JPS57211759A - Electronic parts and manufacture thereof - Google Patents

Electronic parts and manufacture thereof

Info

Publication number
JPS57211759A
JPS57211759A JP9665781A JP9665781A JPS57211759A JP S57211759 A JPS57211759 A JP S57211759A JP 9665781 A JP9665781 A JP 9665781A JP 9665781 A JP9665781 A JP 9665781A JP S57211759 A JPS57211759 A JP S57211759A
Authority
JP
Japan
Prior art keywords
parts
diameter parts
lead wires
thick diameter
electronic parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9665781A
Other languages
Japanese (ja)
Inventor
Setsuo Kuwatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9665781A priority Critical patent/JPS57211759A/en
Publication of JPS57211759A publication Critical patent/JPS57211759A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the electronic parts which has high reliability in hermetical sealing and large strength, by nolding an electric circuit element between the thick diameter parts of a pair of lead wires, and coating the outer edge parts of said thick diameter parts. CONSTITUTION:A pellet 3 is held between the end surfaces of the thick diameter parts 1 of a pair of the lead wires 2. The thick diameter parts 1 and the pellet 3 are hermetically sealed by a glass body 5. The outer edge parts on the sides of the thin diameter parts 6 of the lead wires 2 are coated by the glass body 5.
JP9665781A 1981-06-24 1981-06-24 Electronic parts and manufacture thereof Pending JPS57211759A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9665781A JPS57211759A (en) 1981-06-24 1981-06-24 Electronic parts and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9665781A JPS57211759A (en) 1981-06-24 1981-06-24 Electronic parts and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS57211759A true JPS57211759A (en) 1982-12-25

Family

ID=14170901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9665781A Pending JPS57211759A (en) 1981-06-24 1981-06-24 Electronic parts and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS57211759A (en)

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