JPS61102048U - - Google Patents

Info

Publication number
JPS61102048U
JPS61102048U JP1984187130U JP18713084U JPS61102048U JP S61102048 U JPS61102048 U JP S61102048U JP 1984187130 U JP1984187130 U JP 1984187130U JP 18713084 U JP18713084 U JP 18713084U JP S61102048 U JPS61102048 U JP S61102048U
Authority
JP
Japan
Prior art keywords
semiconductor chip
heat sink
resin
thin
partially
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984187130U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334913Y2 (
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984187130U priority Critical patent/JPH0334913Y2/ja
Publication of JPS61102048U publication Critical patent/JPS61102048U/ja
Application granted granted Critical
Publication of JPH0334913Y2 publication Critical patent/JPH0334913Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1984187130U 1984-12-10 1984-12-10 Expired JPH0334913Y2 ( )

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984187130U JPH0334913Y2 ( ) 1984-12-10 1984-12-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984187130U JPH0334913Y2 ( ) 1984-12-10 1984-12-10

Publications (2)

Publication Number Publication Date
JPS61102048U true JPS61102048U ( ) 1986-06-28
JPH0334913Y2 JPH0334913Y2 ( ) 1991-07-24

Family

ID=30744595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984187130U Expired JPH0334913Y2 ( ) 1984-12-10 1984-12-10

Country Status (1)

Country Link
JP (1) JPH0334913Y2 ( )

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175448U ( ) * 1981-04-30 1982-11-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175448U ( ) * 1981-04-30 1982-11-05

Also Published As

Publication number Publication date
JPH0334913Y2 ( ) 1991-07-24

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