JPS5985394A - Cream solder - Google Patents

Cream solder

Info

Publication number
JPS5985394A
JPS5985394A JP57195377A JP19537782A JPS5985394A JP S5985394 A JPS5985394 A JP S5985394A JP 57195377 A JP57195377 A JP 57195377A JP 19537782 A JP19537782 A JP 19537782A JP S5985394 A JPS5985394 A JP S5985394A
Authority
JP
Japan
Prior art keywords
solder
circuit board
printed circuit
cream solder
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57195377A
Other languages
Japanese (ja)
Inventor
Yukitsugu Kobata
木幡　幸嗣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Original Assignee
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENJIYU KINZOKU KOGYO KK, Senju Metal Industry Co Ltd filed Critical SENJIYU KINZOKU KOGYO KK
Priority to JP57195377A priority Critical patent/JPS5985394A/en
Publication of JPS5985394A publication Critical patent/JPS5985394A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To provide solder for electronic apparatus having reliability without dislodging of chip parts by adding a material which cures by heat and UV light in the cream solder. CONSTITUTION:Titled cream solder is prepd. by adding a material which cures by heat or irradiation of UV light such as an epoxy adhesive agent to the cream solder prepd. by mixing intimately a liquid flux and powder solder. If chip parts are soldered to a hybrid printed circuit board by using such solder, the flux residue remaining in a way as to cover the soldered parts after reflowing of the solder has an adhesive effect. Thus the flux residue fixes the chip parts and the printed circuit board. Even if the soldered parts of the chip parts contact with molten solder in a post stage, the chip parts remain without stripped and stay put in the prescribed position.

Description

【発明の詳細な説明】 本発明は液状フラックスと粉末はんだを混和して得られ
るクリーム状はんだ、特に電子機器のはんだ付けに用い
るクリームはんだに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to creamy solder obtained by mixing liquid flux and powdered solder, particularly creamy solder used for soldering electronic devices.

近時、電子機器にはリードのないチップ部品とリードを
有するディスクリート部品をプリント基板の両面に搭載
する所謂混載が行われている。BACKGROUND ART In recent years, so-called mixed mounting of electronic devices has been carried out in which chip components without leads and discrete components with leads are mounted on both sides of a printed circuit board.

斯様に電子部品が混載されたプリント基板のはんだ付け
は、先ずプリント基板裏面のランド間に接着剤を塗布し
、該接着剤でチップ部品の中央部を接着する。次にプリ
ント基板の表面からスルーホールにディスクリート部品
のリードを挿入した後、裏面にはんだ付は用フラフクス
を塗布し予備加熱してから該裏面を溶融はんだに接触さ
せてチップ部品とランド、およびディスクリート部品と
ランドとを一度にはんだ付けしていた。このはんだ付は
方法はチップ部品およびディスクリート部品が一度のは
んだ付けで全て行えるという合理的なものであるが、は
んだ付は時フラツクスが加熱されてガス化したものや残
留空気がチップ部品の電極部に留まってしまうと溶融は
んだが電極部に侵入できなくなってはんだ付は不良とな
ることがある。To solder a printed circuit board on which electronic components are mixedly mounted in this manner, an adhesive is first applied between the lands on the back surface of the printed circuit board, and the center portion of the chip component is bonded with the adhesive. Next, after inserting the leads of the discrete components into the through holes from the front surface of the printed circuit board, apply soldering flux to the back side, preheat it, and then bring the back side into contact with molten solder to connect the chip components, lands, and discretes. The parts and lands were soldered at the same time. This soldering method is a rational method that allows chip components and discrete components to be soldered all at once. If the molten solder remains in the contact area, the molten solder may not be able to penetrate into the electrode portion, resulting in poor soldering.

