JPS57183059A - Package for electronic parts - Google Patents

Package for electronic parts

Info

Publication number
JPS57183059A
JPS57183059A JP56069558A JP6955881A JPS57183059A JP S57183059 A JPS57183059 A JP S57183059A JP 56069558 A JP56069558 A JP 56069558A JP 6955881 A JP6955881 A JP 6955881A JP S57183059 A JPS57183059 A JP S57183059A
Authority
JP
Japan
Prior art keywords
heat conductivity
high heat
package
substrate
movable piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56069558A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6236639B2 (cg-RX-API-DMAC10.html
Inventor
Takashi Kondo
Hiroshi Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56069558A priority Critical patent/JPS57183059A/ja
Publication of JPS57183059A publication Critical patent/JPS57183059A/ja
Publication of JPS6236639B2 publication Critical patent/JPS6236639B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/77—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/877—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56069558A 1981-05-06 1981-05-06 Package for electronic parts Granted JPS57183059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56069558A JPS57183059A (en) 1981-05-06 1981-05-06 Package for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56069558A JPS57183059A (en) 1981-05-06 1981-05-06 Package for electronic parts

Publications (2)

Publication Number Publication Date
JPS57183059A true JPS57183059A (en) 1982-11-11
JPS6236639B2 JPS6236639B2 (cg-RX-API-DMAC10.html) 1987-08-07

Family

ID=13406192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56069558A Granted JPS57183059A (en) 1981-05-06 1981-05-06 Package for electronic parts

Country Status (1)

Country Link
JP (1) JPS57183059A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196854U (ja) * 1982-06-24 1983-12-27 パイオニア株式会社 Ｉｃ放熱器
FR2569306A1 (fr) * 1984-08-17 1986-02-21 Nec Corp Dispositif de refroidissement pour circuits integres
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US20100133685A1 (en) * 2006-11-21 2010-06-03 The Boeing Company Direct semiconductor contact ebullient cooling package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS566460A (en) * 1979-06-29 1981-01-23 Ibm Multi chip module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS566460A (en) * 1979-06-29 1981-01-23 Ibm Multi chip module

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196854U (ja) * 1982-06-24 1983-12-27 パイオニア株式会社 Ｉｃ放熱器
FR2569306A1 (fr) * 1984-08-17 1986-02-21 Nec Corp Dispositif de refroidissement pour circuits integres
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US20100133685A1 (en) * 2006-11-21 2010-06-03 The Boeing Company Direct semiconductor contact ebullient cooling package
US8592971B2 (en) * 2006-11-21 2013-11-26 The Boeing Company Direct semiconductor contact ebullient cooling package
US20140048236A1 (en) * 2006-11-21 2014-02-20 The Boeing Company Direct semiconductor contact ebullient cooling package
US8937383B2 (en) 2006-11-21 2015-01-20 The Boeing Company Direct semiconductor contact ebullient cooling package

Also Published As

Publication number Publication date
JPS6236639B2 (cg-RX-API-DMAC10.html) 1987-08-07

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