-30 1984-05-10 株式会社島津製作所 Circuit device using printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980996A (en) * 1982-10-30 1984-05-10 株式会社島津製作所 Circuit device using printed board

Also Published As

Publication number Publication date
JPS6131621B2 (en) 1986-07-21

Similar Documents

Publication Publication Date Title
EP0327336A3 (en) Electronic devices incorporating carbon films
GB2036170B (en) Cooled engine valve with heat transfer
JPS5664289A (en) Cooler
JPS5743448A (en) Electronically cooled amplifier
GB1021230A (en) Improvements relating to transistor amplifiers
JPS53113354A (en) Thermostatic oven for electronic cooling
GB1365877A (en) Electronic circuit assemblies
JPS53126918A (en) Speaker system
EP0281404A3 (en) Cooling system for electronic equipment
JPS6472430A (en) Enclosed switchboard
JPS52132701A (en) Console containing electronic equipment
ZA958912B (en) An ecological thermoelectric cooling system
ES462067A1 (en) A heat evacuating cápsula with electronic component. (Machine-translation by Google Translate, not legally binding)
JPS5780748A (en) Cooling housing for power semiconductor application device
JPS549048A (en) Heat exchanger, thermosiphon, and production of thermosiphon
JPS5413036A (en) Induction heatiang device
JPS53112483A (en) Forcedly cooled power cable
JPS53457A (en) Cooling device of ebullition type
JPS55134952A (en) Mounting of ic package
ES8507731A1 (en) Raised core-forming vapour deposition surface band and cooling of electronic subassemblies
JPS645045A (en) Cooling structure for integrated circuit package
JPS5236247A (en) Magnetic corpuscular type electromagnetic coupling
JPS57105684A (en) Device for heat transfer
FR2337483A1 (en) Heat dissipation system on electric equipment - uses dielectric coolant which evaporates from equipment and condenses on cooled surfaces
JPS5472552A (en) Heat exchanger