JPS57166059A - Manufacture of electronic part - Google Patents

Manufacture of electronic part

Info

Publication number
JPS57166059A
JPS57166059A JP56052255A JP5225581A JPS57166059A JP S57166059 A JPS57166059 A JP S57166059A JP 56052255 A JP56052255 A JP 56052255A JP 5225581 A JP5225581 A JP 5225581A JP S57166059 A JPS57166059 A JP S57166059A
Authority
JP
Japan
Prior art keywords
solder
electronic part
lead terminal
metal
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56052255A
Other languages
Japanese (ja)
Other versions
JPH0113207B2 (en
Inventor
Hiroshi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP56052255A priority Critical patent/JPS57166059A/en
Publication of JPS57166059A publication Critical patent/JPS57166059A/en
Publication of JPH0113207B2 publication Critical patent/JPH0113207B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To realize a quick lead terminal installation and an inexpensive soldering by a method wherein a section of a lead terminal including a tip to be connected to an electronic part is pre-soldered and is abutted against by an electronic part lead terminal junction part and a hot blast capable of melting solder is applied. CONSTITUTION:A lead terminal metal 10 consists of a plurality of lead terminals 11-13 whose wide tips 15-17 are respectively provided with a round hole 18 provided by punching or etching and a belt shaped connecting board 14 connecting said lead terminals 11-13. Next, the metal 10 is dipped in a solder bath with the round holes 18 facing downward to have the round holes 18 filled with solder. The metal 10 is further lowered to have the lower half of the terminals 11-13 including the wide tips 15-17 coated with solder. Each of the wide tips 15-17 is then abutted against by the terminal end of an electronic part and sufficiently hot air is applied by a heater 25 to the junction for the solder 20 in the holes 18 to melt to realize a perfect soldering.
JP56052255A 1981-04-06 1981-04-06 Manufacture of electronic part Granted JPS57166059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56052255A JPS57166059A (en) 1981-04-06 1981-04-06 Manufacture of electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56052255A JPS57166059A (en) 1981-04-06 1981-04-06 Manufacture of electronic part

Publications (2)

Publication Number Publication Date
JPS57166059A true JPS57166059A (en) 1982-10-13
JPH0113207B2 JPH0113207B2 (en) 1989-03-03

Family

ID=12909631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56052255A Granted JPS57166059A (en) 1981-04-06 1981-04-06 Manufacture of electronic part

Country Status (1)

Country Link
JP (1) JPS57166059A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987810A (en) * 1982-11-11 1984-05-21 日本電気ホームエレクトロニクス株式会社 Method of producing electronic part
JPS59165444A (en) * 1983-03-10 1984-09-18 Toshiba Corp Fabrication of hybrid integrated circuit
JPS603145A (en) * 1983-06-20 1985-01-09 Rohm Co Ltd Lead soldering process

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987810A (en) * 1982-11-11 1984-05-21 日本電気ホームエレクトロニクス株式会社 Method of producing electronic part
JPS59165444A (en) * 1983-03-10 1984-09-18 Toshiba Corp Fabrication of hybrid integrated circuit
JPS603145A (en) * 1983-06-20 1985-01-09 Rohm Co Ltd Lead soldering process
JPS6353698B2 (en) * 1983-06-20 1988-10-25 Rohm Kk

Also Published As

Publication number Publication date
JPH0113207B2 (en) 1989-03-03

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