JPH0951157A - Electronic-component mounting method and electronic part used in method thereof - Google Patents
Electronic-component mounting method and electronic part used in method thereofInfo
- Publication number
- JPH0951157A JPH0951157A JP20012395A JP20012395A JPH0951157A JP H0951157 A JPH0951157 A JP H0951157A JP 20012395 A JP20012395 A JP 20012395A JP 20012395 A JP20012395 A JP 20012395A JP H0951157 A JPH0951157 A JP H0951157A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- electronic
- conductive paste
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Tunnel Furnaces (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子回路基板へ実
装を行う電子部品の実装方法とこの実装方法に使用する
電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for mounting on an electronic circuit board and an electronic component used in this mounting method.
【０００２】[0002]
【従来の技術】近年、環境保護の観点から、はんだ材料
（Ｓｎ−Ｐｂ系合金）中に含まれる鉛を減少させること
に関心が注がれている。鉛全使用量に占めるはんだ材料
中の鉛の量は少ない（１％未満）が、鉛が使用されてい
る電子機器の廃棄物が酸性雨にさらされると、有害物質
である鉛が溶出して地下水を汚染することがあり、環境
を悪化させるおそれがある。このような事態を避けるた
め、電子機器の回路形成用材料として、はんだ材料に置
き替わる材料が求められている。2. Description of the Related Art Recently, from the viewpoint of environmental protection, attention has been focused on reducing the lead contained in solder materials (Sn-Pb alloys). The amount of lead in the solder material in the total amount of lead used is small (less than 1%), but when the waste of electronic equipment that uses lead is exposed to acid rain, lead, which is a harmful substance, elutes. May pollute groundwater and cause environmental degradation. In order to avoid such a situation, a material replacing a solder material is required as a material for forming a circuit of an electronic device.
【０００３】その代替材料の候補としては銅、ニッケ
ル、銀、銀／パラジウムなどの粉体をエポキシ樹脂など
のバインダー中に分散させた導電性ペーストが挙げられ
る。導電性ペーストは印刷機やディスペンサーにより供
給され、接点同士が接続された状態で熱硬化を行って、
接合を完了させる。As a candidate for the substitute material, there is a conductive paste obtained by dispersing powder of copper, nickel, silver, silver / palladium or the like in a binder such as an epoxy resin. The conductive paste is supplied by a printing machine or dispenser, and heat-cured while the contacts are connected,
Complete the joining.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、前述の
ような導電性ペーストによる接合部分の強度は一般的に
弱く、高温恒湿試験やヒートサイクル試験などの信頼性
評価結果においても充分な結果は得られない。そのた
め、接合部のまわりを封止材料などで封止する必要があ
り、はんだ付けする場合と比較すると工程が増えてリー
ドタイムが長くかかるという問題点を有していた。However, the strength of the joint portion made of the conductive paste as described above is generally weak, and sufficient results are obtained even in the reliability evaluation results such as the high temperature constant humidity test and the heat cycle test. I can't. Therefore, it is necessary to seal the periphery of the joint with a sealing material or the like, and there is a problem that the number of steps is increased and the lead time is long as compared with the case of soldering.
【０００５】本発明は上記従来の問題点を解決するもの
で、従来のはんだ付けと同様に比較的手間のかからない
プロセスで導電性ペーストによる接合を行うことがで
き、かつはんだ付けと同様に十分な接合強度を得ること
のできる電子部品の実装方法を提供することを目的とす
るものである。The present invention solves the above-mentioned problems of the prior art. As in the conventional soldering, the conductive paste can be joined in a relatively labor-free process, and it is sufficient as in the soldering. It is an object of the present invention to provide a mounting method of an electronic component capable of obtaining a bonding strength.
【０００６】また、環境に対して有害となるおそれのあ
る鉛を使用せずに電子回路基板を製造することのできる
電子部品を提供することを目的とするものである。Another object of the present invention is to provide an electronic component capable of manufacturing an electronic circuit board without using lead which may be harmful to the environment.
【０００７】[0007]
【課題を解決するための手段】上記問題点を解決するた
めに、本発明の電子部品の実装方法は、導電性ペースト
を用いて電子部品のリードと基板を接合し、導電性ペー
ストを硬化させた後に、電子部品本体の上面部に設けた
封止用樹脂材料を軟化させてリードと基板の接合部分に
降下させることにより、前記封止用樹脂材料にてリード
と基板の接合部分を封止するものである。In order to solve the above-mentioned problems, a method of mounting an electronic component according to the present invention uses a conductive paste to bond a lead of an electronic component and a substrate and cure the conductive paste. After that, the sealing resin material provided on the upper surface of the electronic component body is softened and lowered to the joint portion between the lead and the substrate, so that the joint portion between the lead and the substrate is sealed with the sealing resin material. To do.
