JPS57192262A - Spatter apparatus - Google Patents
Spatter apparatusInfo
- Publication number
- JPS57192262A JPS57192262A JP7744181A JP7744181A JPS57192262A JP S57192262 A JPS57192262 A JP S57192262A JP 7744181 A JP7744181 A JP 7744181A JP 7744181 A JP7744181 A JP 7744181A JP S57192262 A JPS57192262 A JP S57192262A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- target
- film
- thickness distribution
- film thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7744181A JPS57192262A (en) | 1981-05-21 | 1981-05-21 | Spatter apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7744181A JPS57192262A (en) | 1981-05-21 | 1981-05-21 | Spatter apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57192262A true JPS57192262A (en) | 1982-11-26 |
JPS6352110B2 JPS6352110B2 (ja) | 1988-10-18 |
Family
ID=13634107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7744181A Granted JPS57192262A (en) | 1981-05-21 | 1981-05-21 | Spatter apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57192262A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5861461U (ja) * | 1981-10-19 | 1983-04-25 | 富士通株式会社 | スパツタリング装置 |
EP0439361A2 (en) * | 1990-01-26 | 1991-07-31 | Varian Associates, Inc. | Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5560869U (ja) * | 1978-10-20 | 1980-04-25 |
-
1981
- 1981-05-21 JP JP7744181A patent/JPS57192262A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5560869U (ja) * | 1978-10-20 | 1980-04-25 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5861461U (ja) * | 1981-10-19 | 1983-04-25 | 富士通株式会社 | スパツタリング装置 |
EP0439361A2 (en) * | 1990-01-26 | 1991-07-31 | Varian Associates, Inc. | Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile |
Also Published As
Publication number | Publication date |
---|---|
JPS6352110B2 (ja) | 1988-10-18 |
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