JPS6353698B2 - - Google Patents
Info
- Publication number
- JPS6353698B2 JPS6353698B2 JP58111438A JP11143883A JPS6353698B2 JP S6353698 B2 JPS6353698 B2 JP S6353698B2 JP 58111438 A JP58111438 A JP 58111438A JP 11143883 A JP11143883 A JP 11143883A JP S6353698 B2 JPS6353698 B2 JP S6353698B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- lead frame
- soldering
- tip
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 19
- 238000005476 soldering Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
(イ) 産業上の利用分野
本発明は、ハイブリツドICや抵抗アレイ等に
用いられる基板の端子にリードフレームを半田付
けする方法に関する。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a method for soldering a lead frame to a terminal of a substrate used for a hybrid IC, a resistor array, or the like.
(ロ) 従来技術
第１図は従来技術を説明するための説明図であ
る。基板１の上に基板搭載部品２（例えばチツプ
部品）を半田付けする際には、噴流半田槽を用い
て、半田の噴流に基板表面を接触させて基板表面
の全面を半田付けする方法を用いている。(b) Prior Art FIG. 1 is an explanatory diagram for explaining the prior art. When soldering a board-mounted component 2 (for example, a chip component) onto a board 1, a method is used in which a jet soldering tank is used and the entire surface of the board is soldered by bringing the board surface into contact with a jet of solder. ing.
そのため、基板端子３をむき出しにしたままこ
れを行うと、基板端子３にも半田が被着してしま
い、この部分にリードフレーム先端を挿入するこ
とが困難となる。 Therefore, if this is done with the board terminals 3 exposed, the solder will also adhere to the board terminals 3, making it difficult to insert the tip of the lead frame into this part.
そのため従来は噴流半田槽を通してもこの基板
端子に半田が被着しないように基板端子に予めマ
スキング等の処理を施す。そののち、噴流半田槽
により半田付けを行いそのあと、前記マスキング
を除去する。マスキングの除去後、基板端子３に
リードフレーム先端４を挿入し、再びこの部分に
半田付けを行つてリード付けを完了する。 For this reason, conventionally, the board terminals are subjected to a process such as masking in advance so that solder does not adhere to the board terminals even when the board terminals are passed through a jet soldering bath. After that, soldering is performed using a jet soldering bath, and then the masking is removed. After removing the masking, the lead frame tip 4 is inserted into the board terminal 3, and this portion is soldered again to complete the lead attachment.
このように、従来のリード付け方法の工程は煩
雑であり、ひいては電子部品の製造コストが高く
なるという欠点があつた。 As described above, the steps of the conventional lead attaching method are complicated, and the manufacturing cost of the electronic component is increased.
(ハ) 目的
本発明は基板端子をリードフレームに半田付け
をする作業を簡単化し、製造コストを低減しうる
リード付け方法を提供することを目的としてい
る。(C) Purpose It is an object of the present invention to provide a lead attaching method that can simplify the work of soldering a board terminal to a lead frame and reduce manufacturing costs.
(ニ) 構成
本発明は、先端に二また挟持部を形成したリー
ドフレームを基板端子に半田付けする方法であつ
て、基板に基板搭載部品の半田付けを行う際に半
田を基板端子に被着させたあと、基板端子及びリ
ードフレームの先端を加熱し基板端子に被着した
半田を溶融状態にして基板端子をリードフレーム
の先端に形成した二また挟持部の間に挿入するこ
とにより半田付けをするようにしたリード付け方
法である。(D) Structure The present invention is a method for soldering a lead frame having a bifurcated clamping portion at its tip to a board terminal, and is a method in which solder is applied to the board terminal when soldering components mounted on the board to the board. After that, the tips of the board terminals and lead frame are heated to melt the solder adhered to the board terminals, and the board terminals are inserted between the forked holding parts formed at the tips of the lead frames to perform soldering. This is a lead attaching method.
(ホ) 実施例
第２図は本発明に係るリード付け方法の一実施
例を示す説明図である。同図において１は基板、
２は基板搭載部品、３は基板端子、５はリードフ
レーム、４はリードフレーム５の先端、４ａはリ
ードフレーム５の先端４に形成した二また挟持
部、６は前棋基板端子に被着した半田、７は半田
６の両側にこれを挟むように位置せしめた加熱ガ
ス噴出パイプである。(E) Embodiment FIG. 2 is an explanatory diagram showing an embodiment of the lead attaching method according to the present invention. In the same figure, 1 is a substrate;
2 is a board mounting component, 3 is a board terminal, 5 is a lead frame, 4 is the tip of the lead frame 5, 4a is a bifurcated holding part formed at the tip 4 of the lead frame 5, and 6 is attached to the Maegi board terminal. The solder 7 is a heated gas jet pipe placed on both sides of the solder 6 so as to sandwich it therebetween.