【０００８】この場合に、例えば、導電性ペーストの硬
化をリフロー炉のプレヒートゾーンで行い、封止用樹脂
材料の硬化をリフロー炉のリフローゾーンで行う。そし
て、この実装方法に使用する電子部品としては、電子部
品本体の上面部に、使用温度より高い温度で軟化し、使
用温度で硬化する封止用樹脂材料のブロックを設けた電
子部品が適している。In this case, for example, the conductive paste is cured in the preheat zone of the reflow furnace, and the sealing resin material is cured in the reflow zone of the reflow furnace. As the electronic component used in this mounting method, an electronic component having a block of a sealing resin material that is softened at a temperature higher than the operating temperature and hardened at the operating temperature on the upper surface of the electronic component body is suitable. There is.
【０００９】上記方法によれば、電子部品のリードと基
板とが導電性ペーストにて接合された状態で、封止用樹
脂材料にてリードと基板の接合部分が封止されるため、
手間をあまりかけることなく十分な接合強度を得ること
ができ、高い接合信頼性を得ることができる。According to the above method, since the lead of the electronic component and the substrate are joined with the conductive paste, the joining portion of the lead and the substrate is sealed with the sealing resin material.
Sufficient joining strength can be obtained without much effort, and high joining reliability can be obtained.
【００１０】また、導電性ペーストの硬化をリフロー炉
のプレヒートゾーンで行い、封止用樹脂材料の硬化をリ
フロー炉のリフローゾーンで行うことにより、従来のは
んだ付け工法および設備にて実装することができ、工程
数が増加することはない。Further, the conductive paste is hardened in the preheat zone of the reflow furnace, and the sealing resin material is hardened in the reflow zone of the reflow furnace, so that the conventional soldering method and equipment can be used for mounting. However, the number of steps does not increase.
【００１１】また、上記電子部品を用いることにより、
鉛を使用せずに電子回路基板を製造することができ、環
境に害を及ぼさない。Further, by using the above electronic component,
The electronic circuit board can be manufactured without using lead, and it does not harm the environment.
【００１２】[0012]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。図１は本発明の実施の形態にかかる電子部品の実
装方法に使用する電子部品の斜視図である。１は電子部
品本体、２はリード、３は一般的な封止材料（熱硬化型
エポキシ樹脂）、１０は電子部品である。電子部品１０
における電子部品本体１の上面部には、電子部品１０を
使用する際の温度より高い温度で軟化し、常温、すなわ
ち使用温度で硬化する封止用樹脂材料のブロック４を設
けている。Embodiments of the present invention will be described below. FIG. 1 is a perspective view of an electronic component used in a method of mounting an electronic component according to an embodiment of the present invention. Reference numeral 1 is an electronic component body, 2 is a lead, 3 is a general sealing material (thermosetting epoxy resin), and 10 is an electronic component. Electronic component 10
A block 4 of a sealing resin material that is softened at a temperature higher than the temperature at which the electronic component 10 is used and hardens at room temperature, that is, a use temperature is provided on the upper surface of the electronic component body 1 in FIG.
【００１３】図２は同実装方法に使用する実装用の基板
の斜視図である。実装用の基板５には、印刷機あるいは
ディスペンサにより、電子部品１０のリード２に対応す
る位置に導電性ペースト６が形成されている。FIG. 2 is a perspective view of a mounting board used in the mounting method. A conductive paste 6 is formed on the mounting substrate 5 at a position corresponding to the leads 2 of the electronic component 10 by a printing machine or a dispenser.
【００１４】図３は同実装方法により電子部品を基板上
に実装した斜視図、図４は同実装方法により実装が完了
した基板を樹脂で封止した状態を示す斜視図である。図
４において、７は軟化して広がった封止用樹脂材料であ
る。FIG. 3 is a perspective view of an electronic component mounted on a substrate by the mounting method, and FIG. 4 is a perspective view showing a state in which the substrate completed by the mounting method is sealed with resin. In FIG. 4, reference numeral 7 denotes a softening and expanding sealing resin material.
