JPS5718349A - Manufacture of electronic circuit device - Google Patents

Manufacture of electronic circuit device

Info

Publication number
JPS5718349A
JPS5718349A JP9449380A JP9449380A JPS5718349A JP S5718349 A JPS5718349 A JP S5718349A JP 9449380 A JP9449380 A JP 9449380A JP 9449380 A JP9449380 A JP 9449380A JP S5718349 A JPS5718349 A JP S5718349A
Authority
JP
Japan
Prior art keywords
film
frame body
metal frame
resin
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9449380A
Other languages
Japanese (ja)
Other versions
JPS6342878B2 (en
Inventor
Hiroaki Fujimoto
Masaharu Noyori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9449380A priority Critical patent/JPS5718349A/en
Publication of JPS5718349A publication Critical patent/JPS5718349A/en
Publication of JPS6342878B2 publication Critical patent/JPS6342878B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To maintain the flatness of a substrate, to form a minute wiring and to attain equipment in high density of an electronic circuit device by a method wherein an electronic parts is fixed to the substrate consisted of a resin film and a metal frame body, and the electronic parts in sealed with a resin in the condition being the metal frame body held horizontal by a magnet or by vacuum drawing, etc. CONSTITUTION:The resin film 22 having an adhesive layer 23 is fixed to the metal frame body 21. Penetrating holes 24 are formed in the film 22. The position of electrodes 25' of a chip capacitor 25 and the penetrating holes are made to coincide, the metal frame body 21 is held through the film 22 by the magnet 32 fixed to the film 22, and the film 22 is held horizontally to prevent protrusion of the metal frame body 21. A vacuum drawing pedestal 23 may be used as a substitute for the magnet. The capacitor 25 is sealed with the resin 31 in this condition. Accordingly fault of short-circuit can be prevented, and the mounting with high precision and high density can be attained.
JP9449380A 1980-07-09 1980-07-09 Manufacture of electronic circuit device Granted JPS5718349A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9449380A JPS5718349A (en) 1980-07-09 1980-07-09 Manufacture of electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9449380A JPS5718349A (en) 1980-07-09 1980-07-09 Manufacture of electronic circuit device

Publications (2)

Publication Number Publication Date
JPS5718349A true JPS5718349A (en) 1982-01-30
JPS6342878B2 JPS6342878B2 (en) 1988-08-25

Family

ID=14111816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9449380A Granted JPS5718349A (en) 1980-07-09 1980-07-09 Manufacture of electronic circuit device

Country Status (1)

Country Link
JP (1) JPS5718349A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6164187A (en) * 1984-09-06 1986-04-02 松下電器産業株式会社 Method of producing electronic circuit device
JPH04158596A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Electronic parts mounting method and electronic parts mounting board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6164187A (en) * 1984-09-06 1986-04-02 松下電器産業株式会社 Method of producing electronic circuit device
JPH04158596A (en) * 1990-10-22 1992-06-01 Kokusai Electric Co Ltd Electronic parts mounting method and electronic parts mounting board

Also Published As

Publication number Publication date
JPS6342878B2 (en) 1988-08-25

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