CN103806068A - High-speed plating line plating conductive device - Google Patents

High-speed plating line plating conductive device Download PDF

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Publication number
CN103806068A
CN103806068A CN201410071089.0A CN201410071089A CN103806068A CN 103806068 A CN103806068 A CN 103806068A CN 201410071089 A CN201410071089 A CN 201410071089A CN 103806068 A CN103806068 A CN 103806068A
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CN
China
Prior art keywords
material strip
conductive device
sprocket wheel
crossbeam
rotating shaft
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Application number
CN201410071089.0A
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Chinese (zh)
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CN103806068B (en
Inventor
张军
李宁
樊增勇
罗天秀
刘达
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LESHAN RADIO CO Ltd
Chengdu Advanced Power Semiconductor Co Ltd
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LESHAN RADIO CO Ltd
Chengdu Advanced Power Semiconductor Co Ltd
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Application filed by LESHAN RADIO CO Ltd, Chengdu Advanced Power Semiconductor Co Ltd filed Critical LESHAN RADIO CO Ltd
Priority to CN201410071089.0A priority Critical patent/CN103806068B/en
Publication of CN103806068A publication Critical patent/CN103806068A/en
Application granted granted Critical
Publication of CN103806068B publication Critical patent/CN103806068B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention discloses a high-speed plating line plating conductive device. The high-speed plating line plating conductive device comprises a cross beam (1), a fixation plate (3) which is fixedly mounted on the cross beam (1), and two support feet (4) arranged on the fixation plate (3) and each connected with one L-shaped rotation plate (5), wherein the upper end of a rotation shaft (6) of the L-shaped rotation plate (5) is rotatably connected with the support foot (4) on the corresponding side, a mounting seat (8) is fixedly arranged on each L-shaped rotation plate (5), a copper head (9) and a connection pole (10) are fixedly mounted on each mounting seat (8), and two connection poles (10) are connected by a tension spring (11). The high-speed plating line plating conductive device has the following beneficial effects that after the copper heads are worn, the rotation shafts of the L-shaped rotation plates are driven to rotate by the tension spring, the worn of the copper heads is compensated, so that the copper heads always keep close contact with a material belt, the conduction performance is guaranteed and prevented from going worse due to the worn copper heads, generation of voltaic arc is avoided, and the quality of products is guaranteed.

