JPS57190018A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS57190018A JPS57190018A JP7618781A JP7618781A JPS57190018A JP S57190018 A JPS57190018 A JP S57190018A JP 7618781 A JP7618781 A JP 7618781A JP 7618781 A JP7618781 A JP 7618781A JP S57190018 A JPS57190018 A JP S57190018A
- Authority
- JP
- Japan
- Prior art keywords
- component
- epoxy resin
- resin composition
- imidazole
- derivative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 6
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical class CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 abstract 2
- 150000008065 acid anhydrides Chemical class 0.000 abstract 2
- 125000003700 epoxy group Chemical group 0.000 abstract 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 abstract 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 abstract 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
Landscapes
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7618781A JPS57190018A (en) | 1981-05-19 | 1981-05-19 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7618781A JPS57190018A (en) | 1981-05-19 | 1981-05-19 | Epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57190018A true JPS57190018A (en) | 1982-11-22 |
JPS6136850B2 JPS6136850B2 (enrdf_load_stackoverflow) | 1986-08-20 |
Family
ID=13598116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7618781A Granted JPS57190018A (en) | 1981-05-19 | 1981-05-19 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57190018A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8308970B2 (en) | 2003-07-11 | 2012-11-13 | Ube Industries, Ltd. | Acid-base mixture and ion conductor comprising the same |
JP2019524967A (ja) * | 2016-08-15 | 2019-09-05 | エボニック デグサ ゲーエムベーハーEvonik Degussa GmbH | エポキシ樹脂系用のイミダゾール塩添加剤を含有する酸無水物エポキシ硬化剤 |
JP2020501000A (ja) * | 2016-12-12 | 2020-01-16 | エボニック デグサ ゲーエムベーハーEvonik Degussa GmbH | 新規な低温酸無水物エポキシ硬化系 |
-
1981
- 1981-05-19 JP JP7618781A patent/JPS57190018A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8308970B2 (en) | 2003-07-11 | 2012-11-13 | Ube Industries, Ltd. | Acid-base mixture and ion conductor comprising the same |
JP2019524967A (ja) * | 2016-08-15 | 2019-09-05 | エボニック デグサ ゲーエムベーハーEvonik Degussa GmbH | エポキシ樹脂系用のイミダゾール塩添加剤を含有する酸無水物エポキシ硬化剤 |
JP2020501000A (ja) * | 2016-12-12 | 2020-01-16 | エボニック デグサ ゲーエムベーハーEvonik Degussa GmbH | 新規な低温酸無水物エポキシ硬化系 |
US11286336B2 (en) | 2016-12-12 | 2022-03-29 | Evonik Operations Gmbh | Low temperature anhydride epoxy cured systems |
Also Published As
Publication number | Publication date |
---|---|
JPS6136850B2 (enrdf_load_stackoverflow) | 1986-08-20 |
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