JPS63194866A - Soldering method for electronic component - Google Patents

Soldering method for electronic component

Info

Publication number
JPS63194866A
JPS63194866A JP62027154A JP2715487A JPS63194866A JP S63194866 A JPS63194866 A JP S63194866A JP 62027154 A JP62027154 A JP 62027154A JP 2715487 A JP2715487 A JP 2715487A JP S63194866 A JPS63194866 A JP S63194866A
Authority
JP
Japan
Prior art keywords
lead
soldering
cream solder
fpic
creamy solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62027154A
Other languages
Japanese (ja)
Inventor
Hitoshi Tsuchiya
均 土屋
Hiroshi Koizumi
洋 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62027154A priority Critical patent/JPS63194866A/en
Publication of JPS63194866A publication Critical patent/JPS63194866A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To prevent a bridge and defective wetting and to enable a soldering with less generations of soldering balls by projecting a laser beam on the position displaced from a creamy solder for the lead of an electronic component. CONSTITUTION:A creamy solder 10 is coated so as to cross the circuit pattern 1 formed in parallel corresponding to the lead 4 of FPIC3 on the flat package semiconductor integrated circuit (FPIC) fitting position of a printed circuit board. The FPIC3 is mounted by locating to the FPIC fitting position to press- weld lead 4 to the creamy solder 10 with pressure. Thereafter, the lead 4 is heated by projecting in order the laser beam on its tip part to perform a soldering by melting the creamy solder 10 by its heating by the heat conduction from the lead 4. When the creamy solder is melted by heating the lead 4, the soldering starts after sufficiently heating the lead 4 and circuit pattern to prevent a bridge and defective wetting.

Description

【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） この発明は、フラットパッケージ半導体集積回路などの
リード付き電子部品のはんだ付け方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a method for soldering leaded electronic components such as flat package semiconductor integrated circuits.

（従来の技術） フラットパッケージ半導体集積回路（以下ＦＰＩＣと略
称する）の印刷配線板へのはんだ付けは、第４図に示す
ように、ＦＰＩＣの取付け位置にＦＰＩＣの複数本のリ
ードに対応して並列形成された印刷配線板の回路パター
ン（１）を横切る如く、クリームはんだ■を塗布したの
ち、第５図に示すように、そのＦＰＩＣ取付け位置にＦ
ＰＩＣ■を位置決め搭載する。この場合、従来は、クリ
ームはんだ■をＦ　Ｐ　Ｉ　Ｃ（３）に対してそのリー
ドＧ）の先端部と接触するように塗布している。つぎに
、このＦ　Ｐ　Ｉ　Ｃ（３）を図示しない抑圧具で加圧
してリード（へ）をクリームはんだ（２）に圧接させ、
その後、第６図に矢印０で示すように、順次その接触部
すなわちクリームはんだ■とリード（へ）の先端部に、
たとえばレーザ光を直接照射して加熱することによりは
んだ付けしている。(Prior art) When soldering a flat package semiconductor integrated circuit (hereinafter abbreviated as FPIC) to a printed wiring board, as shown in Fig. 4, the mounting position of the FPIC is connected to the multiple leads of the FPIC. After applying cream solder (■) across the circuit pattern (1) of the printed wiring board formed in parallel, as shown in Figure 5, apply F to the FPIC mounting position.
Position and mount PIC■. In this case, conventionally, cream solder (2) is applied to the F P IC (3) so as to come into contact with the tip of the lead G). Next, pressurize this F P I C (3) with a suppressor (not shown) to press the lead (to) to the cream solder (2),
Then, as shown by arrow 0 in Figure 6, the contact area, that is, the cream solder ■ and the tip of the lead, are
For example, soldering is performed by direct irradiation with laser light and heating.

しかし、上記方法によりはんだ付けをおこなうと、リー
ド（イ）が十分に予熱されないうちにクリームはんだ■
が溶融してはんだ付けが始まるため。However, when soldering is performed using the above method, the cream solder ■
melts and begins soldering.

ブリッジやぬれ不良を生じ、またはんだボールを発生す
る。また、クリームはんだ■を直接加熱するため、クリ
ームはんだ■内の有機溶剤が突沸してそれが原因ではん
だボールを発生することもある。Bridging and poor wetting occur, resulting in solder balls. In addition, since the cream solder (■) is directly heated, the organic solvent in the cream solder (■) may bump, which may generate solder balls.

（発明が解決しようとする問題点） 上記のように、従来のリード付き電子部品の印刷配線板
へのはんだ付けは、印刷配線板にクリームはんだを塗布
し、このクリームはんだ上にＦＰＩＣを位置決め搭載し
たのち、そのクリームはんだとリードとの接触部を直接
レーザ光を照射するため、リードが十分に加熱されない
うちにクリームはんだが溶融してはんだ付けが始まり、
それが原因でブリッジやぬれ不良を生じ、またはんだボ
ールを発生する。また、クリームはんだを直接加熱する
ため、クリームはんだ内の有機溶剤が突沸してはんだボ
ールを発生するという問題点がある。(Problems to be Solved by the Invention) As described above, conventional soldering of electronic components with leads to a printed wiring board involves applying cream solder to the printed wiring board, and positioning and mounting the FPIC on the cream solder. After that, the laser beam is directly applied to the contact area between the cream solder and the lead, so the cream solder melts and soldering begins before the lead is sufficiently heated.
This causes bridging, poor wetting, and solder balls. Furthermore, since the cream solder is directly heated, there is a problem in that the organic solvent in the cream solder bumps and generates solder balls.

