JPS57167638A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57167638A JPS57167638A JP56035025A JP3502581A JPS57167638A JP S57167638 A JPS57167638 A JP S57167638A JP 56035025 A JP56035025 A JP 56035025A JP 3502581 A JP3502581 A JP 3502581A JP S57167638 A JPS57167638 A JP S57167638A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- treatment
- rate
- drop
- rise
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P95/90—
Landscapes
- Formation Of Insulating Films (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56035025A JPS57167638A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
| EP82301212A EP0060676B1 (en) | 1981-03-11 | 1982-03-10 | A method for the production of a semiconductor device comprising annealing a silicon wafer |
| DE8282301212T DE3280219D1 (de) | 1981-03-11 | 1982-03-10 | Verfahren zur herstellung einer halbleiteranordnung mit ausgluehen eines halbleiterkoerpers. |
| IE559/82A IE55966B1 (en) | 1981-03-11 | 1982-03-11 | A method for the production of a semiconductor device comprising annealing a silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56035025A JPS57167638A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57167638A true JPS57167638A (en) | 1982-10-15 |
| JPS6211782B2 JPS6211782B2 (cg-RX-API-DMAC10.html) | 1987-03-14 |
Family
ID=12430513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56035025A Granted JPS57167638A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57167638A (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5821829A (ja) * | 1981-07-31 | 1983-02-08 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS6444023A (en) * | 1987-08-12 | 1989-02-16 | Hitachi Ltd | Heat treatment |
| JPH01312840A (ja) * | 1988-06-10 | 1989-12-18 | Fujitsu Ltd | 半導体装置の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5595330A (en) * | 1979-01-12 | 1980-07-19 | Toshiba Corp | Preparation of semiconductor device |
-
1981
- 1981-03-11 JP JP56035025A patent/JPS57167638A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5595330A (en) * | 1979-01-12 | 1980-07-19 | Toshiba Corp | Preparation of semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5821829A (ja) * | 1981-07-31 | 1983-02-08 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS6444023A (en) * | 1987-08-12 | 1989-02-16 | Hitachi Ltd | Heat treatment |
| JPH01312840A (ja) * | 1988-06-10 | 1989-12-18 | Fujitsu Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211782B2 (cg-RX-API-DMAC10.html) | 1987-03-14 |
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