JPS57170523A - Conveying method for wafer boat - Google Patents

Conveying method for wafer boat

Info

Publication number
JPS57170523A
JPS57170523A JP5641981A JP5641981A JPS57170523A JP S57170523 A JPS57170523 A JP S57170523A JP 5641981 A JP5641981 A JP 5641981A JP 5641981 A JP5641981 A JP 5641981A JP S57170523 A JPS57170523 A JP S57170523A
Authority
JP
Japan
Prior art keywords
boat
wafer
tube
contact
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5641981A
Other languages
Japanese (ja)
Other versions
JPS6243332B2 (en
Inventor
Ryoji Tsunoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP5641981A priority Critical patent/JPS57170523A/en
Publication of JPS57170523A publication Critical patent/JPS57170523A/en
Publication of JPS6243332B2 publication Critical patent/JPS6243332B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

PURPOSE:To avoid the damage of a part such as a wafer boat by immediately detecting a contact of a wafer, a wafer boat, a boat supporting arm or the like with the inner wall of a process tube when the wafer, the wafer boat, a boat supporting arm or the like makes contact with the inner wall of the tube, stopping the movement of the parts, correcting them to non-contacted state and then restarting the movement. CONSTITUTION:A process tube 3 made of a uniform heating tube 2 having a gas guide tube 24 is enclosed with a cylindrical heater 1, a wafer boat 4 on which many semiconductor wafers 6 are stood therein is contained in the heater, and a boat supporting arm 7 is connected to the boat 4. A cylindrical bearing 10 which is supported by a connecting bracket 8 is provided at the other end faced with the boat 4 of an arm 7, and an elevational load detector 12 and a lateral load detector 13 are provided at the bearing. In case that the arm 7 is moved by a motor 18 thus constructed along rails 16, when these parts make contact with the inner wall of the tube 3, the contact is detected by the detectors 12, 13, the motor 18 is stopped, and the contacting state is corrected.
JP5641981A 1981-04-15 1981-04-15 Conveying method for wafer boat Granted JPS57170523A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5641981A JPS57170523A (en) 1981-04-15 1981-04-15 Conveying method for wafer boat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5641981A JPS57170523A (en) 1981-04-15 1981-04-15 Conveying method for wafer boat

Publications (2)

Publication Number Publication Date
JPS57170523A true JPS57170523A (en) 1982-10-20
JPS6243332B2 JPS6243332B2 (en) 1987-09-12

Family

ID=13026580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5641981A Granted JPS57170523A (en) 1981-04-15 1981-04-15 Conveying method for wafer boat

Country Status (1)

Country Link
JP (1) JPS57170523A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5970343U (en) * 1982-11-02 1984-05-12 株式会社日立国際電気 soft landing device
JPS59200432A (en) * 1983-04-28 1984-11-13 Toshiba Ceramics Co Ltd Tool for carrying wafer boat
JPS6095920A (en) * 1983-10-05 1985-05-29 アドヴアンスト セミコンダクター マテイリアルズ アメリカ インコーポレーテツド Article handling device and method
JPS6144832U (en) * 1984-08-24 1986-03-25 日立電子エンジニアリング株式会社 Quartz fork support mechanism for wafer insertion
JPS6190428A (en) * 1984-10-11 1986-05-08 Toshiba Corp Method of positional correction of heat treatment jig

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5970343U (en) * 1982-11-02 1984-05-12 株式会社日立国際電気 soft landing device
JPS59200432A (en) * 1983-04-28 1984-11-13 Toshiba Ceramics Co Ltd Tool for carrying wafer boat
JPS6095920A (en) * 1983-10-05 1985-05-29 アドヴアンスト セミコンダクター マテイリアルズ アメリカ インコーポレーテツド Article handling device and method
JPS6144832U (en) * 1984-08-24 1986-03-25 日立電子エンジニアリング株式会社 Quartz fork support mechanism for wafer insertion
JPH0142341Y2 (en) * 1984-08-24 1989-12-12
JPS6190428A (en) * 1984-10-11 1986-05-08 Toshiba Corp Method of positional correction of heat treatment jig

Also Published As

Publication number Publication date
JPS6243332B2 (en) 1987-09-12

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