JPS57172775A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57172775A
JPS57172775A JP5622781A JP5622781A JPS57172775A JP S57172775 A JPS57172775 A JP S57172775A JP 5622781 A JP5622781 A JP 5622781A JP 5622781 A JP5622781 A JP 5622781A JP S57172775 A JPS57172775 A JP S57172775A
Authority
JP
Japan
Prior art keywords
layer
active layer
ion implantation
gaas
furthermore
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5622781A
Other languages
Japanese (ja)
Inventor
Mikio Tatematsu
Kiyoo Kamei
Hisao Kamo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5622781A priority Critical patent/JPS57172775A/en
Publication of JPS57172775A publication Critical patent/JPS57172775A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/80Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:To obtain good cross modulation characteristics by a method wherein annealing is applied to a shottky-type dual gate FET active layer after forming the active layer by at least two-stage ion implantation when the active layer is formed by using GaAs and furthermore, the maximum carrier concentration position generated by the ion implantation is located around the surface of the active layer. CONSTITUTION:An N type GaAs active layer 2 is formed on a semiinsulating GaAs substrate 1 and a source electrode 3 and a drain electrode 4 are provided in parallel on the layer 2 and in the same way, the first and the second gate electrodes 5, 6 are formed in parallel between the electrodes 3 and 4 to form a dual gate FET. In this composition, N type impurity ions are implanted to the grown GaAs layer by dividing the ion implantation into at least two stages to form the layer 2. Furthermore, the maximum carrier concentration position generated by the ion implantation is located around the surface layer section of the layer 2. Then, annealing treatment is applied to the layer 2. In this way, cross modulation characteristics which are equal to or better than those obtained by using Si can be obtained. Furthermore, the semiconductor device becomes suitable for mass production.
JP5622781A 1981-04-16 1981-04-16 Manufacture of semiconductor device Pending JPS57172775A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5622781A JPS57172775A (en) 1981-04-16 1981-04-16 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5622781A JPS57172775A (en) 1981-04-16 1981-04-16 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57172775A true JPS57172775A (en) 1982-10-23

Family

ID=13021214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5622781A Pending JPS57172775A (en) 1981-04-16 1981-04-16 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57172775A (en)

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