【００１５】図５は通常のリフローはんだ付けにおいて
用いる温度プロファイルを示す図であり、ａはプリヒー
トゾーンの温度プロファイル、ｂはリフローゾーンの温
度プロファイル、ｃはリフロー時のピーク温度を示すラ
インである。FIG. 5 is a diagram showing a temperature profile used in normal reflow soldering, in which a is a temperature profile of the preheat zone, b is a temperature profile of the reflow zone, and c is a line showing a peak temperature during reflow.
【００１６】図１〜図５に基づいて説明を行う。まず、
図２に示すように、回路実装用の基板５のランド部（図
示せず）の上に印刷機あるいはディスペンサにより導電
性ペースト６を形成する。次に、図３に示すように、基
板５に形成された導電性ペースト６に対応する位置にリ
ード２を有する電子部品１０（ＳＯＰ）を実装する。こ
の電子部品１０の電子部品本体１の上面部には、図１に
示すように、電子部品１０を使用する際の温度より高い
温度で軟化する封止用樹脂材料のブロック４が形成され
ている。この電子部品１０を装着した基板５を、リフロ
ー炉に投入する。Description will be made with reference to FIGS. First,
As shown in FIG. 2, the conductive paste 6 is formed on the land portion (not shown) of the circuit mounting substrate 5 by a printing machine or a dispenser. Next, as shown in FIG. 3, the electronic component 10 (SOP) having the lead 2 is mounted at a position corresponding to the conductive paste 6 formed on the substrate 5. As shown in FIG. 1, a block 4 of a sealing resin material that softens at a temperature higher than the temperature when the electronic component 10 is used is formed on the upper surface of the electronic component body 1 of the electronic component 10. . The board 5 on which the electronic component 10 is mounted is put into a reflow furnace.
【００１７】電子部品１０を装着した基板５をリフロー
炉に投入すると、図５に示すリフロープロファイルから
も分かるようにプリヒートゾーンで１５０℃前後の温度
に加熱されることにより、導電性ペースト６が硬化、接
合される。このときに使用する導電ペースト６のバイン
ダーは、１５０℃、２〜３分で８０％以上の硬化率を有
するエポキシ樹脂を使用している。次にリフローゾーン
に進むと２３０℃前後の温度に加熱されることにより、
封止用樹脂材料のブロック４が軟化して、リード２と基
板５の接合部分の上に降下し、リード２と基板５の接合
部分全体が、軟化して広がった封止用樹脂材料７によっ
て封止される。When the substrate 5 on which the electronic component 10 is mounted is placed in a reflow furnace, the conductive paste 6 is cured by being heated to a temperature of about 150 ° C. in the preheat zone, as can be seen from the reflow profile shown in FIG. , Joined. The binder of the conductive paste 6 used at this time is an epoxy resin having a curing rate of 80% or more at 150 ° C. for 2 to 3 minutes. Next, when it goes to the reflow zone, it is heated to a temperature around 230 ° C,
The block 4 of the encapsulating resin material is softened and drops onto the joint portion between the lead 2 and the substrate 5, and the entire joint portion between the lead 2 and the substrate 5 is softened and expanded by the encapsulating resin material 7. It is sealed.
【００１８】これにより、電子部品１０のリード２と基
板５とが導電性ペースト６にて接合された状態で、封止
用樹脂材料７にてリード２と基板５の接合部分が封止さ
れるため、手間をあまりかけることなく十分な接合強度
を得ることができ、接合性能に対して高い信頼性を得る
ことができる。また、導電性ペースト６の硬化をリフロ
ー炉のプレヒートゾーンで行い、封止用樹脂材料７の硬
化をリフロー炉のリフローゾーンで行うことにより、従
来のはんだ付け工法および設備により実装を行うことが
でき、工程数が増加することはない。また、このように
鉛を含まない電子部品１０を用いることにより、鉛を使
用せずに電子回路基板を製造することができ、環境に害
を及ぼすことを防止できる。As a result, in a state where the leads 2 of the electronic component 10 and the substrate 5 are joined by the conductive paste 6, the joining portion of the leads 2 and the substrate 5 is sealed by the sealing resin material 7. Therefore, sufficient joining strength can be obtained without much effort, and high reliability of joining performance can be obtained. Further, the conductive paste 6 is cured in the preheat zone of the reflow furnace, and the encapsulating resin material 7 is cured in the reflow zone of the reflow furnace, so that mounting can be performed by the conventional soldering method and equipment. The number of steps does not increase. In addition, by using the electronic component 10 that does not contain lead in this way, it is possible to manufacture an electronic circuit board without using lead, and it is possible to prevent environmental damage.