この発明は、上記問題点を解決するためになされたもの
であり、リード付き電子部品のはんだ付けにおいて、ブ
リッジやぬれ不良を発生せず、なおかつはんだボールの
発生が少いはんだ付け方法をうろことを目的とする。The present invention has been made to solve the above problems, and aims to provide a soldering method that does not cause bridging or wetting defects and generates fewer solder balls when soldering electronic components with leads. With the goal.

〔発明の構成〕[Structure of the invention]

（問題点を解決するための手段） 印刷配線板の回路パターンにクリームはんだを塗布し、
このクリームはんだの塗布部にリード付き電子部品を搭
載したのち、レーザ光を照射して加熱することにより上
記電子部品を上記印刷配線板にはんだ付けする方法にお
いて、上記電子部品のリードに対して、上記クリームは
んだからずれた位置にレーザ光を照射するようにした。(Means to solve the problem) Apply cream solder to the circuit pattern of the printed wiring board,
In the method of mounting an electronic component with leads on the cream solder application area and then soldering the electronic component to the printed wiring board by irradiating and heating the electronic component with a laser beam, the leads of the electronic component are soldered. The laser beam was irradiated to a position offset from the cream solder.

（作　用） 上記のように、クリームはんだからずれた位置にレーザ
光を照射して、主として電子部品のリードを優先的に加
熱すると、リードを十分に加熱してからはんだ付けが始
まるようにすることができ、ブリッジやぬれ不良を発生
せず、かつはんだボールの発生が少いはんだ付けをおこ
なうことができる。(Function) As mentioned above, by irradiating a laser beam at a position shifted from the cream solder and preferentially heating the leads of electronic components, the leads can be sufficiently heated before soldering can begin. This makes it possible to perform soldering without bridging or poor wetting, and with fewer solder balls.

（実施例） 以下、図面を参照してこの発明を実施例に基づいて説明
する。(Example) Hereinafter, the present invention will be described based on an example with reference to the drawings.

第１図ないし第３図は、ＦＰＩＣを印刷配線板にはんだ
付けする一実施例の説明図である。まず、第１図に示す
ように、印刷配線板のＦＰＩＣ取付け位置に、Ｆ　Ｐ　
Ｉ　Ｃ（３）のリード（イ）に対応して並列形成された
回路パターン■を横切る如く、クリームはんだ（１０）
を塗布する。このクリームはんだ（１０）の塗布位置は
、後述するようにこのクリームはんだ（１０）上に位置
決め搭載されるＦＰＩＣ■に対して、そのリード０）の
基部の折曲げ部と接触する位置とする。1 to 3 are explanatory diagrams of an embodiment in which an FPIC is soldered to a printed wiring board. First, as shown in Figure 1, place an F P
Apply cream solder (10) across the circuit pattern ■ formed in parallel corresponding to the lead (A) of IC (3).
Apply. The cream solder (10) is applied at a position where it comes into contact with the bent portion of the base of the lead 0) of the FPIC (2) positioned and mounted on the cream solder (10), as will be described later.

つぎに、第２図に示すように、上記印刷配線板のＦＰＩ
Ｃ取付け位置に、ＦＰＩＣ■を位置決め搭載し、かつ１
図示しない抑圧具により加圧して、そのリードＯ）を上
記クリームはんだ（１０）に圧接させる。Next, as shown in FIG. 2, the FPI of the printed wiring board is
Position and mount the FPIC■ in the C installation position, and 1
Pressure is applied using a suppressor (not shown) to bring the lead O) into pressure contact with the cream solder (10).

この押圧具は、好ましくはＦＰＩＣ本体部分（３ａ）を
冷却するものがよい。しかるのち、第３図に矢印（ハ）
で示すように、リード（イ）の先端部にたとえばレーザ
光を順次照射してリード＠）を加熱する。そして、主と
してこのリード（イ）からの熱伝導によりクリームはん
だ（１０）を加熱溶融させ、はんだ付けする。This pressing tool is preferably one that cools the FPIC main body portion (3a). After that, the arrow (c) appears in Figure 3.
As shown in (a), the tip of the lead (a) is sequentially irradiated with, for example, a laser beam to heat the lead (@). Then, the cream solder (10) is heated and melted mainly by heat conduction from this lead (A) and soldered.

ところで、上記のようにクリームはんだ（１０）からず
れた位置にレーザ光を照射して、リード０）を優先的に
加熱してクリームはんだを溶融させると。By the way, as described above, if a laser beam is irradiated to a position shifted from the cream solder (10), lead 0) is heated preferentially and the cream solder is melted.