上述のようなガスや残留空気によるはんだ付は不良を回
避するために最近ではチップ部品だけを先にはんだ付け
しておくことが提案され良好な結果を得ている。チップ
部品を先にはんだ付けするにはクリームはんだを用いて
行うが、クリームはんだを用いた一連のはんだ付は方法
は次のような工程で行われている（図）。In order to avoid defects in soldering using gas or residual air as described above, it has recently been proposed to solder only the chip components first, and good results have been obtained. Cream solder is used to solder chip components first, and a series of soldering using cream solder is performed in the following steps (see figure).

■チップ部品搭載部のランド（１）　、　（１）間に接
着剤（２）を塗布する。■Apply adhesive (2) between lands (1) and (1) of the chip component mounting area.

■チップ部品搭載部のランド（１１、（１）上にクリー
ムはんだ（３）　、　（３）を塗布する。■Apply cream solder (3), (3) on the land (11, (1)) of the chip component mounting area.

■チップ部品（４）の両端電極とクリームはんだ（３）
。■Both electrodes of chip component (4) and cream solder (3)
.

（３）が接触し、さらにチップ部品の中央部と接着剤（
２）が接着するようにして上記ランド上にチップ部品を
搭載する。(3) comes into contact with the central part of the chip component and the adhesive (
2) Mount the chip component on the land so that it adheres.

■チップ部品が搭載されたプリント基板を電気炉、赤外
線照射等の加熱手段により加熱してクリームはんだをリ
フローさせる。■Heat the printed circuit board on which the chip components are mounted using heating means such as an electric furnace or infrared irradiation to reflow the cream solder.

■クリームはんだのりフローでチップ部品とランドとが
はんだ付けされたプリント基板の表面からスルーホール
を通してディスクリート部品（５）のリードを挿入する
。■Insert the lead of the discrete component (5) through the through-hole from the surface of the printed circuit board to which the chip component and land are soldered using cream solder flow.

０表面にディスクリート部品（５）が搭載されたプリン
ト基板の裏面にフシックスを塗布し、該裏面を溶融はん
だに接触させてディスクリート部品のリードとランドと
をはんだ付けする。Fusix is applied to the back surface of the printed circuit board on which the discrete component (5) is mounted, and the back surface is brought into contact with molten solder to solder the leads and lands of the discrete component.

上記方法において■の工程で塗布する接着剤がプリント
基板の不必要な箇所に付いてしまうと電子機器の不良の
原因となることがある。つまシ、接着剤がはんだ付は部
やコネクターに付着すると通電状態を悪くしてしまうか
らである。従って、接着剤の塗布は慎重に行わなくては
ならず、できれば接着剤を単体で使用しないことが好ま
しいものである。In the above method, if the adhesive applied in step (2) gets attached to unnecessary parts of the printed circuit board, it may cause a defect in the electronic device. This is because if the tabs or adhesive adhere to soldering parts or connectors, the electrical conductivity will deteriorate. Therefore, the adhesive must be applied carefully, and if possible, it is preferable not to use the adhesive alone.

本発明は前述クリームはんだをチップ部品のはんだ付け
として用いる混載プリント基板のはんだ付は方法におい
て、クリームはんだをリフローした後、はんだ付は部に
はんだを覆うようにして残るフラックス残渣に接着効果
を付与し、フラックス残渣でチップ部品とプリント基板
を固定して、後工程で該チップ部品のはんだ付は部が溶
融はんだに接触してもチップ部品が剥れることなく所定
の位置に留まっていられるようにしたことを技術思想と
しだものである。The present invention is a method for soldering a mixed printed circuit board using the cream solder as described above for soldering chip components, and after reflowing the cream solder, the adhesive effect is imparted to the flux residue remaining in the soldering area so as to cover the solder. Then, by fixing the chip components and the printed circuit board with flux residue, the chip components can be soldered in a later process so that they will remain in place without peeling even if the parts come into contact with molten solder. What he did is considered a technical idea.

本発明者は、エポキシ系接着剤は加熱するととＫより硬
化し、また紫外線硬化型接着剤は紫外線の照射で硬化す
ることに着目して本発明を完成させた。The present inventor completed the present invention by focusing on the fact that epoxy adhesives are cured by K when heated, and that ultraviolet curable adhesives are cured by irradiation with ultraviolet rays.

