JPS57194547A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57194547A
JPS57194547A JP7939081A JP7939081A JPS57194547A JP S57194547 A JPS57194547 A JP S57194547A JP 7939081 A JP7939081 A JP 7939081A JP 7939081 A JP7939081 A JP 7939081A JP S57194547 A JPS57194547 A JP S57194547A
Authority
JP
Japan
Prior art keywords
oxide film
layer
film
si3n4
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7939081A
Other languages
Japanese (ja)
Inventor
Kenichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP7939081A priority Critical patent/JPS57194547A/en
Publication of JPS57194547A publication Critical patent/JPS57194547A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76205Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region

Abstract

PURPOSE:To obtain the oxide film isolated structure without having an isolation leak for the titled device by a method wherein an oxide film is formed in the groove, on which an etching was performed using an Si3N4 film as a mask, and a heat treatment is performed in a nitrogenous atmosphere in the state wherein the oxide film is left over by ion implantation performed through the oxide film. CONSTITUTION:An Si3N4 layer 15 is provided on the epitaxial layer 13 of a single crystal Si substrate 11 through the intermediary of a thin SiO2 layer 14, and a groove 16 is formed by performing an etching using the layer 15 as a mask. Then, a thin oxide film 17 is formed in the exposed groove 16, an ion is implanted in the groove through the film 17 using the Si3N4 film 15 as a mask, and after an inversion preventing layer 18 has been formed by performing a heat treatment in a nitrogenous atmosphere in the state wherein an oxide film 17 is left over, an insulation isolated layer 19 is formed by performing an oxidation, and an oxide film isolated structure is obtained by removing the Si3N4-film 15. Accordingly, as the contact of the silicon surface and the high- temperature nitrogenous gas is cut off by the oxide film, the generation of crystal defect and the segregation of injected impurities can be prevented, thereby enabling to obtain an excellent oxide film isolated structure without having an isolation leak.
JP7939081A 1981-05-27 1981-05-27 Manufacture of semiconductor device Pending JPS57194547A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7939081A JPS57194547A (en) 1981-05-27 1981-05-27 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7939081A JPS57194547A (en) 1981-05-27 1981-05-27 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57194547A true JPS57194547A (en) 1982-11-30

Family

ID=13688529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7939081A Pending JPS57194547A (en) 1981-05-27 1981-05-27 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57194547A (en)

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