JPS562659A - Manufacture of electronic circuit block - Google Patents
Manufacture of electronic circuit blockInfo
- Publication number
- JPS562659A JPS562659A JP7792879A JP7792879A JPS562659A JP S562659 A JPS562659 A JP S562659A JP 7792879 A JP7792879 A JP 7792879A JP 7792879 A JP7792879 A JP 7792879A JP S562659 A JPS562659 A JP S562659A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- frame
- section
- circuit block
- calking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PURPOSE:To achieve an effetive fabrication of a circuit block by performing the following procedures: A printed wiring board is fabricated by bending the lead end of a lead frame, parts are installed by feeding them intermittently to the prescribed position, and after they are soldered, the lead is cut and bent at the frame section. CONSTITUTION:A calking section 4 is formed by bending upward the end of the lead terminal of the lead frame and it is driven by engaging the convexed section of a roller 6 to the groove 5 of a frame 3. The calking section 4 is inserted to the hole 9 of a printed wiring board 8 and a calking is performed. Then a constant feeding is given, a part 10... is installed at the prescribed position and it is fixed by soldering. Lead wire 11 is cut off at the paint near the frame 3 and bent downward 2. Thereby the circuit block is automatically assembled in very cheap cost by these method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7792879A JPS562659A (en) | 1979-06-20 | 1979-06-20 | Manufacture of electronic circuit block |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7792879A JPS562659A (en) | 1979-06-20 | 1979-06-20 | Manufacture of electronic circuit block |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS562659A true JPS562659A (en) | 1981-01-12 |
Family
ID=13647739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7792879A Pending JPS562659A (en) | 1979-06-20 | 1979-06-20 | Manufacture of electronic circuit block |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS562659A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110788255A (en) * | 2019-11-19 | 2020-02-14 | 胜美达电机(广西)有限公司 | Automatic production line |
-
1979
- 1979-06-20 JP JP7792879A patent/JPS562659A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110788255A (en) * | 2019-11-19 | 2020-02-14 | 胜美达电机(广西)有限公司 | Automatic production line |
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