JPH0315342B2 - - Google Patents

Info

Publication number
JPH0315342B2
JPH0315342B2 JP5202381A JP5202381A JPH0315342B2 JP H0315342 B2 JPH0315342 B2 JP H0315342B2 JP 5202381 A JP5202381 A JP 5202381A JP 5202381 A JP5202381 A JP 5202381A JP H0315342 B2 JPH0315342 B2 JP H0315342B2
Authority
JP
Japan
Prior art keywords
package
polymer film
film
lead wire
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5202381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57167664A (en
Inventor
Narikazu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP5202381A priority Critical patent/JPS57167664A/ja
Publication of JPS57167664A publication Critical patent/JPS57167664A/ja
Publication of JPH0315342B2 publication Critical patent/JPH0315342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Liquid Crystal (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5202381A 1981-04-07 1981-04-07 Lead-out structure of lead wire in polymer film package Granted JPS57167664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5202381A JPS57167664A (en) 1981-04-07 1981-04-07 Lead-out structure of lead wire in polymer film package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5202381A JPS57167664A (en) 1981-04-07 1981-04-07 Lead-out structure of lead wire in polymer film package

Publications (2)

Publication Number Publication Date
JPS57167664A JPS57167664A (en) 1982-10-15
JPH0315342B2 true JPH0315342B2 (enrdf_load_stackoverflow) 1991-02-28

Family

ID=12903210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5202381A Granted JPS57167664A (en) 1981-04-07 1981-04-07 Lead-out structure of lead wire in polymer film package

Country Status (1)

Country Link
JP (1) JPS57167664A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01222224A (ja) * 1988-03-01 1989-09-05 Matsushita Electron Corp 液晶表示装置

Also Published As

Publication number Publication date
JPS57167664A (en) 1982-10-15

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