JPS6355966A - Heat radiator of integrated circuit module - Google Patents

Abstract

PURPOSE:To prevent damage of an integrated circuit due to heat, by connecting a heat conductor block and a heat radiating block with solder, and making it possible to transfer the heat from the heat conductor block to the heat radiating block sufficiently. CONSTITUTION:A heat conductor block 1 is attached to an integrated circuit 4, which is mounted on a printed board 3, and conducts heat yielded in the circuit 4. Meanwhile, heat radiating blocks 2 radiate the heat which is conducted through the heat conductor blocks 1 and 1 to the outside. Recess parts 5 and 5 are formed at the positions corresponding to the heat conductor blocks 1. The recess parts 5 and 5 have the size so as to accommodate the entire heat conductor block 1. The block 1 is inserted into each recess part 5. A solder 6 is provided between the heat conductor block 1 and the block 2. Thus the block 1 is connected to the block 2 with soldering. Therefore, heat conduction efficiency between the blocks 1 and 2 becomes high, and the heat is sufficiently transferred from the block 1 to the block 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat dissipation device for an integrated circuit module, and more particularly to a heat dissipation device for an integrated circuit module using a heat conductive member in the integrated circuit module.

[Conventional technology]

Conventionally, a heat dissipation device for an integrated circuit module of this type consists of a heat conduction block 50, 50 and a heat dissipation block 51, as shown in FIG. 2, for example. The heat conduction block 50 is attached to an integrated circuit 53 mounted on a printed circuit board 52 and conducts heat generated in the integrated circuit 53. On the other hand, the heat dissipation block 54 has a hole 54 formed at a position corresponding to the heat conduction block 50, and the heat conduction block 50 is fitted into the hole 54. The heat radiation block 51 radiates the heat transferred from the heat conduction block 50 to the outside.

[Problems to be solved]

However, in the conventional technology described above, heat conduction depends on the contact pressure between the heat conduction block 50 and the heat radiation block 51, so the heat conduction efficiency is low and heat cannot be radiated sufficiently.
There is a problem that the integrated circuit 53 is easily damaged.

Furthermore, in order to obtain a certain heat conduction efficiency, it is necessary to fit the heat conduction block 50 and the heat radiation block 51 to obtain a certain contact pressure, so the processing accuracy of the heat conduction block 50 and the heat radiation block 51 is There is a problem in that it is necessary to increase the temperature and also to perform precise installation, which makes processing and installation extremely complicated.

The present invention has been made in view of the above-mentioned problems of the prior art, and can prevent damage to integrated circuits by increasing the heat conduction efficiency between the heat conduction block and the heat dissipation block and dissipating the heat sufficiently. An object of the present invention is to provide a heat dissipation device for an integrated circuit module that allows easy processing and attachment of blocks and heat dissipation blocks.

[Means for solving problems]

For this reason, the present invention includes a heat conduction block that is attached to an integrated circuit mounted on a printed circuit board and conducts heat generated in the integrated circuit, and a heat radiation block that radiates heat from the heat conduction block to the outside. In a heat dissipation device for an integrated circuit module, a configuration is adopted in which the heat conduction block and the heat dissipation block are connected by soldering, thereby achieving the above object.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG.

The heat dissipation device for the integrated circuit module of this embodiment includes heat conduction blocks 1, 1 and a heat dissipation block 2.

The heat conduction block 1 is attached to an integrated circuit 4 mounted on a printed circuit board 3 and conducts heat generated in the integrated circuit 4.

On the other hand, the heat dissipation block 2 is for discharging the heat transferred from the heat conduction block 1.1 to the outside.
Recesses 5, 5 are formed at positions corresponding to . These recesses 5, 5 have a size that allows the entire heat conduction block 1 to be inserted therein. The heat conduction block 1 is fitted into the recess 5 and connected to the heat dissipation block 2 by soldering by interposing the solder 6 between the heat conduction block 1 and the heat dissipation block 2.

That is, according to this embodiment, since the solder 6 has a high heat conduction efficiency, the heat conduction efficiency between the heat conduction block 1 and the heat radiation block 2 is high, and sufficient heat is transferred from the heat conduction block 1 to the heat radiation block 2. Begins to communicate. In addition, since the heat conduction block 1 and the heat dissipation block 2 are connected by soldering, there is no need to obtain a constant contact pressure by fitting as in the conventional case. Installation can be done easily. Furthermore, in this embodiment, since the recess 5 is large enough to allow the entire heat conduction block l to be inserted, it is possible to insert not only the side surface but also the top surface of the heat conduction block 1, compared to the conventional case where the heat conduction block l is inserted into the hole. The heat dissipation effect is further improved because heat is conducted from the inside. However, in the present invention, the heat conduction block 1 is placed inside the recess 5.
The heat conduction block 1 is not limited to being inserted into the hole, but a hole may be formed and the heat conduction block 1 may be connected to the hole by soldering.

〔Effect of the invention〕

As described above, in the present invention, since the heat conduction block and the heat radiation block are connected by soldering, the heat conduction efficiency between the heat conduction block and the heat radiation block is increased, and heat is transferred from the heat conduction block to the heat radiation block. Sufficient transmission is possible, the heat dissipation effect is improved, and damage to the integrated circuit can be prevented.

Moreover, since the connection is made by soldering, there is no need to obtain a constant contact pressure by fitting as in the conventional case, so processing and attachment of the heat conduction block and the heat radiation block can be easily performed.

[Brief explanation of drawings]

FIG. 1 is a vertical sectional view showing one embodiment of the present invention, and FIG.
FIG. 3 is a vertical cross-sectional view of a conventional example. 1: Heat conduction block 2: Heat dissipation block 3 Niblint board 4: Integrated circuit 5: Recess 6: Handa attorney Patent attorney Mura 1) Yu Miki Figure 1 b5 Tatsumi Dt

Claims (1)

[Claims] Consisting of a heat conduction block that is attached to an integrated circuit mounted on a printed circuit board and that conducts heat generated in the integrated circuit, and a heat radiation block that radiates heat from the heat conduction block to the outside. A heat dissipation device for an integrated circuit module, characterized in that the heat conduction block and the heat dissipation block are connected by soldering.