【００１９】[0019]
【発明の効果】以上述べたように、本発明の電子部品を
実装に使用すると鉛がない状態で回路基板を製造するこ
とができて、環境に害を及ぼすことを防止できる。ま
た、封止樹脂材料からなるブロックを設けることによ
り、はんだ付けと同様に十分な接合強度を得ることがで
きて、接合性能に対して高い信頼性を得ることができ
る。As described above, when the electronic component of the present invention is used for mounting, it is possible to manufacture a circuit board in a lead-free state and prevent environmental damage. Further, by providing the block made of the sealing resin material, sufficient bonding strength can be obtained as in the case of soldering, and high reliability of the bonding performance can be obtained.
【００２０】また、従来のはんだ付け装置を使用するこ
とが可能であるため、新規の投資を行う必要もなく、低
コストで実装を行うことができ、かつ工程数が増加する
こともない。Further, since the conventional soldering apparatus can be used, it is not necessary to make new investment, mounting can be performed at low cost, and the number of steps is not increased.
【図１】本発明の実施の形態にかかる電子部品の実装方
法に使用する電子部品の斜視図FIG. 1 is a perspective view of an electronic component used in an electronic component mounting method according to an embodiment of the present invention.
【図２】同実装方法に使用する実装用の基板の斜視図FIG. 2 is a perspective view of a mounting board used in the mounting method.
【図３】同実装方法により電子部品を基板上に実装した
斜視図FIG. 3 is a perspective view of an electronic component mounted on a board by the mounting method.
【図４】同実装方法により実装が完了した基板を樹脂で
封止した状態を示す斜視図FIG. 4 is a perspective view showing a state in which a board, which has been mounted by the mounting method, is sealed with resin.
【図５】通常のリフローはんだ付けにおいて用いる温度
プロファイルを示す図FIG. 5 is a diagram showing a temperature profile used in normal reflow soldering.
１ 電子部品本体 ２ リード ３ 封止材料 ４ ブロック ５ 基板 ６ 導電性ペースト ７ 封止用樹脂材料 １０ 電子部品 1 Electronic Component Main Body 2 Lead 3 Sealing Material 4 Block 5 Substrate 6 Conductive Paste 7 Sealing Resin Material 10 Electronic Component
Claims (3)
ドと基板を接合し、導電性ペーストを硬化させた後に、
電子部品本体の上面部に設けた封止用樹脂材料を軟化さ
せてリードと基板の接合部分に降下させることにより、
前記封止用樹脂材料にてリードと基板の接合部分を封止
する電子部品の実装方法。1. A lead of an electronic component and a substrate are joined using a conductive paste, and after hardening the conductive paste,
By softening the encapsulating resin material provided on the upper surface of the electronic component body and lowering it to the joint between the lead and the substrate,
A method for mounting an electronic component, wherein a bonding portion between a lead and a substrate is sealed with the sealing resin material.
レヒートゾーンで行い、封止用樹脂材料の硬化をリフロ
ー炉のリフローゾーンで行う請求項１記載の電子部品の
実装方法。2. The method of mounting an electronic component according to claim 1, wherein the conductive paste is cured in a preheat zone of a reflow furnace and the sealing resin material is cured in a reflow zone of the reflow furnace.
品であって、電子部品本体の上面部に、使用温度より高
い温度で軟化し、使用温度で硬化する封止用樹脂材料の
ブロックを設けた電子部品。3. An electronic component having leads and joined to a substrate, wherein a block of a sealing resin material, which is softened at a temperature higher than a use temperature and hardened at a use temperature, is provided on an upper surface of an electronic component body. Electronic components with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20012395A JP3690843B2 (en) | 1995-08-07 | 1995-08-07 | Electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20012395A JP3690843B2 (en) | 1995-08-07 | 1995-08-07 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0951157A true JPH0951157A (en) | 1997-02-18 |
| JP3690843B2 JP3690843B2 (en) | 2005-08-31 |
Family
ID=16419212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20012395A Expired - Lifetime JP3690843B2 (en) | 1995-08-07 | 1995-08-07 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3690843B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9657292B2 (en) | 2010-11-24 | 2017-05-23 | The United States Of America, As Represented By The Secretary, Department Of Health & Human Services | Compositions and methods for treating or preventing lupus |
-
1995
- 1995-08-07 JP JP20012395A patent/JP3690843B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9657292B2 (en) | 2010-11-24 | 2017-05-23 | The United States Of America, As Represented By The Secretary, Department Of Health & Human Services | Compositions and methods for treating or preventing lupus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3690843B2 (en) | 2005-08-31 |
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