Description

A kind of High-speed Electric plate wire electroplating conductive device
Technical field
The present invention relates to electroplanting device technical field, particularly a kind of High-speed Electric plate wire electroplating conductive device.
Background technology
Electroplate the electrolyzer that needs a low-voltage high-current power source of powering to plating tank and formed by electroplate liquid, part to be plated (negative electrode) and anode.Wherein to look coating different and different for electroplating bath components, but all contain provide the main salt of metal ion, can the main salt of complexing in metal ion form the complexing agent of complex compound, buffer reagent, anode activator and the special additive (as brightening agent, grain-refining agent, leveling agent, wetting agent, stress relieving agent and inhibiting fog agent etc.) for stabilizing solution potential of hydrogen.Electroplating process be metal ion in plating solution under the effect of external electric field, be reduced into atoms metal through electrode reaction, and in the process of the enterprising row metal deposition of negative electrode.Therefore, this is a metal electrodeposition process that comprises the steps such as mass transfer in liquid phase, electrochemical reaction and electrocrystallization.
When plating, coated metal or other insoluble materials do anode, and workpiece to be plated does negative electrode, and the positively charged ion of coated metal is reduced formation coating at workpiece surface to be plated.In large-scale production, electroplated material strip is driven at the uniform velocity and is advanced by transmitting device conventionally, and in its traveling process, through plating tank, it is connected with electrode by friction contact simultaneously, thereby completes successively plating in transmitting procedure.But existing apparatus be aborning because material strip and interelectrode friction can cause the wearing and tearing of electrode, thereby can produce the untight problem of contact, cause poorly conductive and produce electric arc, damage transport tape and affect quality product.
Summary of the invention
The object of the invention is to overcome the shortcoming of prior art, the High-speed Electric plate wire electroplating conductive device that a kind of conductivity is secure, improve product quality stability is provided.
Object of the present invention is achieved through the following technical solutions: a kind of High-speed Electric plate wire electroplating conductive device, it comprises the crossbeam that is fixedly installed on plating tank and is fixedly installed on crossbeam and is positioned at the retaining plate above plating tank material strip, the zygomorphy that retaining plate is positioned at material strip is provided with two legs, on each leg, be all connected with a L-type flap, each L-type flap comprises that the rotating shaft of a vertical direction setting and one are parallel to the leveling board of material strip, the upper end of rotating shaft is rotatable to be connected with the leg of respective side, the lower end of rotating shaft is fixedly connected with leveling board, on the leveling board of each L-type flap, be all fixedly installed a mount pad, each mount pad is installed with a copperhead near a side of material strip, on each mount pad, be provided with a joint pin, two joint pins connect by back-moving spring, two copperheads are all pressed in the side surface of material strip.
On described material strip, be provided with along the equally distributed through hole of material strip length direction, on described crossbeam, be provided with a support sprocket wheel that drives material strip to advance, the wheel shaft that supports sprocket wheel vertically arranges and rotatable being installed on crossbeam, wheel shaft is connected with drive-motor by transmission mechanism, support the excircle of sprocket wheel along being circumferentially evenly provided with the projection matching with the hole on material strip, a side that supports sprocket wheel contacts with material strip.
The present invention has the following advantages: the present invention is after copperhead wearing and tearing, drive the rotating shaft of L-type flap to rotate by back-moving spring, the wearing and tearing of compensation copperhead, make copperhead continue to compress material strip, thereby make copperhead keep close contact with material strip all the time, guarantee that conductivity can, because of copperhead wearing and tearing variation, not avoid the generation of electric arc, guaranteed the quality of product.Copperhead, to the clamping action of material strip in conjunction with the driving effect of supporting sprocket wheel, has guaranteed the stability of material strip transmission simultaneously, has improved equally the quality of product.
Accompanying drawing explanation
Fig. 1 is plan structure schematic diagram of the present invention
Fig. 2 is right TV structure schematic diagram of the present invention
In figure, 1-crossbeam, 2-material strip, 3-retaining plate, 4-leg, 5-L-type flap, 6-rotating shaft, 7-leveling board, 8-mount pad, 9-copperhead, 10-joint pin, 11-back-moving spring, 12-through hole, 13-supports sprocket wheel, 14-projection, 15-power lead locking screw.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described, and protection scope of the present invention is not limited to the following stated:
As Fig. 1, shown in Fig. 2, a kind of High-speed Electric plate wire electroplating conductive device, it comprises the crossbeam 1 being fixedly installed on plating tank and is fixedly installed on crossbeam 1 and is positioned at the retaining plate 3 of plating tank material strip 2 tops, the zygomorphy that retaining plate 3 is positioned at material strip 2 is provided with two legs 4, on each leg 4, be all connected with a L-type flap 5, each L-type flap 5 comprises that the rotating shaft 6 of a vertical direction setting and one are parallel to the leveling board 7 of material strip 2, the upper end of rotating shaft 6 is rotatable to be connected with the leg 4 of respective side, the lower end of rotating shaft 6 is fixedly connected with leveling board 7, on the leveling board 7 of each L-type flap 5, be all fixedly installed a mount pad 8, each mount pad 8 is installed with a copperhead 9 near a side of material strip 2, on each mount pad 8, be provided with a joint pin 10, two joint pins 10 connect by back-moving spring 11, the two ends of back-moving spring 11 are connected to the upper end of the joint pin 10 of respective side, two copperheads 9 are all pressed in the side surface of material strip 2.Electric installation entirety is symmetrical about material strip 2, thereby has guaranteed the stability of clamping and the stable transfer of material strip 2.On each copperhead 9, be provided with power lead locking screw 15.
On described material strip 2, be provided with along the equally distributed through hole 12 of material strip 2 length direction, on described crossbeam 1, be provided with a support sprocket wheel 13 that drives material strip 2 to advance, the wheel shaft that supports sprocket wheel 13 vertically arranges and rotatable being installed on crossbeam 1, wheel shaft is connected with drive-motor by transmission mechanism, drive support sprocket wheel 13 to rotate by drive-motor, support the excircle of sprocket wheel 13 along being circumferentially evenly provided with the projection 14 matching with the hole on material strip 2, a side that supports sprocket wheel 13 contacts with material strip 2, and the projection 14 that is positioned at support sprocket wheel 13 and material strip 2 contact parts is positioned at the through hole 12 of material strip 2, thereby while supporting sprocket wheel 13 by drive-motor driving rotation, projection 14 drives material strip 2 to transmit forward.Meanwhile, described support sprocket wheel 13 also plays the effect of material strip 2 being fixed on to design height.Described material strip 2 is steel band.
Working process of the present invention is as follows: in equipment running process, material strip 2 is fixed on design height by supporting sprocket wheel 13, and drive-motor drives support sprocket wheel 13 to rotate, thereby drives material strip 2 and copperhead 9 to do relative motion; Two copperheads 9 that are positioned at material strip 2 both sides keep contacting with steel band material strip 2 by back-moving spring 11; Due to rubbing effect, can progressively wear and tear in copperhead 9 inside edges, and material strip 2 is pressed close in the rotation of the rotating shaft 6 by L-type flap 5 under back-moving spring 11 effect of the copperhead 9 after wearing and tearing again, thereby makes copperhead 9 keep close contact with material strip 2 all the time.

