JPS6454799A - Mounting structure for electronic component part - Google Patents

Mounting structure for electronic component part

Info

Publication number
JPS6454799A
JPS6454799A JP21177087A JP21177087A JPS6454799A JP S6454799 A JPS6454799 A JP S6454799A JP 21177087 A JP21177087 A JP 21177087A JP 21177087 A JP21177087 A JP 21177087A JP S6454799 A JPS6454799 A JP S6454799A
Authority
JP
Japan
Prior art keywords
terminal
frame
components
piece
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21177087A
Other languages
Japanese (ja)
Inventor
Minoru Fukumori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP21177087A priority Critical patent/JPS6454799A/en
Publication of JPS6454799A publication Critical patent/JPS6454799A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To omit the step of connecting a terminal to a printed substrate and to improve the mounting density of the components by disposing by soldering the components at predetermined positions of a conductive lead frame formed with a circuit pattern, and cutting the ends, to form the terminal. CONSTITUTION:A conductive flat lead frame 6 is punched in a predetermined circuit pattern, a terminal 7 to be connected externally out of the pattern and a terminal piece 8 are formed in advance in the frame 6. Lead inserting holes 8a of discrete components 3 are formed at the piece 8. The frame 6 is coated at its predetermined position with cream solder, and the components 2 and 3 are mounted on the surface. Then, the components are secured to the frame 6 by reflow soldering, the end of the frame 6 is cut to form the terminal 7. Then, the terminal 7 and the terminal piece 8 are bent at a right angle at the mounting side, and the component part 3 which cannot be mounted on the pattern is mounted on the piece 8.
JP21177087A 1987-08-26 1987-08-26 Mounting structure for electronic component part Pending JPS6454799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21177087A JPS6454799A (en) 1987-08-26 1987-08-26 Mounting structure for electronic component part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21177087A JPS6454799A (en) 1987-08-26 1987-08-26 Mounting structure for electronic component part

Publications (1)

Publication Number Publication Date
JPS6454799A true JPS6454799A (en) 1989-03-02

Family

ID=16611299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21177087A Pending JPS6454799A (en) 1987-08-26 1987-08-26 Mounting structure for electronic component part

Country Status (1)

Country Link
JP (1) JPS6454799A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008181989A (en) * 2007-01-24 2008-08-07 Hitachi Ltd Electronic controller

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008181989A (en) * 2007-01-24 2008-08-07 Hitachi Ltd Electronic controller

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