リード■および回路パターンを十分に加熱したのちには
んだ付けが始まるようにすることができ。Soldering can be started after the leads and circuit pattern have been sufficiently heated.

従来クリームはんだおよびリードをともに直接加熱して
いたためにクリームはんだが急速に加熱され、リードと
の間の湿度差が原因で発生したブリッジやぬれ不良を防
止することができる。また、はんだボールの発生も少く
、しかも、フラットパッケージの封止部とリードの間の
実害のない部分に生じ、所要のはんだ付けをおこなうこ
とができる。Conventionally, both the cream solder and the leads were directly heated, so the cream solder is heated rapidly, and it is possible to prevent bridging and poor wetting caused by humidity differences between the cream solder and the leads. In addition, solder balls are less likely to be generated, and moreover, solder balls are generated in a harmless part between the sealing part of the flat package and the leads, so that the required soldering can be performed.

なお、上記実施例では、ＦＰＩＣのはんだ付けについて
述べたが、この発明は、他のリード付き電子部品のはん
だ付けにも適用できる。In the above embodiment, soldering of FPIC was described, but the present invention can also be applied to soldering of other leaded electronic components.

〔発明の効果〕〔Effect of the invention〕

印刷配線板の回路パターンにクリームはんだを塗布して
リード付き電子部品をレーザ光の照射によりはんだ付け
する方法において、電子部品のリードに対して、クリー
ムはんだからずれた位置にレーザ光を照射して、リード
を優先的に加熱することにより、十分に加熱してからは
んだ付けが始まるようにしたので、従来リードが十分に
加熱されないうちにはんだ付けが始まるために発生した
ブリッジやぬれ不良を防止し、かつはんだボールの発生
が少い所要のはんだ付けをおこなうことができる。In the method of applying cream solder to the circuit pattern of a printed wiring board and soldering electronic components with leads by irradiating laser light, the laser light is irradiated onto the leads of the electronic components at a position shifted from the cream solder. By heating the leads preferentially, we have made it possible to start soldering after sufficiently heating them, which prevents bridging and poor wetting that conventionally occur when soldering starts before the leads are sufficiently heated. , and it is possible to perform the required soldering with less generation of solder balls.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ないし第３図はそれぞれこの発明の一実施例であ
るＦＰＩＣの印刷配線板へのはんだ付け方法を説明する
ための図、第４図ないし第６図はそれぞれ従来のＦＰＩ
Ｃの印刷配線板へのはんだ付け方法を説明するための図
である。 （１）・・・回路パターン ■・・・ＦＰＩＣ（フラットパッケージ半導体集積回路
）（イ）・・・リード　　　　　　（１０）・・・クリ
ームはんだ第１図 第　　２　　図 第　　３　　図1 to 3 are diagrams for explaining a method of soldering an FPIC, which is an embodiment of the present invention, to a printed wiring board, and FIGS.
FIG. 3 is a diagram for explaining a method of soldering C to a printed wiring board. (1)...Circuit pattern ■...FPIC (Flat Package Semiconductor Integrated Circuit) (A)...Lead (10)...Cream solder Figure 1 Figure 2 Figure 3

Claims (2)

【特許請求の範囲】[Claims] （１）印刷配線板の回路パターンにクリームはんだを塗
布し、このクリームはんだの塗布部にリード付き電子部
品を搭載したのち、レーザ光を照射して加熱することに
より上記電子部品を上記印刷配線板にはんだ付けする電
子部品のはんだ付け方法において、上記電子部品のリー
ドに対して上記クリームはんだからずれた位置にレーザ
光を照射することを特徴とする電子部品のはんだ付け方
法。(1) Apply cream solder to the circuit pattern of the printed wiring board, mount electronic components with leads on the area where the cream solder is applied, and then irradiate and heat the electronic components with laser light to attach the electronic components to the printed wiring board. A method for soldering electronic components, the method comprising: irradiating a lead of the electronic component with a laser beam at a position offset from the cream solder. （２）印刷配線板の回路パターンに対してクリームはん
だを電子部品のリード基部と対向する部分に塗布し、レ
ーザ光を上記リードの先端部側に照射することを特徴と
する特許請求の範囲第１項記載の電子部品のはんだ付け
方法。(2) Cream solder is applied to the circuit pattern of the printed wiring board on a portion facing the lead base of the electronic component, and a laser beam is irradiated onto the tip end side of the lead. A method for soldering electronic components as described in item 1.
JP62027154A 1987-02-10 1987-02-10 Soldering method for electronic component Pending JPS63194866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62027154A JPS63194866A (en) 1987-02-10 1987-02-10 Soldering method for electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62027154A JPS63194866A (en) 1987-02-10 1987-02-10 Soldering method for electronic component

Publications (1)

Publication Number Publication Date
JPS63194866A true JPS63194866A (en) 1988-08-12

Family

ID=12213132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62027154A Pending JPS63194866A (en) 1987-02-10 1987-02-10 Soldering method for electronic component

Country Status (1)

Country Link
JP (1) JPS63194866A (en)

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