JPS57174488A - High speed plating device - Google Patents

High speed plating device

Info

Publication number
JPS57174488A
JPS57174488A JP5994881A JP5994881A JPS57174488A JP S57174488 A JPS57174488 A JP S57174488A JP 5994881 A JP5994881 A JP 5994881A JP 5994881 A JP5994881 A JP 5994881A JP S57174488 A JPS57174488 A JP S57174488A
Authority
JP
Japan
Prior art keywords
electrode
tank
grasping
members
grasped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5994881A
Other languages
Japanese (ja)
Inventor
Masaaki Isobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP5994881A priority Critical patent/JPS57174488A/en
Priority to DE1982101642 priority patent/DE63226T1/en
Priority to EP82101642A priority patent/EP0063226A1/en
Publication of JPS57174488A publication Critical patent/JPS57174488A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE: To plate the inside surfaces of though-holes automatically and efficiently by grasping the through-hole parts with grasping members and forming a platig bath tank with the inside surfaces of the through-holes and the grasping members.
CONSTITUTION: A small end part 1b of a connecting rod 1 is grasped by a pair of grapsing members C1, C2 in a plating tank C. The one member C1 is fixed in the tank and has an opening 22a communicating with the inside of the part 1b. The other member C2 is constituted of an insulator, and can be discplaced by the operation of an oil hydraulic cylinder 24. While the rod 1 is held grasped, the opening 28a in the lower part of the member C2 is communicated with the inside of the part 1b and an electrode 31 is inserted therein. While a plating soln. is supplied through a passage 22b, the electrode 31 is connected to a + electrode with a mounting plate 25 consisting of a conductive material and a conductor 32, and the the large end part 1a is connected to a - electrode with an abuttig member 33 and a conductor 34, thence electric current is conducted to these, whereby the inside surface of the part 1b is electroplated.
COPYRIGHT: (C)1982,JPO&Japio
JP5994881A 1981-04-20 1981-04-20 High speed plating device Pending JPS57174488A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP5994881A JPS57174488A (en) 1981-04-20 1981-04-20 High speed plating device
DE1982101642 DE63226T1 (en) 1981-04-20 1982-03-03 DEVICE FOR HIGH-SPEED ELECTROPLATING.
EP82101642A EP0063226A1 (en) 1981-04-20 1982-03-03 High speed plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5994881A JPS57174488A (en) 1981-04-20 1981-04-20 High speed plating device

Publications (1)

Publication Number Publication Date
JPS57174488A true JPS57174488A (en) 1982-10-27

Family

ID=13127870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5994881A Pending JPS57174488A (en) 1981-04-20 1981-04-20 High speed plating device

Country Status (3)

Country Link
EP (1) EP0063226A1 (en)
JP (1) JPS57174488A (en)
DE (1) DE63226T1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103806068A (en) * 2014-02-28 2014-05-21 成都先进功率半导体股份有限公司 High-speed plating line plating conductive device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4096042A (en) * 1969-04-04 1978-06-20 The United States Of America As Represented By The United States Department Of Energy Electroplating method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103806068A (en) * 2014-02-28 2014-05-21 成都先进功率半导体股份有限公司 High-speed plating line plating conductive device
CN103806068B (en) * 2014-02-28 2016-03-02 成都先进功率半导体股份有限公司 A kind of High-speed Electric plate wire electroplating conductive device

Also Published As

Publication number Publication date
DE63226T1 (en) 1983-04-28
EP0063226A1 (en) 1982-10-27

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