JPS57170523A - Conveying method for wafer boat - Google Patents
Conveying method for wafer boatInfo
- Publication number
- JPS57170523A JPS57170523A JP5641981A JP5641981A JPS57170523A JP S57170523 A JPS57170523 A JP S57170523A JP 5641981 A JP5641981 A JP 5641981A JP 5641981 A JP5641981 A JP 5641981A JP S57170523 A JPS57170523 A JP S57170523A
- Authority
- JP
- Japan
- Prior art keywords
- boat
- wafer
- tube
- contact
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
PURPOSE:To avoid the damage of a part such as a wafer boat by immediately detecting a contact of a wafer, a wafer boat, a boat supporting arm or the like with the inner wall of a process tube when the wafer, the wafer boat, a boat supporting arm or the like makes contact with the inner wall of the tube, stopping the movement of the parts, correcting them to non-contacted state and then restarting the movement. CONSTITUTION:A process tube 3 made of a uniform heating tube 2 having a gas guide tube 24 is enclosed with a cylindrical heater 1, a wafer boat 4 on which many semiconductor wafers 6 are stood therein is contained in the heater, and a boat supporting arm 7 is connected to the boat 4. A cylindrical bearing 10 which is supported by a connecting bracket 8 is provided at the other end faced with the boat 4 of an arm 7, and an elevational load detector 12 and a lateral load detector 13 are provided at the bearing. In case that the arm 7 is moved by a motor 18 thus constructed along rails 16, when these parts make contact with the inner wall of the tube 3, the contact is detected by the detectors 12, 13, the motor 18 is stopped, and the contacting state is corrected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5641981A JPS57170523A (en) | 1981-04-15 | 1981-04-15 | Conveying method for wafer boat |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5641981A JPS57170523A (en) | 1981-04-15 | 1981-04-15 | Conveying method for wafer boat |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57170523A true JPS57170523A (en) | 1982-10-20 |
JPS6243332B2 JPS6243332B2 (en) | 1987-09-12 |
Family
ID=13026580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5641981A Granted JPS57170523A (en) | 1981-04-15 | 1981-04-15 | Conveying method for wafer boat |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57170523A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5970343U (en) * | 1982-11-02 | 1984-05-12 | 株式会社日立国際電気 | soft landing device |
JPS59200432A (en) * | 1983-04-28 | 1984-11-13 | Toshiba Ceramics Co Ltd | Tool for carrying wafer boat |
JPS6095920A (en) * | 1983-10-05 | 1985-05-29 | アドヴアンスト セミコンダクター マテイリアルズ アメリカ インコーポレーテツド | Article handling device and method |
JPS6144832U (en) * | 1984-08-24 | 1986-03-25 | 日立電子エンジニアリング株式会社 | Quartz fork support mechanism for wafer insertion |
JPS6190428A (en) * | 1984-10-11 | 1986-05-08 | Toshiba Corp | Method of positional correction of heat treatment jig |
-
1981
- 1981-04-15 JP JP5641981A patent/JPS57170523A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5970343U (en) * | 1982-11-02 | 1984-05-12 | 株式会社日立国際電気 | soft landing device |
JPS59200432A (en) * | 1983-04-28 | 1984-11-13 | Toshiba Ceramics Co Ltd | Tool for carrying wafer boat |
JPS6095920A (en) * | 1983-10-05 | 1985-05-29 | アドヴアンスト セミコンダクター マテイリアルズ アメリカ インコーポレーテツド | Article handling device and method |
JPS6144832U (en) * | 1984-08-24 | 1986-03-25 | 日立電子エンジニアリング株式会社 | Quartz fork support mechanism for wafer insertion |
JPH0142341Y2 (en) * | 1984-08-24 | 1989-12-12 | ||
JPS6190428A (en) * | 1984-10-11 | 1986-05-08 | Toshiba Corp | Method of positional correction of heat treatment jig |
Also Published As
Publication number | Publication date |
---|---|
JPS6243332B2 (en) | 1987-09-12 |
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