JPS57175448U - - Google Patents

Info

Publication number
JPS57175448U
JPS57175448U JP1981064307U JP6430781U JPS57175448U JP S57175448 U JPS57175448 U JP S57175448U JP 1981064307 U JP1981064307 U JP 1981064307U JP 6430781 U JP6430781 U JP 6430781U JP S57175448 U JPS57175448 U JP S57175448U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981064307U
Other languages
Japanese (ja)
Other versions
JPS6225905Y2 (
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981064307U priority Critical patent/JPS6225905Y2/ja
Publication of JPS57175448U publication Critical patent/JPS57175448U/ja
Application granted granted Critical
Publication of JPS6225905Y2 publication Critical patent/JPS6225905Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1981064307U 1981-04-30 1981-04-30 Expired JPS6225905Y2 ( )

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981064307U JPS6225905Y2 ( ) 1981-04-30 1981-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981064307U JPS6225905Y2 ( ) 1981-04-30 1981-04-30

Publications (2)

Publication Number Publication Date
JPS57175448U true JPS57175448U ( ) 1982-11-05
JPS6225905Y2 JPS6225905Y2 ( ) 1987-07-02

Family

ID=29860379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981064307U Expired JPS6225905Y2 ( ) 1981-04-30 1981-04-30

Country Status (1)

Country Link
JP (1) JPS6225905Y2 ( )

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134570A (ja) * 1983-01-24 1984-08-02 Shin Kobe Electric Mach Co Ltd 燃料電池構造
JPS59117156U (ja) * 1983-01-26 1984-08-07 サンケン電気株式会社 絶縁物封止半導体装置
JPS6164212A (ja) * 1984-09-05 1986-04-02 ユニチカ株式会社 布団用硬綿の製造方法
JPS61102048U ( ) * 1984-12-10 1986-06-28
JPS6371548U ( ) * 1987-10-02 1988-05-13
JPS63315041A (ja) * 1987-06-19 1988-12-22 Olympus Optical Co Ltd 内視鏡チャンネル插通型超音波プロ−ブ
JP2011077215A (ja) * 2009-09-30 2011-04-14 Shindengen Electric Mfg Co Ltd 半導体パッケージ
JP2015008309A (ja) * 2014-08-08 2015-01-15 株式会社鷺宮製作所 モールドコイルおよびモールドコイルを用いた電磁弁
JP2019140398A (ja) * 2019-04-01 2019-08-22 ローム株式会社 パワーモジュールおよびその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036074A ( ) * 1973-07-20 1975-04-04
JPS5149960U ( ) * 1974-10-14 1976-04-15
JPS5541022A (en) * 1978-09-15 1980-03-22 Matsushita Electric Works Ltd Photo oscillation circuit
JPS55160449A (en) * 1979-05-31 1980-12-13 Toshiba Corp Semiconductor device
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS613100A (ja) * 1984-06-18 1986-01-09 富士写真フイルム株式会社 放射線増感紙

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036074A ( ) * 1973-07-20 1975-04-04
JPS5149960U ( ) * 1974-10-14 1976-04-15
JPS5541022A (en) * 1978-09-15 1980-03-22 Matsushita Electric Works Ltd Photo oscillation circuit
JPS55160449A (en) * 1979-05-31 1980-12-13 Toshiba Corp Semiconductor device
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS613100A (ja) * 1984-06-18 1986-01-09 富士写真フイルム株式会社 放射線増感紙

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134570A (ja) * 1983-01-24 1984-08-02 Shin Kobe Electric Mach Co Ltd 燃料電池構造
JPS59117156U (ja) * 1983-01-26 1984-08-07 サンケン電気株式会社 絶縁物封止半導体装置
JPS6164212A (ja) * 1984-09-05 1986-04-02 ユニチカ株式会社 布団用硬綿の製造方法
JPS61102048U ( ) * 1984-12-10 1986-06-28
JPS63315041A (ja) * 1987-06-19 1988-12-22 Olympus Optical Co Ltd 内視鏡チャンネル插通型超音波プロ−ブ
JPS6371548U ( ) * 1987-10-02 1988-05-13
JP2011077215A (ja) * 2009-09-30 2011-04-14 Shindengen Electric Mfg Co Ltd 半導体パッケージ
JP2015008309A (ja) * 2014-08-08 2015-01-15 株式会社鷺宮製作所 モールドコイルおよびモールドコイルを用いた電磁弁
JP2019140398A (ja) * 2019-04-01 2019-08-22 ローム株式会社 パワーモジュールおよびその製造方法

Also Published As

Publication number Publication date
JPS6225905Y2 ( ) 1987-07-02

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