JPS575898A - Surface treating method - Google Patents

Surface treating method

Info

Publication number
JPS575898A
JPS575898A JP7989180A JP7989180A JPS575898A JP S575898 A JPS575898 A JP S575898A JP 7989180 A JP7989180 A JP 7989180A JP 7989180 A JP7989180 A JP 7989180A JP S575898 A JPS575898 A JP S575898A
Authority
JP
Japan
Prior art keywords
work
electrode plates
end parts
treatment
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7989180A
Other languages
Japanese (ja)
Other versions
JPS5810479B2 (en
Inventor
Shinichi Nitta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP55079891A priority Critical patent/JPS5810479B2/en
Publication of JPS575898A publication Critical patent/JPS575898A/en
Publication of JPS5810479B2 publication Critical patent/JPS5810479B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To accomplish a remote control of a treatment and the entry thereof into a program by a simple operation, by a method wherein a plurality of sectioned electrode plates are placed in parallel and facing to an elongate work placed in a treating tank, and the treatment for end parts of the work is restricted by selectively supplying currents to the electrode plates.
CONSTITUTION: The work W is immersed in a liquid in the treating tank 1, a plurality of end-part electrode plates Pa1, Pa2..., Pb1, Pb2..., Pc1, Pc2... positioned in correspondence to both end parts Wa, Wb of the work W and central electrode plates Pm are placed in parallel and opposite to the work W. In this case, switching contacts Sal, Sa2... for the end electrode plates Pal... corresponding to the end parts Wa, Wb of the work W are operated selectively. Namely, the distance between the electrode plate and the end part is set to be a little larger so as to reduce, e.g., the amount of metal plated on the end part and to obtain a uniform plated film over the the entire surface of the work, utilizing the Coulombs law to the effect that the force of attraction is in inverse proportion to the square of the separated distance.
COPYRIGHT: (C)1982,JPO&Japio
JP55079891A 1980-06-12 1980-06-12 Surface treatment method Expired JPS5810479B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55079891A JPS5810479B2 (en) 1980-06-12 1980-06-12 Surface treatment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55079891A JPS5810479B2 (en) 1980-06-12 1980-06-12 Surface treatment method

Publications (2)

Publication Number Publication Date
JPS575898A true JPS575898A (en) 1982-01-12
JPS5810479B2 JPS5810479B2 (en) 1983-02-25

Family

ID=13702882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55079891A Expired JPS5810479B2 (en) 1980-06-12 1980-06-12 Surface treatment method

Country Status (1)

Country Link
JP (1) JPS5810479B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05132799A (en) * 1991-06-25 1993-05-28 Internatl Business Mach Corp <Ibm> Electroplating method and apparatus therefor
JP2007224321A (en) * 2006-02-21 2007-09-06 Think Laboratory Co Ltd Plating method and apparatus for cylinder
CN110546313A (en) * 2017-04-25 2019-12-06 古河电气工业株式会社 Surface treated copper foil

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50158573A (en) * 1974-06-12 1975-12-22
JPS5218649A (en) * 1975-08-04 1977-02-12 Taku Sasagawa Free stand for twoowheel vehicle on ground
JPS5351146A (en) * 1976-10-21 1978-05-10 Nippon Steel Corp Nonnelectrolytic treatment method of metal strip
JPS5419295U (en) * 1977-07-08 1979-02-07
JPS5432427A (en) * 1977-08-18 1979-03-09 Mitsui Toatsu Chem Inc Novel diphenyl ether compounds and herbicides
JPS56165067U (en) * 1980-05-07 1981-12-07

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50158573A (en) * 1974-06-12 1975-12-22
JPS5218649A (en) * 1975-08-04 1977-02-12 Taku Sasagawa Free stand for twoowheel vehicle on ground
JPS5351146A (en) * 1976-10-21 1978-05-10 Nippon Steel Corp Nonnelectrolytic treatment method of metal strip
JPS5419295U (en) * 1977-07-08 1979-02-07
JPS5432427A (en) * 1977-08-18 1979-03-09 Mitsui Toatsu Chem Inc Novel diphenyl ether compounds and herbicides
JPS56165067U (en) * 1980-05-07 1981-12-07

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05132799A (en) * 1991-06-25 1993-05-28 Internatl Business Mach Corp <Ibm> Electroplating method and apparatus therefor
JP2007224321A (en) * 2006-02-21 2007-09-06 Think Laboratory Co Ltd Plating method and apparatus for cylinder
CN110546313A (en) * 2017-04-25 2019-12-06 古河电气工业株式会社 Surface treated copper foil

Also Published As

Publication number Publication date
JPS5810479B2 (en) 1983-02-25

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