JPS57167664A - Lead-out structure of lead wire in polymer film package - Google Patents
Lead-out structure of lead wire in polymer film packageInfo
- Publication number
- JPS57167664A JPS57167664A JP5202381A JP5202381A JPS57167664A JP S57167664 A JPS57167664 A JP S57167664A JP 5202381 A JP5202381 A JP 5202381A JP 5202381 A JP5202381 A JP 5202381A JP S57167664 A JPS57167664 A JP S57167664A
- Authority
- JP
- Japan
- Prior art keywords
- rivet
- polymer film
- lead wire
- lead
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 4
- 229920006254 polymer film Polymers 0.000 title abstract 4
- 239000010409 thin film Substances 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 2
- 239000010408 film Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Liquid Crystal (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5202381A JPS57167664A (en) | 1981-04-07 | 1981-04-07 | Lead-out structure of lead wire in polymer film package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5202381A JPS57167664A (en) | 1981-04-07 | 1981-04-07 | Lead-out structure of lead wire in polymer film package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57167664A true JPS57167664A (en) | 1982-10-15 |
| JPH0315342B2 JPH0315342B2 (enrdf_load_stackoverflow) | 1991-02-28 |
Family
ID=12903210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5202381A Granted JPS57167664A (en) | 1981-04-07 | 1981-04-07 | Lead-out structure of lead wire in polymer film package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57167664A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01222224A (ja) * | 1988-03-01 | 1989-09-05 | Matsushita Electron Corp | 液晶表示装置 |
-
1981
- 1981-04-07 JP JP5202381A patent/JPS57167664A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01222224A (ja) * | 1988-03-01 | 1989-09-05 | Matsushita Electron Corp | 液晶表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0315342B2 (enrdf_load_stackoverflow) | 1991-02-28 |
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