JPS57166059A - Manufacture of electronic part - Google Patents
Manufacture of electronic partInfo
- Publication number
- JPS57166059A JPS57166059A JP56052255A JP5225581A JPS57166059A JP S57166059 A JPS57166059 A JP S57166059A JP 56052255 A JP56052255 A JP 56052255A JP 5225581 A JP5225581 A JP 5225581A JP S57166059 A JPS57166059 A JP S57166059A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic part
- lead terminal
- metal
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 3
- 238000005476 soldering Methods 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56052255A JPS57166059A (en) | 1981-04-06 | 1981-04-06 | Manufacture of electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56052255A JPS57166059A (en) | 1981-04-06 | 1981-04-06 | Manufacture of electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57166059A true JPS57166059A (en) | 1982-10-13 |
| JPH0113207B2 JPH0113207B2 (enrdf_load_stackoverflow) | 1989-03-03 |
Family
ID=12909631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56052255A Granted JPS57166059A (en) | 1981-04-06 | 1981-04-06 | Manufacture of electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57166059A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5987810A (ja) * | 1982-11-11 | 1984-05-21 | 日本電気ホームエレクトロニクス株式会社 | 積層セラミックコンデンサの製造方法 |
| JPS59165444A (ja) * | 1983-03-10 | 1984-09-18 | Toshiba Corp | 混成集積回路の製造方法 |
| JPS603145A (ja) * | 1983-06-20 | 1985-01-09 | Rohm Co Ltd | リ−ド付け方法 |
-
1981
- 1981-04-06 JP JP56052255A patent/JPS57166059A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5987810A (ja) * | 1982-11-11 | 1984-05-21 | 日本電気ホームエレクトロニクス株式会社 | 積層セラミックコンデンサの製造方法 |
| JPS59165444A (ja) * | 1983-03-10 | 1984-09-18 | Toshiba Corp | 混成集積回路の製造方法 |
| JPS603145A (ja) * | 1983-06-20 | 1985-01-09 | Rohm Co Ltd | リ−ド付け方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0113207B2 (enrdf_load_stackoverflow) | 1989-03-03 |
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