本発明の特徴とするところは、クリームはんだ中に加熱
、或いは紫外線照射により硬化する物質を添加したこと
にある。The feature of the present invention is that a substance that is hardened by heating or ultraviolet irradiation is added to the cream solder.

以下実施例を説明する。Examples will be described below.

実施例１ 重合ロジン　　　　　　　　　　　６，８重量係イング
ロピルアミンＨＢｒ　　　　　　ｏ、　２重量％ブチ、
ルセロソルプ　　　　　　　　８．０重量％−液性エポ
キシ糸摘着剤　　　　１０．０重量％Ｐｂ　−６０Ｓｎ
　ハんだ粉　　　　　　８０．０重量％上記組成のクリ
ームはんだをプリント基板裏面のランド間に塗布し、該
塗布部にチップ部品を搭載して遠赤外線の電気炉で１２
０　℃、２０秒間予備加熱を行い、その後近赤外線を用
いた加熱装置で２１０℃、５秒間加熱してクリームはん
だのりフローを行なった。そして該プリント基板を電気
炉で１５０℃、１０分間加熱処理を行なってフラックス
残渣を硬化させた。次にプリント基板の表面からディス
クリート部品のリードをスルーホールに挿入し、裏面に
フランクスを塗布した後、予備加熱を行ない、２５０℃
の溶融はんだに接触させてディスクリート部品のリード
とランドとをはんだ付けした。Example 1 Polymerized rosin 6,8 weight percent ingropylamine HBr o, 2% by weight butylene,
Lucerosolp 8.0% by weight - Liquid epoxy thread picker 10.0% by weight Pb -60Sn
Solder powder 80.0% by weight A cream solder having the above composition was applied between the lands on the back of the printed circuit board, a chip component was mounted on the applied area, and a far-infrared electric furnace was used for 12 hours.
Preheating was performed at 0° C. for 20 seconds, and then heating was performed at 210° C. for 5 seconds using a heating device using near-infrared rays to perform cream solder paste flow. The printed circuit board was then heat-treated at 150° C. for 10 minutes in an electric furnace to harden the flux residue. Next, insert the leads of the discrete components into the through holes from the front surface of the printed circuit board, apply Franks to the back surface, and preheat to 250℃.
The leads and lands of the discrete components were soldered by contacting the molten solder.

はんだ付は後のプリント基板の裏面を観察したところチ
ップ部品の脱落は全く見られず、またディスクリート部
品、チップ部品とも全て良好なはんだ付けとなっていた
。When the back side of the printed circuit board was observed after soldering, no chip components were observed to have fallen off, and both discrete components and chip components were all soldered well.

実施例２ ＷＷロジン　　　　　　　　　　　４．０重量係エチル
アミンＨＢｒ　　　　　　　　　Ｏ，２重量係ブチルセ
ロソルブ　　　　　　　　２．８重量％紫外線硬化型接
着剤　　　　　　１３．０重量％Ｐｂ　−６０Ｓｎはん
だ粉　　　　　　　８０，０重量％上記組成のクリーム
はんだを実施例１と同様にして塗布、リフロー後、１０
０ｍＷ４の高圧水銀燈下で１５秒間紫外線を照射してフ
ラックス残渣を硬化させた。次に実施例１と同様にディ
スクリート部品を溶融はんだではんだ付けしだ後、プリ
ント基板の裏面を観察したところ、チップ部品の脱落は
全くなく、シかもディスクリート部品、チップ部品とも
全て良好なはんだ付けとなっていた。Example 2 WW rosin 4.0% by weight Ethylamine HBr O.2% by weight Butyl cellosolve 2.8% by weight Ultraviolet curing adhesive 13.0% by weight Pb -60Sn solder powder 80.0% by weight Cream solder having the above composition was implemented. After coating and reflowing in the same manner as Example 1, 10
The flux residue was cured by irradiating ultraviolet light for 15 seconds under a high-pressure mercury lamp of 0 mW4. Next, as in Example 1, after soldering the discrete components with molten solder, we observed the back side of the printed circuit board and found that no chip components had fallen off. It became.