つぎに、作業の手順について以下説明する。 Next, the procedure of the work will be explained below.
まず、基板１上に搭載された基板搭載部品２
は噴流半田槽を通つて半田付けされ、基板端子
３にも半田６が被着される。 First, board-mounted components 2 mounted on board 1
are soldered through a jet solder bath, and solder 6 is also applied to the board terminals 3.
前記加熱ガス噴出パイプ７を用いて、基板端
子３の両側より基板端子３及びリードフレーム
先端４に向かつて、約300〜400度Ｃに加熱され
た窒素ガスを噴出させることにより、前記半田
６を溶融せしめる。 The solder 6 is removed by blowing out nitrogen gas heated to approximately 300 to 400 degrees Celsius from both sides of the board terminal 3 toward the board terminal 3 and the lead frame tip 4 using the heated gas blowing pipe 7. Let it melt.
そののち、基板端子３をリードフレーム５の
先端４に形成した二また挟持部４ａの間に挿入
し、引続き加熱することによつてリードフレー
ム先端４は基板端子３に半田付けされる。 Thereafter, the lead frame end 4 is soldered to the board terminal 3 by inserting the board terminal 3 between the bifurcated clamping portions 4a formed at the tip 4 of the lead frame 5 and continuing to heat it.
なお、第２図に示した実施例では基板端子の
加熱方法として高温の窒素ガスを使用したが、
これは例えば赤外線を照射する方法であつても
よい。 In addition, in the example shown in FIG. 2, high temperature nitrogen gas was used as a heating method for the board terminals.
This may be, for example, a method of irradiating with infrared rays.
また、上記実施例では、基板の片面のみ半田
付けをおこなつているがこれに限定されず、基
板の両面に基板搭載部品をとりつける場合であ
つてもよい。 Further, in the above embodiment, soldering is performed only on one side of the board, but the present invention is not limited to this, and board-mounted components may be attached to both sides of the board.
(ヘ) 効果
本発明に係るリード付け方法によれば、基板端
子のマスキングや、それを取り除く工程及びその
のちのリードフレーム先端を別途基板端子に半田
付けする工程を省くことができるので、工程数が
減少し、製造コストを低減させることができる。(f) Effects According to the lead attaching method of the present invention, it is possible to omit the process of masking and removing the board terminals, and the subsequent process of separately soldering the tip of the lead frame to the board terminals, thereby reducing the number of steps. is reduced, and manufacturing costs can be reduced.
第１図は従来のリード付け方法の説明図、第２
図は本発明のリード付け方法の一実施例の説明図
である。
１……基板、２……基板搭載部品、３……基板
端子、４……先端、４ａ……二また挟持部、５…
…リードフレーム、６……半田、７……加熱ガス
噴出パイプ。
Figure 1 is an explanatory diagram of the conventional lead attachment method, Figure 2
The figure is an explanatory diagram of an embodiment of the lead attaching method of the present invention. DESCRIPTION OF SYMBOLS 1... Board, 2... Board mounted component, 3... Board terminal, 4... Tip, 4a... Bifurcated holding part, 5...
...Lead frame, 6...Solder, 7...Heated gas jet pipe.
Claims (1)
ムを基板端子に半田付けする方法であつて、基板
に基板搭載部品の半田付けを行う際に半田を前記
基板端子に被着させたあと、前記基板端子及びリ
ードフレームの先端を加熱し前記基板端子に被着
した半田を溶融状態にして前記基板端子を前記リ
ードフレームの先端に形成した二また挟持部の間
に挿入することにより半田付けをすることを特徴
とするリード付け方法。1. A method of soldering a lead frame having a bifurcated clamping portion at its tip to a board terminal, in which when soldering components mounted on a board to a board, solder is applied to the board terminal, and then the lead frame is soldered to the board terminal. Soldering is performed by heating the terminal and the tip of the lead frame to melt the solder adhered to the board terminal, and inserting the board terminal between the forked holding parts formed at the tip of the lead frame. A lead attachment method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11143883A JPS603145A (en) | 1983-06-20 | 1983-06-20 | Lead soldering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11143883A JPS603145A (en) | 1983-06-20 | 1983-06-20 | Lead soldering process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS603145A JPS603145A (en) | 1985-01-09 |
| JPS6353698B2 true JPS6353698B2 (en) | 1988-10-25 |
Family
ID=14561197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11143883A Granted JPS603145A (en) | 1983-06-20 | 1983-06-20 | Lead soldering process |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS603145A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57166059A (en) * | 1981-04-06 | 1982-10-13 | Murata Mfg Co Ltd | Manufacture of electronic part |
-
1983
- 1983-06-20 JP JP11143883A patent/JPS603145A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57166059A (en) * | 1981-04-06 | 1982-10-13 | Murata Mfg Co Ltd | Manufacture of electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS603145A (en) | 1985-01-09 |
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