Claims (2)

1. a High-speed Electric plate wire electroplating conductive device, it is characterized in that: it comprises the crossbeam (1) being fixedly installed on plating tank and be fixedly installed in crossbeam (1) retaining plate (3) of going up and be positioned at plating tank material strip (2) top, the zygomorphy that retaining plate (3) is positioned at material strip (2) is provided with two legs (4), on each leg (4), be all connected with a L-type flap (5), each L-type flap (5) comprises that rotating shaft (6) that vertical direction arranges and one are parallel to the leveling board (7) of material strip (2), the upper end of rotating shaft (6) is rotatable to be connected with the leg (4) of respective side, the lower end of rotating shaft (6) is fixedly connected with leveling board (7), on the leveling board (7) of each L-type flap (5), be all fixedly installed a mount pad (8), each mount pad (8) is installed with a copperhead (9) near a side of material strip (2), on each mount pad (8), be provided with a joint pin (10), two joint pins (10) connect by back-moving spring (11), two copperheads (9) are all pressed in the side surface of material strip (2).
2. a kind of High-speed Electric plate wire electroplating conductive device according to claim 1, it is characterized in that: on described material strip (2), be provided with along the equally distributed through hole of material strip (2) length direction (12), on described crossbeam (1), be provided with a support sprocket wheel (13) that drives material strip (2) to advance, the wheel shaft that supports sprocket wheel (13) vertically arranges and rotatable being installed on crossbeam (1), wheel shaft is connected with drive-motor by transmission mechanism, support the excircle of sprocket wheel (13) along being circumferentially evenly provided with the projection (14) matching with the hole on material strip (2), a side that supports sprocket wheel (13) contacts with material strip (2).
CN201410071089.0A 2014-02-28 2014-02-28 A kind of High-speed Electric plate wire electroplating conductive device Expired - Fee Related CN103806068B (en)

Priority Applications (1)

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CN201410071089.0A CN103806068B (en) 2014-02-28 2014-02-28 A kind of High-speed Electric plate wire electroplating conductive device

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Application Number Priority Date Filing Date Title
CN201410071089.0A CN103806068B (en) 2014-02-28 2014-02-28 A kind of High-speed Electric plate wire electroplating conductive device

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CN103806068B CN103806068B (en) 2016-03-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111621842A (en) * 2020-06-30 2020-09-04 中国振华集团永光电子有限公司(国营第八七三厂) Large-current dynamic electrolysis electrode device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064034A (en) * 1972-02-17 1977-12-20 M & T Chemicals Inc. Anode structure for wire and strip line electroplating
JPS57174488A (en) * 1981-04-20 1982-10-27 Yamaha Motor Co Ltd High speed plating device
JPS61117299A (en) * 1984-11-12 1986-06-04 Kobe Steel Ltd Prevention of damage of anode electricity conducting body for electroplating
CN2705473Y (en) * 2004-04-23 2005-06-22 上海应用技术学院 Electroplating V-shape base for increasing conductivity
CN201176465Y (en) * 2008-04-17 2009-01-07 苏骞 Conductive device for continuous electroplating production line
CN203728946U (en) * 2014-02-28 2014-07-23 成都先进功率半导体股份有限公司 Electroplating electric conduction device for high-speed electroplating line

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064034A (en) * 1972-02-17 1977-12-20 M & T Chemicals Inc. Anode structure for wire and strip line electroplating
JPS57174488A (en) * 1981-04-20 1982-10-27 Yamaha Motor Co Ltd High speed plating device
JPS61117299A (en) * 1984-11-12 1986-06-04 Kobe Steel Ltd Prevention of damage of anode electricity conducting body for electroplating
CN2705473Y (en) * 2004-04-23 2005-06-22 上海应用技术学院 Electroplating V-shape base for increasing conductivity
CN201176465Y (en) * 2008-04-17 2009-01-07 苏骞 Conductive device for continuous electroplating production line
CN203728946U (en) * 2014-02-28 2014-07-23 成都先进功率半导体股份有限公司 Electroplating electric conduction device for high-speed electroplating line

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111621842A (en) * 2020-06-30 2020-09-04 中国振华集团永光电子有限公司(国营第八七三厂) Large-current dynamic electrolysis electrode device

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Granted publication date: 20160302

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