以上説明した如く、本発明クリームはんだはクリームは
んだリフロー後、該リフローによるはんだ付は部を加熱
、或いは紫外線照射処理するだけでフランクス残渣が硬
化するため、その後のはんだ付は工程においてもチップ
部品が脱落することなく信頼のある電子機器が得られる
ものである。As explained above, in the cream solder of the present invention, after the cream solder reflow, the Franks residue is hardened simply by heating or UV irradiation of the soldering part, so that the chip parts are not damaged during the subsequent soldering process. A reliable electronic device can be obtained without falling off.

【図面の簡単な説明】[Brief explanation of the drawing]

図は従来のクリームはんだを用いた混載プリント基板の
はんだ付は方法を説明する図である。 特許出願人 千住金属工業株式会社 ４６５−The figure is a diagram illustrating a method for soldering a mixed printed circuit board using conventional cream solder. Patent applicant Senju Metal Industry Co., Ltd. 465-

Claims (1)

【特許請求の範囲】[Claims] （１）　　クリームはんだ中に加熱、或いは紫外線照射
により硬化する物質を添加したことを特徴とするクリー
ムはんだ。 はんだ。(1) A cream solder characterized by adding a substance that hardens by heating or ultraviolet irradiation into the cream solder. Solder.
JP57195377A 1982-11-09 1982-11-09 Cream solder Pending JPS5985394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57195377A JPS5985394A (en) 1982-11-09 1982-11-09 Cream solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57195377A JPS5985394A (en) 1982-11-09 1982-11-09 Cream solder

Publications (1)

Publication Number Publication Date
JPS5985394A true JPS5985394A (en) 1984-05-17

Family

ID=16340151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57195377A Pending JPS5985394A (en) 1982-11-09 1982-11-09 Cream solder

Country Status (1)

Country Link
JP (1) JPS5985394A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037357A (en) * 2001-07-26 2003-02-07 Matsushita Electric Ind Co Ltd Soldering method and heating unit
WO2007018288A1 (en) * 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. Lead free solder paste and application thereof
JP2007237271A (en) * 2006-03-10 2007-09-20 Alps Electric Co Ltd Solder adhesive, and electronic component mounting structure using the same
US9053402B2 (en) 2007-05-14 2015-06-09 Tateyama Kagaku Industry Co., Ltd. Wireless IC tag and method for manufacturing wireless IC tag

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181993A (en) * 1975-01-17 1976-07-17 Tamura Toshimichi KAITENSHIKI DENRYUKAIROSETSUZOKUKI

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181993A (en) * 1975-01-17 1976-07-17 Tamura Toshimichi KAITENSHIKI DENRYUKAIROSETSUZOKUKI

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037357A (en) * 2001-07-26 2003-02-07 Matsushita Electric Ind Co Ltd Soldering method and heating unit
WO2007018288A1 (en) * 2005-08-11 2007-02-15 Senju Metal Industry Co., Ltd. Lead free solder paste and application thereof
JP4894758B2 (en) * 2005-08-11 2012-03-14 千住金属工業株式会社 Lead-free solder paste and its application
US8227536B2 (en) 2005-08-11 2012-07-24 Senju Metal Industry Co., Ltd. Lead-free solder paste and its use
JP2007237271A (en) * 2006-03-10 2007-09-20 Alps Electric Co Ltd Solder adhesive, and electronic component mounting structure using the same
JP4676907B2 (en) * 2006-03-10 2011-04-27 アルプス電気株式会社 Electronic component mounting structure using solder adhesive and solder adhesive
US9053402B2 (en) 2007-05-14 2015-06-09 Tateyama Kagaku Industry Co., Ltd. Wireless IC tag and method for manufacturing wireless IC tag

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